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公开(公告)号：US20230319993A1
公开(公告)日：2023-10-05
申请号：US18332078
申请日：2023-06-09
Applicant: FURUKAWA ELECTRIC CO., LTD.
Inventor： Atsushi IZAWA , Kazuya NAGASHIMA
CPC classification number: H05K1/118 , H01R12/57 , H05K2201/10121
Abstract: An optical apparatus includes: a housing; at least one component housed in the housing, the at least one component being configured to be energized and perform at least one of outputting light, receiving light, and changing a property of light; a plurality of external connection conductors configured to penetrate through the housing; and a flexible substrate housed in the housing, the flexible substrate including an insulation layer, a plurality of conductive wires each configured to perform at least one of conduction between the component and the external connection conductors, conduction between the external connection conductors, and conduction between a plurality of the components each serving as the at least one component, a base part in which the conductive wires are covered by the insulation layer, and a plurality of arm parts protruding and extending from the base part, each including one of the conductive wires.
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公开(公告)号：US20220317392A1
公开(公告)日：2022-10-06
申请号：US17808007
申请日：2022-06-21
Applicant: FURUKAWA ELECTRIC CO., LTD.
Inventor： Atsushi IZAWA , Jun MIYOKAWA , Maiko ARIGA , Kazuya NAGASHIMA , Yozo ISHIKAWA , Taketsugu SAWAMURA
Abstract: An optical device includes: a case; a sleeve attached to the case, the sleeve including a first through-hole penetrating between an inside and an outside of the case, and an inclined surface inclined with respect to a penetrating direction of the first through-hole, the inclined surface having an opening of the first through-hole; a first optical fiber including a core wire including a core and a clad, and a sheath configured to surround the core wire, wherein an exposed portion of the core wire not surrounded by the sheath passes through the first through-hole; and a first joining material interposed and sealed between an outer peripheral surface of the exposed portion and an inner peripheral surface of the first through-hole in the first through-hole.
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公开(公告)号：US20240255724A1
公开(公告)日：2024-08-01
申请号：US18631138
申请日：2024-04-10
Applicant: FURUKAWA ELECTRIC CO., LTD.
Inventor： Atsushi IZAWA , Kazuya NAGASHIMA , Atsushi KAJI , Yozo ISHIKAWA
IPC: G02B7/02
CPC classification number: G02B7/025
Abstract: An optical apparatus includes: a housing including a first member constituting at least a part of the housing; an optical component accommodated in the housing and configured to transmit or reflect light; and a second member fixed to the first member and including at least one opening configured to accommodate a part of the optical component, the second member being configured to support the optical component via an adhesive agent.
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公开(公告)号：US20240340085A1
公开(公告)日：2024-10-10
申请号：US18744779
申请日：2024-06-17
Applicant: FURUKAWA ELECTRIC CO., LTD.
Inventor： Kazuya NAGASHIMA , Masaki KOTOKU , Tatsuro KUROBE , Kazuaki KIYOTA , Maiko ARIGA , Atsushi IZAWA , Yozo ISHIKAWA
CPC classification number: H04B10/40 , G02B6/4246
Abstract: An optical module includes: a modulator containing an InP-based semiconductor material, the modulator including a modulation signal providing unit configured to modulate input light; and an optical integrated circuit optically coupled to the modulator, the optical integrated circuit integrating a plurality of waveguides and a plurality of optical elements including a silicon-based semiconductor material. The optical integrated circuit is configured to output light passed through any one of the waveguides or any one of the optical elements to the modulator, receive modulation light generated by the modulator that modulates the light, and output the modulation light passed through any one of other waveguides or any one of other optical elements.
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公开(公告)号：US20220007496A1
公开(公告)日：2022-01-06
申请号：US17478030
申请日：2021-09-17
Applicant: FURUKAWA ELECTRIC CO., LTD.
Inventor： Maiko ARIGA , Yusuke INABA , Kazuki YAMAOKA , Atsushi IZAWA , Kazuya NAGASHIMA
IPC: H05K1/02
Abstract: An optical module includes a box-shaped housing with an optical element mounted therein. Further, a wiring substrate is bonded to a part of a surface of a housing part of the housing, and an electric wiring, which is formed in the wiring substrate or on a surface of the wiring substrate, and an electric wiring, which is introduced into the housing part or onto a surface of the housing part, are electrically connected to each other.
