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公开(公告)号:US20230307894A1
公开(公告)日:2023-09-28
申请号:US18326981
申请日:2023-05-31
Applicant: FUJIFILM Business Innovation Corp.
Inventor: Kazuhiro SAKAI , Daisuke IGUCHI , Takeshi MINAMIRU , Yoshinori SHIRAKAWA , Tomoaki SAKITA , Tsutomu OTSUKA
IPC: H01S5/068 , H01S5/0687 , H01S5/02255 , H01S5/02325 , G06V20/64 , G02B27/42 , G06V40/16 , H01S5/42 , G02B5/02 , G06V10/145
CPC classification number: H01S5/423 , G02B5/0278 , G02B27/4205 , G06V10/145 , G06V20/64 , G06V40/166 , H01S5/02255 , H01S5/02325 , H01S5/06804 , H01S5/0687 , H01S5/04254
Abstract: A light emitting device includes a wiring substrate, a light emitting element array that includes a first side surface and a second side surface facing each other, and a third side surface and a fourth side surface connecting the first side surface and the second side surface to each other and facing each other, the light emitting element array being provided on the wiring substrate, a driving element that is provided on the wiring substrate on the first side surface side and drives the light emitting element array, a first circuit element and a second circuit element that are provided on the wiring substrate on the second side surface side to be arranged in a direction along the second side surface, and a wiring member that is provided on the third side surface side and the fourth side surface side and extends from a top electrode of the light emitting element array toward an outside of the light emitting element array.
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公开(公告)号:US20220077659A1
公开(公告)日:2022-03-10
申请号:US17528177
申请日:2021-11-16
Applicant: FUJIFILM Business Innovation Corp.
Inventor: Kazuhiro SAKAI , Daisuke IGUCHI , Takeshi MINAMIRU , Yoshinori SHIRAKAWA , Tomoaki SAKITA , Tsutomu OTSUKA
IPC: H01S5/42 , H01S5/068 , H01S5/0687 , G02B27/42 , G02B5/02 , G06K9/00 , G06K9/20 , H01S5/02255 , H01S5/02325
Abstract: A light emitting device includes a wiring substrate, a light emitting element array that includes a first side surface and a second side surface facing each other, and a third side surface and a fourth side surface connecting the first side surface and the second side surface to each other and facing each other, the light emitting element array being provided on the wiring substrate, a driving element that is provided on the wiring substrate on the first side surface side and drives the light emitting element array, a first circuit element and a second circuit element that are provided on the wiring substrate on the second side surface side to be arranged in a direction along the second side surface, and a wiring member that is provided on the third side surface side and the fourth side surface side and extends from a top electrode of the light emitting element array toward an outside of the light emitting element array.
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公开(公告)号:US20220357022A1
公开(公告)日:2022-11-10
申请号:US17874032
申请日:2022-07-26
Applicant: FUJIFILM Business Innovation Corp.
Inventor: Yosuke KASUYA , Tsutomu OTSUKA
Abstract: A light-emitting device includes a base that is composed of a metal block that extends in a first direction, multiple light-emitting portions unaligned in the first direction and facing a front surface of the base, the multiple light-emitting portions including multiple light sources that extend in the first direction and that are supported by a support that extends in the first direction, and a handle that is formed below the front surface of the base and that is to be held by an operator with the base placed on a flat surface.
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公开(公告)号:US20220006268A1
公开(公告)日:2022-01-06
申请号:US17478551
申请日:2021-09-17
Applicant: FUJIFILM Business Innovation Corp.
Inventor: Takashi KONDO , Kenichi ONO , Daisuke IGUCHI , Yoshinori SHIRAKAWA , Tomoaki SAKITA , Tsutomu OTSUKA
Abstract: A light-emitting device includes: a first light-emitting element array that includes plural first light-emitting elements arranged at a first interval; a second light-emitting element array that includes plural second light-emitting elements arranged at a second interval wider than the first interval, second light-emitting element array being configured to output a light output larger than a light output of the first light-emitting element array, and being configured to be driven independently from the first light-emitting element array; and a light diffusion member provided on an emission path of the second light-emitting element array.
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公开(公告)号:US20210325034A1
公开(公告)日:2021-10-21
申请号:US17358866
申请日:2021-06-25
Applicant: FUJIFILM BUSINESS INNOVATION CORP.
Inventor: Kazuhiro SAKAI , Daisuke IGUCHI , Takeshi MINAMIRU , Yoshinori SHIRAKAWA , Tomoaki SAKITA , Tsutomu OTSUKA
Abstract: A light-emitting device includes a wiring substrate, a base member provided on the wiring substrate, a light-emitting element array that has a first side surface and a second side surface facing each other, that has a third side surface and a fourth side surface facing each other and connecting the first side surface and the second side surface, and that is provided on the base member, a drive unit that is provided on the wiring substrate at a side of the first side surface and drives the light-emitting element array, a first circuit element that is provided on the base member at the side of the first side surface, a second circuit element that is provided on the base member at a side of the second side surface and has a larger occupation area on the base member than the first circuit element, and wiring members that are provided at a side of the third side surface and at a side of the fourth side surface and extend from an upper surface electrode of the light-emitting element array toward an outer side of the light-emitting element array.
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公开(公告)号:US20210288193A1
公开(公告)日:2021-09-16
申请号:US17335201
申请日:2021-06-01
Applicant: FUJIFILM Business Innovation Corp.
Inventor: Satoshi INADA , Kenichi ONO , Takeshi MINAMIRU , Akemi MURAKAMI , Junichiro HAYAKAWA , Tsutomu OTSUKA
IPC: H01L31/0224 , H01S5/183 , H01S5/042 , H01L31/18 , H01S5/02
Abstract: An optical semiconductor element includes: a semiconductor substrate that is semi-insulating; a columnar body that is formed on a front surface-side of the semiconductor substrate and configured to emit or receive light from the front surface-side; a front surface-side electrode that is connected to the columnar body; a back surface-side electrode formed on a back surface-side of the semiconductor substrate; and an electrically conductive member that is formed to penetrate through the semiconductor substrate to connect the front surface-electrode and the back surface-side electrode, and has a protruding portion protruding on the front surface-side of the semiconductor substrate.
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