公开(公告)号：US20150138742A1

公开(公告)日：2015-05-21

申请号：US14539545

申请日：2014-11-12

Applicant: Finisar Corporation

Inventor： Henry Nguyen ,  Yuxin Zhou ,  Tay Gek-Teng

IPC: H05K1/11 ,  H05K1/18 ,  H05K3/34

CPC classification number: H05K1/113 ,  H01L2924/0002 ,  H05K1/0269 ,  H05K1/111 ,  H05K3/363 ,  H05K3/4007 ,  H05K3/4038 ,  H05K2201/0373 ,  H05K2201/09381 ,  H05K2201/09445 ,  H05K2201/09845 ,  H05K2203/0465 ,  Y02P70/611 ,  H01L2924/00

Abstract: A method of soldering can include: providing a first electronic component having a first buttoned soldering pad including a first soldering pad and one or more first button heads protruding from a first surface of the soldering pad; providing a second electronic component having a soldering pad; and soldering the first buttoned soldering pad to the soldering pad. The method includes introducing solder to spaces around the one or more first buttons of the first buttoned soldering pad. The method includes introducing a first solder to spaces around the one or more first buttons of the first buttoned soldering pad; introducing a second solder to spaces around one or more second buttons of a second buttoned soldering pad of the first electronic component; and forming spaces between the first and second solder that electronically insulate the first solder from the second solder.

Abstract translation: 焊接方法可以包括：提供第一电子部件，其具有包括第一焊接焊盘和从焊盘的第一表面突出的一个或多个第一按钮头的第一按扣焊盘; 提供具有焊盘的第二电子部件; 并将第一个带扣的焊盘焊接到焊盘。 该方法包括将焊料引入第一纽扣焊盘的一个或多个第一按钮周围的空间。 该方法包括：将第一焊料引入第一按扣焊盘的一个或多个第一按钮周围的空间; 将第二焊料引入到第一电子部件的第二按扣焊盘的一个或多个第二按钮周围的空间; 以及在所述第一和第二焊料之间形成用于使所述第一焊料与所述第二焊料电绝缘的空间。

公开(公告)号：US09900982B2

公开(公告)日：2018-02-20

申请号：US14539545

申请日：2014-11-12

Applicant: Finisar Corporation

Inventor： Henry Nguyen ,  Yuxin Zhou ,  Tay Gek-Teng

IPC: H05K7/10 ,  H05K1/11 ,  H05K1/02 ,  H05K3/36 ,  H05K3/40

CPC classification number: H05K1/113 ,  H01L2924/0002 ,  H05K1/0269 ,  H05K1/111 ,  H05K3/363 ,  H05K3/4007 ,  H05K3/4038 ,  H05K2201/0373 ,  H05K2201/09381 ,  H05K2201/09445 ,  H05K2201/09845 ,  H05K2203/0465 ,  Y02P70/611 ,  H01L2924/00

Abstract: A method of soldering can include: providing a first electronic component having a first buttoned soldering pad including a first soldering pad and one or more first button heads protruding from a first surface of the soldering pad; providing a second electronic component having a soldering pad; and soldering the first buttoned soldering pad to the soldering pad. The method includes introducing solder to spaces around the one or more first buttons of the first buttoned soldering pad. The method includes introducing a first solder to spaces around the one or more first buttons of the first buttoned soldering pad; introducing a second solder to spaces around one or more second buttons of a second buttoned soldering pad of the first electronic component; and forming spaces between the first and second solder that electronically insulate the first solder from the second solder.