公开(公告)号：US09050755B2

公开(公告)日：2015-06-09

申请号：US13657454

申请日：2012-10-22

申请人： Essilor International (Compagnie Generale D'Optique)

发明人： Timothy E. Herod ,  Margie Hendrickson ,  Robert J. Rist

IPC分类号： C09J5/02 ,  B29C65/48 ,  B29C65/00 ,  B29D11/00 ,  B29L11/00

CPC分类号： B29C65/48 ,  B29C65/4825 ,  B29C65/483 ,  B29C66/0242 ,  B29C66/1122 ,  B29C66/343 ,  B29C66/452 ,  B29C66/532 ,  B29C66/5326 ,  B29C66/71 ,  B29C66/723 ,  B29C66/73117 ,  B29D11/00644 ,  B29D11/0073 ,  B29L2011/0016 ,  B29K2077/00 ,  B29K2069/00 ,  B29K2029/04 ,  B29K2001/12 ,  B29K2067/003 ,  B29K2067/00 ,  B29K2001/00

摘要： A process for producing a curved substrate (20) covered with a film (10) comprises a heat treatment of the film performed between a step of preforming said film and a step of assembling the film with the substrate. A maximum temperature of the pre-assembling heat treatment is higher than another maximum temperature of a post-assembling heat treatment (F) which is performed after the assembling step. Then the assembly of the substrate (20) with the film (10) is not altered during said post-assembling heat treatment. In particular, no defect and no delamination appear, and no change in the curved shape of the substrate is caused by the post-assembling heat treatment, even if the substrate (20) has a low glass transition temperature.

摘要翻译： 用于制造被膜（10）覆盖的弯曲基板（20）的方法包括在预成型所述膜的步骤和将膜与基板组装的步骤之间进行的膜的热处理。 预组装热处理的最高温度高于在组装步骤之后执行的组装后热处理（F）的另一最高温度。 然后，在所述组装后热处理期间，基板（20）与薄膜（10）的组装不会改变。 特别地，即使基板（20）具有低的玻璃化转变温度，也不会出现缺陷，没有脱层，并且由于后组装热处理也不会引起基板的弯曲形状的变化。

公开(公告)号：US20130105080A1

公开(公告)日：2013-05-02

申请号：US13657454

申请日：2012-10-22

申请人： Essilor International (Compagnie Generale D'Optique)

发明人： Timothy E. Herod ,  Margie Hendrickson ,  Robert J. Rist

IPC分类号： B29C65/48

CPC分类号： B29C65/48 ,  B29C65/4825 ,  B29C65/483 ,  B29C66/0242 ,  B29C66/1122 ,  B29C66/343 ,  B29C66/452 ,  B29C66/532 ,  B29C66/5326 ,  B29C66/71 ,  B29C66/723 ,  B29C66/73117 ,  B29D11/00644 ,  B29D11/0073 ,  B29L2011/0016 ,  B29K2077/00 ,  B29K2069/00 ,  B29K2029/04 ,  B29K2001/12 ,  B29K2067/003 ,  B29K2067/00 ,  B29K2001/00

摘要： A process for producing a curved substrate (20) covered with a film (10) comprises a heat treatment of the film performed between a step of preforming said film and a step of assembling the film with the substrate. A maximum temperature of the pre-assembling heat treatment is higher than another maximum temperature of a post-assembling heat treatment (F) which is performed after the assembling step. Then the assembly of the substrate (20) with the film (10) is not altered during said post-assembling heat treatment. In particular, no defect and no delamination appear, and no change in the curved shape of the substrate is caused by the post-assembling heat treatment, even if the substrate (20) has a low glass transition temperature.

摘要翻译： 用于制造被膜（10）覆盖的弯曲基板（20）的方法包括在预成型所述膜的步骤和将膜与基板组装的步骤之间进行的膜的热处理。 预组装热处理的最高温度高于在组装步骤之后执行的组装后热处理（F）的另一最高温度。 然后，在所述组装后热处理期间，基板（20）与薄膜（10）的组装不会改变。 特别地，即使基板（20）具有低的玻璃化转变温度，也不会出现缺陷，没有脱层，并且由于后组装热处理也不会引起基板的弯曲形状的变化。