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1.发明授权Delamination resistant device package having raised bond surface and mold locking aperture 有权具有升高的粘合表面和模具锁定孔的防分离装置包装公开(公告)号：US08736042B2
公开(公告)日：2014-05-27
申请号：US13324749
申请日：2011-12-13
IPC分类号： H01L23/48 , H01L23/52 , H01L23/495
CPC分类号： H01L23/49551 , H01L23/49503 , H01L23/49562 , H01L24/48 , H01L24/49 , H01L24/97 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/49109 , H01L2224/49113 , H01L2224/49171 , H01L2224/85001 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/15747 , H01L2924/181 , H01L2924/35121 , H01L2924/00011 , H01L2924/00013 , H01L2924/00 , H01L2224/85 , H01L2224/45099 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor package configured to attain a thin profile and low moisture sensitivity. Packages of this invention can include a semiconductor die mounted on a die attachment site of a leadframe and further connected with a plurality of elongate I/O leads arranged about the die attach pad and extending in said first direction. The leadframe having an “up-set” bonding pad arranged with a bonding support for supporting a plurality of wire bonds and a large mold flow aperture in the up-set bonding pad. The package encapsulated in a mold material that surrounds the bonding support and flows through the large mold flow aperture to establish well supported wire bonds such that the package has low moisture sensitivity.
摘要翻译： 一种半导体封装，其被配置为获得薄型和低湿度敏感性。 本发明的封装可以包括安装在引线框架的管芯附接部位上的半导体管芯，并且还与围绕管芯附接焊盘布置并沿所述第一方向延伸的多个细长I / O引线连接。 该引线框架具有一个“上部”焊盘，其布置有用于支撑多个引线接合的接合支撑件和在上压接焊盘中的大的模具流动孔。 该包装封装在模制材料中，该模具材料围绕粘合支撑件并流过大型模具流动孔径以建立良好的支撑的线接合，使得该包装具有低湿度敏感性。
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公开(公告)号：US08097934B1
公开(公告)日：2012-01-17
申请号：US12191158
申请日：2008-08-13
IPC分类号： H01L23/495
CPC分类号： H01L23/49551 , H01L23/49503 , H01L23/49562 , H01L24/48 , H01L24/49 , H01L24/97 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/49109 , H01L2224/49113 , H01L2224/49171 , H01L2224/85001 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/15747 , H01L2924/181 , H01L2924/35121 , H01L2924/00011 , H01L2924/00013 , H01L2924/00 , H01L2224/85 , H01L2224/45099 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A lead frame and package construction configured to attain a thin profile and low moisture sensitivity. Lead frames of this invention may include a die attach pad having a die attachment site and an elongate ground lead that extends from the die attach pad. The lead frame includes a plurality of elongate I/O leads arranged about the die attach pad and extending away from the die attach pad in at least two directions. An inventive lead frame features “up-set” bonding pads electrically connected with the die attach pad and arranged with a bonding surface for supporting a plurality of wire bonds. The bonding surfaces also constructed to define at least one mold flow aperture for each up-set bonding pad. A package incorporating the lead frame is further disclosed such that the package includes an encapsulant that surrounds the bonding support and flows through the mold flow aperture to establish well supported wire bonds such that the package has low moisture sensitivity. Such packages can be constructed in single inline configuration, dual inline configuration, quad package configurations.
摘要翻译： 引线框架和封装结构，其构造为获得薄型和低湿度敏感性。 本发明的引线框架可以包括具有管芯附接位置的管芯附接垫和从管芯附接垫延伸的细长接地引线。 引线框架包括多个细长的I / O引线，其围绕管芯附接垫布置并且在至少两个方向上远离管芯附接垫延伸。 本发明的引线框架具有与芯片附接焊盘电连接的“上放置”焊盘，并布置有用于支撑多个引线键合的接合表面。 接合表面还被构造成为每个上定位焊盘限定至少一个模流通孔。 进一步公开了包括引线框架的封装，使得封装件包括密封剂，该密封剂围绕粘合支撑件并流过模具流动孔径以建立良好支撑的引线键合，使得封装具有低湿度敏感性。 这种封装可以采用单列直插式配置，双列直插式配置，四包装配置。
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公开(公告)号：US07838980B1
公开(公告)日：2010-11-23
申请号：US11862787
申请日：2007-09-27
CPC分类号： H01L23/49562 , H01L23/49551 , H01L24/48 , H01L24/49 , H01L24/97 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/49109 , H01L2224/49113 , H01L2224/49171 , H01L2224/73265 , H01L2224/85001 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/35121 , H01L2924/00 , H01L2224/45099 , H01L2924/00012
摘要： A lead frame and package construction configured to attain a thin profile and low moisture sensitivity. Lead frames of this invention may include a die attach pad having a die attachment site and an elongate ground lead that extends from the die attach pad. The lead frame includes a plurality of elongate I/O leads arranged about the die attach pad and extending in said first direction. An inventive lead frame features an “up-set” bonding pad electrically connected with the die attach pad and arranged with a bonding support for supporting a plurality of wire bonds. The lead frame also having a large mold flow aperture in the up-set bonding pad. A package incorporating the lead frame is further disclosed such that the package includes an encapsulant that surrounds the bonding support and flows through the large mold flow aperture to establish well supported wire bonds such that the package has low moisture sensitivity.
摘要翻译： 引线框架和封装结构，其构造为获得薄型和低湿度敏感性。 本发明的引线框架可以包括具有管芯附接位置的管芯附接垫和从管芯附接垫延伸的细长接地引线。 引线框架包括围绕管芯附接垫布置并沿所述第一方向延伸的多个细长I / O引线。 本发明的引线框架具有与管芯附接焊盘电连接的“上部”焊盘，并且布置有用于支撑多个引线接合的焊接支撑。 引线框架还具有在上压接焊盘中的大的模具流动孔径。 进一步公开了包括引线框架的封装，使得封装件包括密封剂，其围绕粘合支撑件并流过大型模具流动孔径以建立良好支撑的引线键合，使得封装具有低湿度敏感性。
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公开(公告)号：US20180122724A1
公开(公告)日：2018-05-03
申请号：US15848372
申请日：2017-12-20
IPC分类号： H01L23/495 , H01L23/00 , H01L21/48
CPC分类号： H01L23/49503 , H01L21/4842 , H01L23/49541 , H01L23/49562 , H01L23/49582 , H01L23/562 , H01L24/48 , H01L24/49 , H01L24/83 , H01L24/85 , H01L24/92 , H01L24/97 , H01L2224/05599 , H01L2224/45015 , H01L2224/48247 , H01L2224/48257 , H01L2224/49 , H01L2224/49111 , H01L2224/49171 , H01L2224/85 , H01L2224/92247 , H01L2924/00014 , H01L2924/181 , H01L2224/45099 , H01L2924/20754 , H01L2924/00012
摘要： A leadframe (300) for use in semiconductor devices, comprising an assembly pad (3010 having rectangular sides, the pad extending, on one pad side (301b), into a lead (302) and, on the opposite pad side (301a), into straps (350) oriented normal to the side (301a) and anchored in adjacent tie bars (313), strap surfaces having recesses (501, 502) suitable for interlocking with packaging materials. The leadframe further includes a plurality of leads (303) parallel to and alternating with the straps.
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