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Patent Agency Ranking
公开(公告)号：US20170261701A1
公开(公告)日：2017-09-14
申请号：US15608454
申请日：2017-05-30
Applicant: FURUKAWA ELECTRIC CO., LTD.
Inventor： Atsushi IZAWA
CPC classification number: G02B6/42 , G02B6/26 , G02B6/262 , G02B6/423 , G02B6/4246 , G02B6/4249 , G02B6/428 , G02B6/4292
Abstract: An optical module includes a first module having a first end surface provided with a first guide hole and a second end surface opposite the first end surface, wherein the first module includes first optical fibers each provided penetrating the first module from the first end surface to the second end surface and having an axial center aligned based on a positional relationship to the first guide hole, and a first optical element having an axial center aligned based on a positional relationship to the first guide hole.
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7.发明公开公开(公告)号：US20230359024A1
公开(公告)日：2023-11-09
申请号：US18350936
申请日：2023-07-12
Applicant: FURUKAWA ELECTRIC CO., LTD.
Inventor： Atsushi IZAWA , Kazuya NAGASHIMA , Yozo ISHIKAWA , Yusuke INABA , Takuya KOKAWA
CPC classification number: G02B27/0012 , H05K5/0004 , H05K5/0209 , H05K5/0247 , H05K5/0217 , H05K5/069
Abstract: An optical device includes: a case; a wiring substrate that passes through the case and that includes an insulating member and a conductor; at least one of components including a first component configured to perform at least one of: outputting a light; receiving a light; and varying optical properties, and a second component configured to electrically control the first component, the at least one of components being housed in the case and flip-chip mounted on the wiring substrate.
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公开(公告)号：US20230244047A1
公开(公告)日：2023-08-03
申请号：US18059054
申请日：2022-11-28
Applicant: FURUKAWA ELECTRIC CO., LTD.
Inventor： Kazuya NAGASHIMA , Atsushi IZAWA , Atsushi KAJI , Go KOBAYASHI
IPC: G02B6/42
CPC classification number: G02B6/4271 , G02B6/4244 , G02B6/4269 , G02B6/4257
Abstract: An optical module includes: a casing in which light is propagated; a heating portion; a device arranged inside the casing and configured to change, when heated, characteristics of the light propagated inside the casing; and a first member thermally connected to the heating portion and the device, the first member including a hollow arranged in a heat transfer path from the heating portion to the device and configured to prevent convective heat transmission to an inside of the casing.
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公开(公告)号：US20220369524A1
公开(公告)日：2022-11-17
申请号：US17874439
申请日：2022-07-27
Applicant: FURUKAWA ELECTRIC CO., LTD.
Inventor： Kazuya NAGASHIMA , Maiko ARIGA , Atsushi IZAWA , Jun MIYOKAWA
IPC: H05K9/00 , H01S5/023 , H01S5/024 , H01S5/0683 , H01S5/02345 , G02B6/42 , H05K1/18 , H05K1/11 , H05K1/02
Abstract: An optical module includes: an optical element; a housing configured to house the optical element; as electrical terminal arranged on an outer peripheral surface of the housing and electrically connected to an inside of the housing; and a positioning unit configured to determine a relative position of a wiring board electrically connected to the electrical terminal from outside of the housing, with respect to the electrical terminal.
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公开(公告)号：US20210376931A1
公开(公告)日：2021-12-02
申请号：US17401182
申请日：2021-08-12
Applicant: FURUKAWA ELECTRIC CO., LTD.
Inventor： Kazuya NAGASHIMA , Yozo ISHIKAWA , Atsushi IZAWA
Abstract: An optical module includes: photoelectric elements including first terminal groups; an integrated circuit including second terminal groups and ground terminals; a carrier substrate; a housing; and a common ground pad. Further, the carrier substrate is fixed to one surface of the housing, the carrier substrate includes signal wiring parts and a ground wiring part, the ground wiring part includes terminal pattern parts, a common pattern part, and a coupling part, each of the terminal pattern parts being disposed between the corresponding signal wiring parts and electrically connected with one of the ground terminals, the common pattern part being disposed on a side where the common ground pad is provided on the carrier substrate, the coupling part electrically connecting each terminal pattern part and the common pattern part, and the ground terminals of the integrated circuit are electrically connected with the common ground pad through the ground wiring part.
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