公开(公告)号：US20240204147A1

公开(公告)日：2024-06-20

申请号：US18437863

申请日：2024-02-09

Applicant: FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD.

Inventor： Libing PAN ,  Jiapeng ZHANG ,  Zhiguo XIE ,  Man ZHAO ,  Fuhai LI ,  Tao CHEN

IPC: H01L33/48 ,  H01L25/075 ,  H01L33/62

CPC classification number: H01L33/483 ,  H01L25/0753 ,  H01L33/62

Abstract: A lamp bead holder includes a lead framework and a bowl-shaped cup. The bowl-shaped cup includes a cup bottom and a cup body. The lead framework is embedded within the cup bottom. The cup body is disposed on the lead framework. The bowl-shaped cup further includes a cross-shaped baffle. The cross-shaped baffle is disposed within the bowl-shaped cup to divide the inner cavity of the bowl-shaped cup into four cavities arranged in a 2×2 array.

公开(公告)号：US20240144864A1

公开(公告)日：2024-05-02

申请号：US18457755

申请日：2023-08-29

Applicant: FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD.

Inventor： Libing PAN ,  Zhiguo XIE ,  Penghui DONG ,  Xiaoji ZHANG ,  Danlei GONG ,  Man ZHAO ,  Zihao CHEN

IPC: G09G3/32 ,  F21K9/235 ,  F21K9/237 ,  F21K9/238

CPC classification number: G09G3/32 ,  F21K9/235 ,  F21K9/237 ,  F21K9/238 ,  F21W2131/30 ,  G09G2320/02

Abstract: Provided are a beveled light-emitting lamp bead, a beveled light-emitting lamp bead holder, a manufacturing method therefor, and a display device. The beveled light-emitting lamp bead holder includes a holder body and a metal holder embedded in the holder body, where the holder body is divided by the metal holder into a cup shield located on a top side and a support structure located on a bottom side, a cup bottom in the cup shield is provided with a chip mounting surface parallel to a cup rim top surface, a bottom portion of the support structure is provided with a soldering plane, the soldering plane is electrically connected to the chip mounting surface through the metal holder, and an inclination angle is formed between the chip mounting surface and the soldering plane.

公开(公告)号：US20230216011A1

公开(公告)日：2023-07-06

申请号：US18090665

申请日：2022-12-29

Applicant: FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD.

Inventor： Libing PAN ,  Zhiguo XIE ,  Man ZHAO ,  Jiapeng ZHANG ,  Danwei LI ,  Pingxia LIANG ,  Fuhai LI

IPC: H01L33/62

CPC classification number: H01L33/62 ,  H01L33/60

Abstract: Provided are a bracket and a LED device. The bracket includes a lead frame and a molded structure connected to the lead frame. The lead frame includes a first lead portion, a second lead portion, and a barrier structure. The first lead portion includes a first base. The second lead portion includes a second base spaced from the first base. A gap between the first base and the second base forms a channel. The barrier structure is disposed on a side of at least one of the first base or the second base facing the channel. The barrier structure is disposed between two opposite ends of the first base and/or the second base and protrudes from the first base and/or the second base, and a length between two opposite ends of the channel is greater than a length of a middle part so that a “wide-narrow-wide” pattern is formed.

公开(公告)号：US20230215999A1

公开(公告)日：2023-07-06

申请号：US18090127

申请日：2022-12-28

Applicant: FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD.

Inventor： Libing PAN ,  Zhiguo XIE ,  Jiapeng ZHANG ,  Man ZHAO ,  Yinling ZHENG ,  Pingxia LIANG ,  Fuhai LI

IPC: H01L33/60 ,  H01L33/62

CPC classification number: H01L33/60 ,  H01L33/62

Abstract: Provided is an LED device. The LED device includes a bracket and a chip. The bracket includes a lead frame and a molded structure connected to the lead frame. The molded structure includes a chip placement body and a reflective structure. The chip placement body defines an avoidance groove. The reflective structure is a cylindrical structure with an inner through hole. The inner through hole communicates with the avoidance groove. The cylindrical structure is disposed around the periphery of the chip placement body. A first end of the cylindrical structure is formed with an opening communicating with the inner through hole. A second end of the cylindrical structure is connected to the chip placement body in the entire circumferential direction. A circumferential sidewall of the inner through hole forms a reflective surface used for reflecting light.