Abstract:
An apparatus and related process are provided for vapor deposition of a sublimated source material as a thin film on a photovoltaic (PV) module substrate. A deposition head is configured for sublimating a source material supplied thereto. The sublimated source material condenses onto a transport conveyor disposed below the deposition head. A substrate conveyor is disposed below the transport conveyor and conveys substrates in a conveyance path through the apparatus such that an upper surface of the substrates is opposite from and spaced below a lower leg of the transport conveyor. A heat source is configured adjacent the lower leg of the transport conveyor. The source material plated onto the transport conveyor is sublimated along the lower leg and condenses onto to the upper surface of substrates conveyed by the substrate conveyor.
Abstract:
A method for vapor deposition of a sublimated source material, such as CdTe, onto substrates in a continuous, non-stop manner through the apparatus is provided. The sublimated source material moves through a distribution plate and deposits onto the upper surface of the substrates as they are conveyed through the deposition area. The substrates move into and out of the deposition area through entry and exit slots that are defined by transversely extending entrance and exit seals. The seals are disposed at a gap distance above the upper surface of the substrates that is less than the distance or spacing between the upper surface of the substrates and the distribution plate. The seals have a ratio of longitudinal length (in the direction of conveyance of the substrates) to gap distance of from about 10:1 to about 100:1.
Abstract:
Photovoltaic devices are provided that include a thin film stack (of a plurality of photovoltaic cells connected in series to each other) on a transparent substrate, a first busbar electrically connected to the first terminal cell, and a second busbar electrically connected to the second terminal cell. An encapsulation substrate is on the plurality of thin film layers and defines a first connection aperture positioned over the first busbar and a second connection aperture positioned over the second bus bar. A first electrical connector is positioned on the encapsulation substrate and is electrically connected to the first busbar through the first connection aperture, and a second electrical connector is positioned on the encapsulation substrate and is electrically connected to the second busbar through the second connection aperture. Solar arrays and kits are also provided that include such photovoltaic devices and a connection cable.
Abstract:
Photovoltaic devices are provided that include a thin film stack (of a plurality of photovoltaic cells connected in series to each other) on a transparent substrate, a first busbar electrically connected to the first terminal cell, and a second busbar electrically connected to the second terminal cell. An encapsulation substrate is on the plurality of thin film layers and defines a first connection aperture positioned over the first busbar and a second connection aperture positioned over the second bus bar. A first electrical connector is positioned on the encapsulation substrate and is electrically connected to the first busbar through the first connection aperture, and a second electrical connector is positioned on the encapsulation substrate and is electrically connected to the second busbar through the second connection aperture. Solar arrays and kits are also provided that include such photovoltaic devices and a connection cable.
Abstract:
Sputtering chambers including one or more first sputtering targets within the sputtering chamber and one or more second sputtering targets are generally provided. Each first sputtering target comprises a source material, and each second sputtering target comprises the source material and a dopant. A conveyor system is configured to transport a plurality of substrates through the sputtering chamber to deposit a thin film onto a surface of each substrate. A power source is electrically connected to each of the first sputtering targets and the second sputtering target. A target shield can also be included within the sputtering chamber, and can be positioned between a portion of the second sputtering target and the conveyor system. The dopant can be present within the second sputtering target as a discrete insert within a cavity defined by the source material. Methods are also provided for making a sputtering target and depositing a thin film.