摘要:
A spatial light modulator with an anti-reflective coating (ARC) 100 integrated into its structure. The manufacturing of the device is altered to include deposition of an ARC 100, and any necessary patterning and etching to allow the elements of the array to operate properly. The ARC could reside in several places of the element structure including over the addressing circuitry 26, over a middle layer 32 or on the underside of the reflective structure 10. Micromechanical spatial light modulators, as well as non-moving modulators, such as reflective and transmissive LCD modulators can use the invention.
摘要:
A capacitor structure formed on a semiconductor substrate may include a first interconnect wiring (such as copper damascene) and a first conductive barrier layer in contact with the first interconnect wiring. A first capacitor plate, a capacitor dielectric structure and a second capacitor plate may also be included over the first conductive barrier layer. A second conductive barrier layer may be formed on the second capacitor plate and a second planar insulating structure may be formed over the second capacitor plate. Finally, a second interconnect wiring may be embedded within a second planar insulator structure.
摘要:
Methods for selecting one or more golden devices on a golden wafer that exhibit a smooth length and width scaling behavior. Test devices of differing geometry and carried on different chips of the golden wafer are screened with single point measurements of electrical performance. Based upon a statistical analysis of these single point measurements, chips are selected that carry the respective golden device of each given geometry that exhibits optimum electrical performance referenced to a selection criterion. Golden devices identified by the selection process are extensively characterized with a more comprehensive electrical measurement. The parameters derived from these more extensive test measurements on the golden devices are then used for refining a device model for a circuit simulation.
摘要:
A method of modeling statistical variation of field effect transistors having fingers physically measures characteristics of existing transistors and extracts a scaled simulation based on the characteristics of the existing transistors using a first model. The method creates synthetic single finger data using the scaled simulation. The method physically measures characteristics of existing pairs of matched transistors and extracts random dopant fluctuations from the characteristics of the existing pairs of matched transistors using a second model that is different than the first model. The method extracts a single finger from the synthetic single finger data and the random dopant fluctuations using the first model. The method can also create an ensemble model by determining the skew between a typical single device model and a typical ensemble model. The method adjusts parameters of the first model to cause the single finger to match targets for the single finger. Also, the method produces the centered scalable single finger model (model C) after the adjustments are complete.
摘要:
A method, apparatus and program product are provided for extracting parameters for compact models for semiconductor devices. A first set of parameters associated with first and second semiconductor devices is defined and has the same value for all devices. A second set of parameters associated with the semiconductor devices is defined having values that differ among the devices. Data is measured from the semiconductor devices related to the first and second set of parameters. A mathematical relationship is established between the measured data, and the values of the second set of parameters are adjusted to fit the established mathematical relationship. The mathematical relationship may also be a correlation of the measured data from the first semiconductor device with the measured data from the second semiconductor device creating a data set for parameter extraction. Parameters may then be extracted from the data set related to the first and second semiconductor devices.
摘要:
The present invention provides a method of forming a capacitor in a last metal wiring layer, and the structure so formed. The invention further provides a spacer formed around the capacitor to electrically isolate portions of the capacitor
摘要:
A computer-implemented method for modeling Spatially Correlated Variation (SCV) in a design of an Integrated Circuit (IC) is disclosed. In one embodiment, the method includes: generating a set of coefficient values for a position dependent SCV function, the set of coefficient values being selected from a set of random variables; obtaining a set of coordinates defining a position of each of a plurality of devices in a defined field; evaluating the position dependent SCV function to determine a device attribute variation for each of the plurality of devices based upon the coordinates of each of the plurality of devices; modifying at least one model parameter based upon the evaluation of the position dependent SCV function; and running a circuit simulation using the at least one modified model parameter.
摘要:
A computer-implemented method for modeling Spatially Correlated Variation (SCV) in a design of an Integrated Circuit (IC) is disclosed. In one embodiment, the method includes: generating a set of coefficient values for a position dependent SCV function, the set of coefficient values being selected from a set of random variables; obtaining a set of coordinates defining a position of each of a plurality of devices in a defined field; evaluating the position dependent SCV function to determine a device attribute variation for each of the plurality of devices based upon the coordinates of each of the plurality of devices; modifying at least one model parameter based upon the evaluation of the position dependent SCV function; and running a circuit simulation using the at least one modified model parameter.
摘要:
Methods for selecting one or more golden devices on a golden wafer that exhibit a smooth length and width scaling behavior. Test devices of differing geometry and carried on different chips of the golden wafer are screened with single point measurements of electrical performance. Based upon a statistical analysis of these single point measurements, chips are selected that carry the respective golden device of each given geometry that exhibits optimum electrical performance referenced to a selection criterion. Golden devices identified by the selection process are extensively characterized with a more comprehensive electrical measurement. The parameters derived from these more extensive test measurements on the golden devices are then used for refining a device model for a circuit simulation.
摘要:
A method and system are disclosed for preserving measured temperature and geometric behavior of a hardware model while adjusting the model to match specified target values. In one embodiment, the method includes measuring a characteristic of an integrated circuit (IC) chip at a plurality of temperatures; modeling to form a hardware model for the characteristic versus temperature based on the measuring; obtaining a known first target value of the characteristic for at least one temperature in the hardware model; determining a plurality of second target values for the characteristic for a corresponding plurality of temperatures in the hardware model; and modeling to form a target model for the characteristic based on the first known target value and the plurality of second target values.