Spatially distributed CdS in thin film photovoltaic devices and their methods of manufacture
    2.
    发明授权
    Spatially distributed CdS in thin film photovoltaic devices and their methods of manufacture 有权
    薄膜光伏器件中空间分布的CdS及其制造方法

    公开(公告)号:US09000549B2

    公开(公告)日:2015-04-07

    申请号:US13676550

    申请日:2012-11-14

    CPC classification number: H01L31/073 H01L31/035218 Y02E10/543

    Abstract: Thin film photovoltaic devices are provided. The device includes a transparent substrate; a transparent conductive oxide layer on the transparent substrate; an n-type window layer on the transparent conductive oxide layer, an absorber layer on the n-type window layer, and a back contact layer on the absorber layer. The n-type window layer includes a plurality of nanoparticles spatially distributed within a medium, with the nanoparticles comprising cadmium sulfide. In one embodiment, the medium has an optical bandgap that is greater than about 3.0 eV (e.g., includes a material other than cadmium sulfide). Methods are also provided for such thin film photovoltaic devices.

    Abstract translation: 提供薄膜光伏器件。 该装置包括透明基板; 在透明基板上的透明导电氧化物层; 透明导电氧化物层上的n型窗口层,n型窗口层上的吸收层和吸收层上的背面接触层。 n型窗口层包括在介质内空间分布的多个纳米颗粒,纳米颗粒包含硫化镉。 在一个实施例中,介质具有大于约3.0eV的光学带隙(例如,包括除硫化镉之外的材料)。 还提供了这种薄膜光伏器件的方法。

    METHODS AND APPARATUS FOR CONTROLLING DOPANT CONCENTRATION IN THIN FILMS FORMED VIA SPUTTERING DEPOSITION
    3.
    发明申请
    METHODS AND APPARATUS FOR CONTROLLING DOPANT CONCENTRATION IN THIN FILMS FORMED VIA SPUTTERING DEPOSITION 审中-公开
    用于控制通过溅射沉积形成的薄膜中的浓度浓度的方法和装置

    公开(公告)号:US20140238849A1

    公开(公告)日:2014-08-28

    申请号:US13775613

    申请日:2013-02-25

    CPC classification number: C23C14/3407 C23C14/086 C23C14/3414

    Abstract: Sputtering chambers including one or more first sputtering targets within the sputtering chamber and one or more second sputtering targets are generally provided. Each first sputtering target comprises a source material, and each second sputtering target comprises the source material and a dopant. A conveyor system is configured to transport a plurality of substrates through the sputtering chamber to deposit a thin film onto a surface of each substrate. A power source is electrically connected to each of the first sputtering targets and the second sputtering target. A target shield can also be included within the sputtering chamber, and can be positioned between a portion of the second sputtering target and the conveyor system. The dopant can be present within the second sputtering target as a discrete insert within a cavity defined by the source material. Methods are also provided for making a sputtering target and depositing a thin film.

    Abstract translation: 通常提供包括溅射室内的一个或多个第一溅射靶和一个或多个第二溅射靶的溅射室。 每个第一溅射靶包括源材料,并且每个第二溅射靶包括源材料和掺杂剂。 输送机系统被配置为通过溅射室输送多个基板以将薄膜沉积到每个基板的表面上。 电源电连接到第一溅射靶和第二溅射靶中的每一个。 目标屏蔽也可以包括在溅射室内,并且可以位于第二溅射靶的一部分和输送系统之间。 掺杂剂可以作为在由源材料限定的空腔内的分立插入物存在于第二溅射靶内。 还提供了制造溅射靶并沉积薄膜的方法。

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