公开(公告)号：US20240365469A1

公开(公告)日：2024-10-31

申请号：US18566430

申请日：2022-04-22

申请人： FUJIKURA PRINTED CIRCUITS LTD.

发明人： Daisuke Arai ,  Toshiya Iwamura

IPC分类号： H05K1/11 ,  G03F1/50 ,  G03F7/00 ,  G03F7/20 ,  H05K1/02 ,  H05K3/00 ,  H05K3/06

CPC分类号： H05K1/118 ,  G03F1/50 ,  G03F7/2016 ,  G03F7/70475 ,  H05K1/0281 ,  H05K3/0082 ,  H05K3/064

摘要： A method for producing a flexible printed wiring board using a photoresist includes placing the photoresist, including a first region and a second region, on a substrate, placing a first photomask including a first light-transmitting portion such that the first light-transmitting portion faces the first region to expose the photoresist through the first light-transmitting portion, and placing a second photomask including a second light-transmitting portion such that the second light-transmitting portion faces the second region to expose the photoresist through the second light-transmitting portion. The first region is adjacent to the second region such that an edge portion of the first region overlaps an edge portion of the second region. The first light-transmitting portion has a linear shape including a first tip having a tapered shape.

公开(公告)号：US20240040708A1

公开(公告)日：2024-02-01

申请号：US18257579

申请日：2022-01-19

申请人： FUJIKURA PRINTED CIRCUITS LTD.

发明人： Daisuke Arai ,  Shigeki Otsuka

IPC分类号： H05K3/28 ,  H05K3/30 ,  H05K3/46

CPC分类号： H05K3/288 ,  H05K3/305 ,  H05K3/4632 ,  H05K2203/0228

摘要： A method of manufacturing a wiring board includes covering a part of a wiring disposed on a base material for the wiring board by disposing a separation layer on the base material; covering the wiring and the separation layer by disposing a cover lay including a removal portion on the base material; and removing the removal portion of the cover lay laminated on the separation layer and exposing a part of the wiring from the cover lay by peeling the separation layer from the base material.