公开(公告)号：US20160130492A1

公开(公告)日：2016-05-12

申请号：US14898701

申请日：2014-10-20

申请人： FUJI POLYMER INDUSTRIES CO., LTD. ,  RIKEN

发明人： Tomoki MATSUMURA ,  Masakazu HATTORI ,  Seiji NIITAKA ,  Kimitoshi KONO

IPC分类号： C09K5/06

CPC分类号： C09K5/063 ,  C08K3/00 ,  C08K3/01 ,  C08K3/18 ,  C08K3/22 ,  C08K3/28 ,  C08K9/06 ,  C08K2003/222 ,  C08K2003/2227 ,  C08K2003/2296 ,  C08K2201/001 ,  C08K2201/005 ,  C08L101/00 ,  C09K5/00 ,  H01L23/3737 ,  H01L23/427 ,  H01L23/4275 ,  C08L83/04 ,  C08K3/0008

摘要： A heat storage composition (20) of the present invention includes a matrix resin (21) and heat storage inorganic particles (22). The heat storage inorganic particles (22) are composed of a material that undergoes an electronic phase transition and has a latent heat of 1 J/cc or more for the electronic phase transition. The amount of the heat storage inorganic particles is 10 to 2000 parts by weight with respect to 100 parts by weight of the matrix resin. The heat conductivity of the heat storage composition is 0.3 W/m·K or more. The heat storage composition may further include heat conductive particles (23, 24). The heat storage inorganic particles are preferably metal oxide particles containing vanadium as the main metal component. The heat storage composition has high heat storage properties and high heat conduction properties, and is used as a heat storage silicone material provided between a heat generating component and a case. Since heat from the heat generating component is temporarily stored in the heat storage composition so that the heat conduction is delayed, the heat is diffused during the delay to eliminate partial heating, thereby resulting in uniform heat dissipation.

摘要翻译： 本发明的蓄热组合物（20）包括基质树脂（21）和储热无机颗粒（22）。 蓄热无机粒子（22）由电子相变的材料构成，电子相变的潜热为1J / cc以上。 相对于100重量份的基体树脂，蓄热无机粒子的量为10〜2000重量份。 储热组合物的导热率为0.3W / m·K以上。 蓄热组合物还可以包括导热颗粒（23,24）。 储热无机粒子优选为含有钒作为主要金属成分的金属氧化物粒子。 蓄热组合物具有高蓄热性和高导热性，并且用作设置在发热部件和壳体之间的储热硅酮材料。 由于来自发热部件的热量暂时存储在蓄热组合物中，导致热传导延迟，所以在延迟期间散热以消除部分加热，从而导致均匀的散热。

公开(公告)号：US20240002619A1

公开(公告)日：2024-01-04

申请号：US18254077

申请日：2022-01-13

申请人： Fuji Polymer Industries Co., Ltd.

发明人： Tomoki MATSUMURA ,  Keisuke KAWAHAMA ,  Makoto IWAI

IPC分类号： C08J7/044

CPC分类号： C08J7/044 ,  C08J2383/04

摘要： Provided is a silicone rubber molded body (1) including a conductive ink coating layer (3) that is disposed on a portion of the surface of the silicone rubber molded body (1). The conductive ink coating layer (3) contains a hydrolyzable organosilicon compound. Using the silicone rubber molded body with a saturated water absorption of 0.10 to 1.50% by mass and/or using a conductive ink containing water improves the affinity between the surface of the silicone rubber molded body (1) and the conductive ink coating layer (3). A residual ink area is an average of 20% or more and 100% or less after the conductive ink coating layer (3) is subjected to an abrasion test. With this configuration, the silicone rubber molded body has a high affinity between the silicone rubber and the conductive ink, good durability under continuous stress, and stability in long-term use. Further provided is a method for producing the silicone rubber molded body.

公开(公告)号：US20210189188A1

公开(公告)日：2021-06-24

申请号：US17116733

申请日：2020-12-09

申请人： Fuji Polymer Industries Co., Ltd. ,  TOYOTA JIDOSHA KABUSHIKI KAISHA

发明人： Yuki KAMIYA ,  Masakazu HATTORI ,  Tomoki MATSUMURA ,  Katsuyuki SUZUMURA ,  Koji NAKANISHI ,  Ayako YAMAGUCHI

IPC分类号： C09J7/35 ,  C09K5/14 ,  C09J11/04 ,  C09J7/10 ,  H05K7/20

摘要： A thermally conductive composition 26 contains a base polymer, an adhesive polymer, and thermally conductive particles. A thermal conductivity of the thermally conductive composition 26 is 0.3 W/mK or more. The base polymer is a silicone polymer. The adhesive polymer contains a methyl hydrogen polysiloxane, an epoxy group-containing alkyltrialkoxysilane, and a cyclic polysiloxane oligomer. The amount of the adhesive polymer is 5 to 35 parts by weight with respect to 100 parts by weight of the base polymer. A thermally conductive sheet of the present invention includes the thermally conductive composition in the form of a sheet. Thus, the present invention provides a thermally conductive composition that has high thermal conductive properties and excellent resilience and that can prevent interfacial peeling due to stress, a thermally conductive sheet including the thermally conductive composition, and a method for producing the thermally conductive sheet.