公开(公告)号：US20130271175A1

公开(公告)日：2013-10-17

申请号：US13856091

申请日：2013-04-03

Applicant: FORMFACTOR, INC.

Inventor： Shawn Powell

IPC: G01R1/073

CPC classification number: G01R1/07378 ,  G01R1/07342 ,  G01R3/00 ,  H01L21/486 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2224/16225 ,  H05K1/0268 ,  H05K1/115 ,  H05K3/4038

Abstract: A probe card assembly and associated processes of forming them may include a wiring substrate with a first surface and an opposite surface, an electrically conductive first via comprising electrically conductive material extending into the wiring substrate from the opposite surface and ending before reaching the first surface, and a plurality of electrically conductive second vias, and a custom electrically conductive terminal disposed on the first surface such that said custom terminal covers the first via and contacts one of the second vias adjacent to said first via without electrically contacting the first via. Each of the second vias may be electrically conductive from the first surface to the opposite surface. The first via may include electrically insulating material disposed within a hole in the first via.

Abstract translation: 探针卡组件及其相关联的工艺可以包括具有第一表面和相对表面的布线基板，导电的第一通孔包括从相对表面延伸到布线基板中并在到达第一表面之前结束的导电材料， 以及多个导电的第二通孔以及设置在所述第一表面上的定制导电端子，使得所述定制端子覆盖所述第一通孔，并接触与所述第一通孔相邻的所述第二通孔中的一个，而不与所述第一通孔电接触。 每个第二通孔可以从第一表面到相对表面导电。 第一通孔可以包括设置在第一通孔中的孔内的电绝缘材料。

公开(公告)号：US09869697B2

公开(公告)日：2018-01-16

申请号：US15353324

申请日：2016-11-16

Applicant: FormFactor, Inc.

Inventor： Shawn Powell

IPC: G01R1/073 ,  G01R3/00 ,  H01L21/48 ,  H01L23/498 ,  H05K1/02 ,  H05K1/11 ,  H05K3/40

CPC classification number: G01R1/07378 ,  G01R1/07342 ,  G01R3/00 ,  H01L21/486 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2224/16225 ,  H05K1/0268 ,  H05K1/115 ,  H05K3/4038

Abstract: A probe card assembly and associated processes of forming them may include a wiring substrate with a first surface and an opposite surface, an electrically conductive first via comprising electrically conductive material extending into the wiring substrate from the opposite surface and ending before reaching the first surface, and a plurality of electrically conductive second vias, and a custom electrically conductive terminal disposed on the first surface such that said custom terminal covers the first via and contacts one of the second vias adjacent to said first via without electrically contacting the first via. Each of the second vias may be electrically conductive from the first surface to the opposite surface. The first via may include electrically insulating material disposed within a hole in the first via.

公开(公告)号：US20170067937A1

公开(公告)日：2017-03-09

申请号：US15353324

申请日：2016-11-16

Applicant: FormFactor, Inc.

Inventor： Shawn Powell

IPC: G01R1/073 ,  H01L21/48 ,  G01R3/00 ,  H05K1/11 ,  H05K3/40 ,  H05K1/02 ,  H01L23/498 ,  H01L21/66

CPC classification number: G01R1/07378 ,  G01R1/07342 ,  G01R3/00 ,  H01L21/486 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2224/16225 ,  H05K1/0268 ,  H05K1/115 ,  H05K3/4038

Abstract: A probe card assembly and associated processes of forming them may include a wiring substrate with a first surface and an opposite surface, an electrically conductive first via comprising electrically conductive material extending into the wiring substrate from the opposite surface and ending before reaching the first surface, and a plurality of electrically conductive second vias, and a custom electrically conductive terminal disposed on the first surface such that said custom terminal covers the first via and contacts one of the second vias adjacent to said first via without electrically contacting the first via. Each of the second vias may be electrically conductive from the first surface to the opposite surface. The first via may include electrically insulating material disposed within a hole in the first via.

Abstract translation: 探针卡组件及其相关联的工艺可以包括具有第一表面和相对表面的布线基板，导电的第一通孔包括从相对表面延伸到布线基板中并在到达第一表面之前结束的导电材料， 以及多个导电的第二通孔以及设置在所述第一表面上的定制导电端子，使得所述定制端子覆盖所述第一通孔，并接触与所述第一通孔相邻的所述第二通孔中的一个，而不与所述第一通孔电接触。 每个第二通孔可以从第一表面到相对表面导电。 第一通孔可以包括设置在第一通孔中的孔内的电绝缘材料。

公开(公告)号：US09523715B2

公开(公告)日：2016-12-20

申请号：US13856091

申请日：2013-04-03

Applicant: FormFactor, Inc.

Inventor： Shawn Powell

IPC: G01R1/073

CPC classification number: G01R1/07378 ,  G01R1/07342 ,  G01R3/00 ,  H01L21/486 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2224/16225 ,  H05K1/0268 ,  H05K1/115 ,  H05K3/4038

Abstract: A probe card assembly and associated processes of forming them may include a wiring substrate with a first surface and an opposite surface, an electrically conductive first via comprising electrically conductive material extending into the wiring substrate from the opposite surface and ending before reaching the first surface, and a plurality of electrically conductive second vias, and a custom electrically conductive terminal disposed on the first surface such that said custom terminal covers the first via and contacts one of the second vias adjacent to said first via without electrically contacting the first via. Each of the second vias may be electrically conductive from the first surface to the opposite surface. The first via may include electrically insulating material disposed within a hole in the first via.

Abstract translation: 探针卡组件及其相关联的工艺可以包括具有第一表面和相对表面的布线基板，导电的第一通孔包括从相对表面延伸到布线基板中并在到达第一表面之前结束的导电材料， 以及多个导电的第二通孔以及设置在所述第一表面上的定制导电端子，使得所述定制端子覆盖所述第一通孔，并接触与所述第一通孔相邻的所述第二通孔中的一个，而不与所述第一通孔电接触。 每个第二通孔可以从第一表面到相对表面导电。 第一通孔可以包括设置在第一通孔中的孔内的电绝缘材料。