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    Sub-Millinewton Capacitive Mems Force Sensor for Mechanical Testing on a Microscope
    2.
    发明申请
    Sub-Millinewton Capacitive Mems Force Sensor for Mechanical Testing on a Microscope 有权
    用于显微镜机械测试的次Millinewton电容式存储器力传感器

    公开(公告)号：US20140230576A1

    公开(公告)日：2014-08-21

    申请号：US14347421

    申请日：2012-09-20

    Applicant: Femtotools AG

    Inventor： Felix Beyeler ,  Simon Muntwyler ,  Wolfgang Dietze

    IPC: G01L1/14

    CPC classification number: G01L1/148 ,  G01L5/0057 ,  G01L5/165

    Abstract: Most mechanical tests (compression testing, tensile testing, flexure testing, shear testing) of samples in the sub-mm size scale are performed under the observation with an optical microscope or a scanning electron microscope. However, the following problems exist with prior art force sensors as e.g they cannot be used for in-plane mechanical testing (a- and b-direction) of a sample; they cannot be used for vertical testing (c-direction) of a sample. In order to overcome the before mentioned drawbacks the invention comprises the following basic working principle: A force is applied to the probe (2) at the probe tip (1) of the sensor. The force is transmitted by the sensor probe (2) to the movable body (3) of the sensor. The movable body is elastically suspended by four folded flexures (4), which transduce the force into a deflection dx. This deflection is measured by an array of capacitor electrodes, called capacitive comb drive (6).

    Abstract translation: 在使用光学显微镜或扫描电子显微镜的观察下进行大小尺寸刻度的样品的大多数机械试验（压缩试验，拉伸试验，挠曲试验，剪切试验）。 然而，现有技术的力传感器存在以下问题，例如它们不能用于样品的面内机械测试（a-和b-方向）; 它们不能用于样品的垂直测试（c方向）。 为了克服上述缺点，本发明包括以下基本工作原理：在传感器的探针尖端（1）处向探针（2）施加力。 传感器探针（2）将力传递到传感器的可移动体（3）。 可移动体通过四个折叠的挠曲件（4）弹性地悬挂，其将力转换成偏转dx。 该偏转通过称为电容梳驱动器（6）的电容器电极阵列来测量。

    Sub-millinewton capacitive MEMS force sensor for mechanical testing on a microscope
    3.
    发明授权
    Sub-millinewton capacitive MEMS force sensor for mechanical testing on a microscope 有权
    亚微米电容式MEMS力传感器用于在显微镜上进行机械测试

    公开(公告)号：US08984966B2

    公开(公告)日：2015-03-24

    申请号：US14347421

    申请日：2012-09-20

    Applicant: Femtotools AG

    Inventor： Felix Beyeler ,  Simon Muntwyler ,  Wolfgang Dietze

    IPC: G01L1/14 ,  G01L5/00 ,  G01L5/16

    CPC classification number: G01L1/148 ,  G01L5/0057 ,  G01L5/165

    Abstract: Most mechanical tests (compression testing, tensile testing, flexure testing, shear testing) of samples in the sub-mm size scale are performed under the observation with an optical microscope or a scanning electron microscope. However, the following problems exist with prior art force sensors as e.g they cannot be used for in-plane mechanical testing (a- and b-direction) of a sample; they cannot be used for vertical testing (c-direction) of a sample. In order to overcome the before mentioned drawbacks the invention comprises the following basic working principle: A force is applied to the probe (2) at the probe tip (1) of the sensor. The force is transmitted by the sensor probe (2) to the movable body (3) of the sensor. The movable body is elastically suspended by four folded flexures (4), which transduce the force into a deflection dx. This deflection is measured by an array of capacitor electrodes, called capacitive comb drive (6).

    Abstract translation: 在使用光学显微镜或扫描电子显微镜的观察下进行大小尺寸刻度的样品的大多数机械试验（压缩试验，拉伸试验，挠曲试验，剪切试验）。 然而，现有技术的力传感器存在以下问题，例如它们不能用于样品的面内机械测试（a-和b-方向）; 它们不能用于样品的垂直测试（c方向）。 为了克服上述缺点，本发明包括以下基本工作原理：在传感器的探针尖端（1）处向探针（2）施加力。 传感器探针（2）将力传递到传感器的可移动体（3）。 可移动体通过四个折叠的挠曲件（4）弹性地悬挂，其将力转换成偏转dx。 该偏转通过称为电容梳驱动器（6）的电容器电极阵列来测量。

    MEMS nanoindenter chip with indenter probe and reference probe
    4.
    发明授权
    MEMS nanoindenter chip with indenter probe and reference probe 有权

    公开(公告)号：US11307125B2

    公开(公告)日：2022-04-19

    申请号：US16196145

    申请日：2018-11-20

    Applicant: FEMTOTOOLS AG

    Inventor： David Beyeler ,  Simon Muntwyler ,  Felix Beyeler

    IPC: G01N3/42 ,  G01Q60/36

    Abstract: A MEMS-nanoindenter chip performs nanoindentation on a specimen. The MEMS-nanoindenter chip has an intender probe joined with an indenter tip. The indenter tip indents into the specimen. A reference probe is joined with a reference tip, the reference tip touches the specimen. Sensing capabilities are provided to measure the position of the indenter probe relative to the reference probe. The MEMS-nanoindenter chip enables highly accurate measurements since the frame stiffness is not part of the measurement chain any more. Furthermore, thermal drift during the nanoindentation is considerably reduced.

    System for the combined, probe-based mechanical and electrical testing of MEMS
    5.
    发明授权
    System for the combined, probe-based mechanical and electrical testing of MEMS 有权
    用于MEMS组合的基于探针的机电测试系统

    公开(公告)号：US09575093B2

    公开(公告)日：2017-02-21

    申请号：US14516793

    申请日：2014-10-17

    Applicant: FEMTOTOOLS AG

    Inventor： Felix Beyeler ,  Christoph Bolliger ,  Daniel Frost ,  David Beyeler ,  Simon Muntwyler

    IPC: G01R31/20 ,  G01R1/04 ,  B81C99/00 ,  G01D5/12 ,  G01L1/18 ,  G01L3/02 ,  G01R1/44 ,  G01R31/00

    CPC classification number: G01R1/0408 ,  B81C99/005 ,  G01D5/12 ,  G01L1/18 ,  G01L3/02 ,  G01R1/44 ,  G01R31/00

    Abstract: A system for testing MEMS-structures includes a microforce sensor, two or more multi-axis micropositioning units, at least one electrical probe and a sample holder on which a MEMS-structure is mounted. At least one of the multi-axis micropositioning units is motorized and at least one additional micropositioning unit is equipped with at least one electrical probe to apply electrical signals or to measure electrical signals at one or multiple locations on the MEMS structure. The system with the aforementioned components allows a combined electrical and probe-based mechanical testing of MEMS-structures.

    Abstract translation: 用于测试MEMS结构的系统包括微力传感器，两个或多个多轴微定位单元，至少一个电探针和其上安装有MEMS结构的样品架。 多轴微定位单元中的至少一个被电动化，并且至少一个附加的微定位单元配备有至少一个电探针以施加电信号或在MEMS结构上的一个或多个位置处测量电信号。 具有上述组件的系统允许对MEMS结构进行组合电和基于探针的机械测试。

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