OPTICAL APPARATUS
    1.
    发明公开
    OPTICAL APPARATUS 审中-公开

    公开(公告)号:US20230319993A1

    公开(公告)日:2023-10-05

    申请号:US18332078

    申请日:2023-06-09

    CPC classification number: H05K1/118 H01R12/57 H05K2201/10121

    Abstract: An optical apparatus includes: a housing; at least one component housed in the housing, the at least one component being configured to be energized and perform at least one of outputting light, receiving light, and changing a property of light; a plurality of external connection conductors configured to penetrate through the housing; and a flexible substrate housed in the housing, the flexible substrate including an insulation layer, a plurality of conductive wires each configured to perform at least one of conduction between the component and the external connection conductors, conduction between the external connection conductors, and conduction between a plurality of the components each serving as the at least one component, a base part in which the conductive wires are covered by the insulation layer, and a plurality of arm parts protruding and extending from the base part, each including one of the conductive wires.

    OPTICAL APPARATUS
    2.
    发明公开
    OPTICAL APPARATUS 审中-公开

    公开(公告)号:US20240255724A1

    公开(公告)日:2024-08-01

    申请号:US18631138

    申请日:2024-04-10

    CPC classification number: G02B7/025

    Abstract: An optical apparatus includes: a housing including a first member constituting at least a part of the housing; an optical component accommodated in the housing and configured to transmit or reflect light; and a second member fixed to the first member and including at least one opening configured to accommodate a part of the optical component, the second member being configured to support the optical component via an adhesive agent.

    OPTICAL MODULE
    3.
    发明公开
    OPTICAL MODULE 审中-公开

    公开(公告)号:US20230288737A1

    公开(公告)日:2023-09-14

    申请号:US18318894

    申请日:2023-05-17

    CPC classification number: G02F1/0136 G02F1/0115

    Abstract: An optical module includes: a polarization controller that includes a main body including a polarization multiplexer and demultiplexer portion that, upon input of two kinds of light that are in perpendicularly-polarized states, performs polarization multiplexing on the two kinds of light and output polarization-multiplexed light, and upon input of light, performs polarization demultiplexing on the light and outputs two kinds of light that are in perpendicularly-polarized states, a first polarizer, a first input portion, a second input portion, a third input portion, a first output portion, and a second output portion; and an optical device configured to receive input of light via the polarization controller and output light via the polarization controller.

    SUBSTRATE ASSEMBLY
    4.
    发明申请

    公开(公告)号:US20250012986A1

    公开(公告)日:2025-01-09

    申请号:US18891051

    申请日:2024-09-20

    Abstract: A substrate assembly includes: a substrate including a first surface facing a first direction, a second surface on a side opposite to the first surface, the second surface facing an opposite direction to the first direction, and an optical transceiver including a first electrical interface, and a heat dissipation portion, the optical transceiver being fixed to the substrate in a state where the first electrical interface and the heat dissipation portion face the opposite direction to the first direction and are aligned in a direction intersecting the first direction; and a first heat dissipation mechanism fixed to the substrate, the first heat dissipation mechanism including a first portion adjacent to the heat dissipation portion in the first direction and thermally connected with the heat dissipation portion in a state where the optical transceiver is fixed to the substrate.

    OPTICAL MODULE
    5.
    发明公开
    OPTICAL MODULE 审中-公开

    公开(公告)号:US20240340085A1

    公开(公告)日:2024-10-10

    申请号:US18744779

    申请日:2024-06-17

    CPC classification number: H04B10/40 G02B6/4246

    Abstract: An optical module includes: a modulator containing an InP-based semiconductor material, the modulator including a modulation signal providing unit configured to modulate input light; and an optical integrated circuit optically coupled to the modulator, the optical integrated circuit integrating a plurality of waveguides and a plurality of optical elements including a silicon-based semiconductor material. The optical integrated circuit is configured to output light passed through any one of the waveguides or any one of the optical elements to the modulator, receive modulation light generated by the modulator that modulates the light, and output the modulation light passed through any one of other waveguides or any one of other optical elements.

    OPTICAL MODULE
    6.
    发明申请

    公开(公告)号:US20220007496A1

    公开(公告)日:2022-01-06

    申请号:US17478030

    申请日:2021-09-17

    Abstract: An optical module includes a box-shaped housing with an optical element mounted therein. Further, a wiring substrate is bonded to a part of a surface of a housing part of the housing, and an electric wiring, which is formed in the wiring substrate or on a surface of the wiring substrate, and an electric wiring, which is introduced into the housing part or onto a surface of the housing part, are electrically connected to each other.

    OPTICAL DEVICE AND METHOD FOR MANUFACTURING OPTICAL DEVICE

    公开(公告)号:US20220317392A1

    公开(公告)日:2022-10-06

    申请号:US17808007

    申请日:2022-06-21

    Abstract: An optical device includes: a case; a sleeve attached to the case, the sleeve including a first through-hole penetrating between an inside and an outside of the case, and an inclined surface inclined with respect to a penetrating direction of the first through-hole, the inclined surface having an opening of the first through-hole; a first optical fiber including a core wire including a core and a clad, and a sheath configured to surround the core wire, wherein an exposed portion of the core wire not surrounded by the sheath passes through the first through-hole; and a first joining material interposed and sealed between an outer peripheral surface of the exposed portion and an inner peripheral surface of the first through-hole in the first through-hole.

    OPTICAL MODULE
    8.
    发明申请
    OPTICAL MODULE 有权
    光学模块

    公开(公告)号:US20160218810A1

    公开(公告)日:2016-07-28

    申请号:US14603567

    申请日:2015-01-23

    Abstract: The present invention provides an optical module capable of achieving downsizing and high densification, and reducing crosstalk as compared to a conventional optical module. An optical module includes: an optical device including multiple light receiving elements; a control device which transmits and receives signals to and from the optical device; and a substrate including multiple lines which allow passage of the signals. Anode terminals of the multiple light receiving elements are connected to different lines by first wires, respectively. Cathode terminals of the multiple light receiving elements are connected to different lines by second wires, respectively. Each first wire and the corresponding second wire cross each other and are disposed out of contact with each other. The wires connecting each light receiving element and the control device, namely, the wires of each channel cross each other.

    Abstract translation: 本发明提供一种能够实现小型化和高密度化,并且与常规光学模块相比减少串扰的光学模块。 光学模块包括:包括多个光接收元件的光学装置; 控制装置,用于向光学装置发送信号和从光学装置接收信号; 以及包括允许信号通过的多条线的基板。 多个光接收元件的阳极端子分别通过第一布线连接到不同的线。 多个光接收元件的阴极端子分别通过第二导线连接到不同的线。 每个第一线和相应的第二线彼此交叉并且彼此不接触地布置。 连接每个光接收元件和控制装置的导线,即每个通道的导线彼此交叉。

    OPTICAL MODULE
    10.
    发明公开
    OPTICAL MODULE 审中-公开

    公开(公告)号:US20230244047A1

    公开(公告)日:2023-08-03

    申请号:US18059054

    申请日:2022-11-28

    CPC classification number: G02B6/4271 G02B6/4244 G02B6/4269 G02B6/4257

    Abstract: An optical module includes: a casing in which light is propagated; a heating portion; a device arranged inside the casing and configured to change, when heated, characteristics of the light propagated inside the casing; and a first member thermally connected to the heating portion and the device, the first member including a hollow arranged in a heat transfer path from the heating portion to the device and configured to prevent convective heat transmission to an inside of the casing.

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