公开(公告)号：US06939408B1

公开(公告)日：2005-09-06

申请号：US09650103

申请日：2000-08-29

申请人： Francis A. Abramovich ,  Nicole S. Carpenter ,  Joseph R. Drennan ,  Rick H. Gaylord ,  Casey J. Grant ,  Kenneth F. McAvey, Jr. ,  Mark A. Pakulski ,  Joel M. Sharrow ,  William A. Syverson ,  Alison K. Easton ,  Kenneth H. Yao

发明人： Francis A. Abramovich ,  Nicole S. Carpenter ,  Joseph R. Drennan ,  Rick H. Gaylord ,  Casey J. Grant ,  Kenneth F. McAvey, Jr. ,  Mark A. Pakulski ,  Joel M. Sharrow ,  William A. Syverson ,  Alison K. Easton ,  Kenneth H. Yao

IPC分类号： B08B3/00 ,  B08B3/08 ,  H01L21/00 ,  H01L21/306

CPC分类号： H01L21/02052 ,  B08B3/08 ,  H01L21/02019 ,  H01L21/30604 ,  H01L21/67086 ,  Y10S134/902

摘要： A method for preparing a workpiece surface utilizing two more fluids of differing density and miscibility which create one or more fluid interfaces wherein the fluids are chosen such that the solubility or affinity of one of the fluids is high for a material to be removed from the workpiece surface while the other fluid has a low solubility or affinity for the material to be removed. The workpiece surface is treated by passing the workpiece through the fluid interface. The two or more fluids are preferably dispensed into an apparatus and allowed to settle into two or more predominant layers separated by an interface. Surface preparation techniques which may benefit from the present invention include etching, cleaning or drying processes and the like.

摘要翻译： 一种用于制备工件表面的方法，其使用两种不同密度和混溶性的流体，其产生一个或多个流体界面，其中选择流体使得流体之一的溶解度或亲和力对于从工件中去除的材料是高的 而另一种流体对待除去的材料具有低溶解度或亲和性。 通过使工件通过流体界面来处理工件表面。 两种或更多种流体优选地分配到装置中并允许沉降到由界面分开的两个或更多个主要层中。 可受益于本发明的表面处理技术包括蚀刻，清洗或干燥过程等。

公开(公告)号：US06776171B2

公开(公告)日：2004-08-17

申请号：US09892954

申请日：2001-06-27

申请人： Nicole S. Carpenter ,  Joseph R. Drennan ,  Alison K. Easton ,  Casey J. Grant ,  Andrew S. Hoadley ,  Kenneth F. McAvey, Jr. ,  Joel M. Sharrow ,  William A. Syverson ,  Kenneth H. Yao

发明人： Nicole S. Carpenter ,  Joseph R. Drennan ,  Alison K. Easton ,  Casey J. Grant ,  Andrew S. Hoadley ,  Kenneth F. McAvey, Jr. ,  Joel M. Sharrow ,  William A. Syverson ,  Kenneth H. Yao

IPC分类号： B08B700

CPC分类号： B08B7/0014

摘要： An apparatus and method are provided for removing contaminate particulate matter from substrate surfaces such as semiconductor wafers. The method and apparatus use a material, preferably a liquid curable polymer, which is applied as a sacrificial coating to the surface of a substrate containing contaminate particulate matter thereon. An energy source is used to dislodge the contaminate particulate matter from the surface of the wafer into the sacrificial coating so that the particles are partially or fully encapsulated and suspended in the sacrificial coating. The sacrificial coating is then removed. The coating is preferably formed into a film to facilitate removal of the coating by pulling (stripping) the film providing a cleaner substrate surface.