公开(公告)号：US06250127B1

公开(公告)日：2001-06-26

申请号：US09415698

申请日：1999-10-11

申请人： Frank J. Polese ,  Jack A. Rubin ,  Michael J. Singer ,  Walter V. Chichra ,  Anthony P. Grodio ,  Vlad Ocher ,  Henry Escalante ,  William Dixon ,  David L. Rose ,  Stuart Weinshanker

发明人： Frank J. Polese ,  Jack A. Rubin ,  Michael J. Singer ,  Walter V. Chichra ,  Anthony P. Grodio ,  Vlad Ocher ,  Henry Escalante ,  William Dixon ,  David L. Rose ,  Stuart Weinshanker

IPC分类号： B21C2300

CPC分类号： C22F1/04 ,  C22C32/0063 ,  H01L21/4878 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/16152 ,  H01L2924/16195 ,  Y10S72/70 ,  H01L2924/00

摘要： A process for low cost manufacturing light-weight, heat-dissipating structures such as heatsinks, heat spreaders, and covers or lids for microelectronic components such as flip-chip integrated circuits from difficult-to-machine metal matrix composites such as aluminum silicon carbide (generically referred to as “Al—SiC” or “AlSiC”). The process involves selecting a mass produced quantity of Al—SiC material, forming that material into a thin ribbon, then stamping/coining the ribbon into the structures. The ribbon can be formed by extruding a thin strip from a billet of the Al—SiC material, then plurally rolling it. In this way, commonly available AlSiC composites manufactured in high volume for use in other applications such as cast automotive parts may be used.

摘要翻译： 用于低成本制造轻量级，散热结构的方法，例如散热器，散热器，以及用于微电子部件的覆盖物或盖，例如来自难加工金属基复合材料的倒装芯片集成电路，例如铝碳化硅（ 通常称为“Al-SiC”或“AlSiC”）。 该方法包括选择大量产生的Al-SiC材料量，将该材料形成薄带，然后将带压制/压印成结构。 带可以通过从Al-SiC材料的坯料挤出薄带，然后多次轧制而形成。 以这种方式，可以使用大量制造的常用的AlSiC复合材料，以用于其他应用，例如铸造汽车部件。

公开(公告)号：US06462413B1

公开(公告)日：2002-10-08

申请号：US09620758

申请日：2000-07-21

申请人： Frank J. Polese ,  Stuart Weinshanker ,  Dana R. Graham

发明人： Frank J. Polese ,  Stuart Weinshanker ,  Dana R. Graham

IPC分类号： H01L2312

CPC分类号： H01L24/00 ,  H01L23/047 ,  H01L23/10 ,  H01L23/492 ,  H01L24/37 ,  H01L24/40 ,  H01L2224/37599 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/00 ,  H01L2224/37099

摘要： A heatsink assembly and method of fabrication and use for high power RF LDMOS transistors such as those used in mobile telephone basestation pre-antenna amplifiers wherein die attachment to the heatsink flange occurs prior to leadframe/spacer-to-flange bonding. Various bonding methods are disclosed which do not compromise the die-to-flange attachment bond. A unique leadframe/spacer/flange heatsink package is also disclosed which automatically properly orients attachment of the leadframe/spacer to the flange, and provides for a thickened spacer. A unique leadframe having contact projections also avoids later wire bonding. A unique leadframe/spacer/lid combination is disclosed which allows in one step the bonding of the leadframe to the flange, electrically contacting the die, and encapsulation.

摘要翻译： 用于大功率RF LDMOS晶体管的散热器组件和制造方法，例如在用于移动电话基站前置天线放大器中的那些，其中在引线框/间隔件到法兰接合之前发生与散热器法兰的连接。 公开了不损害模 - 法 - 凸缘附接接合的各种粘合方法。 还公开了独特的引线框架/间隔件/法兰散热器封装，其自动适当地将引线框架/间隔件附接到凸缘，并提供增厚的间隔件。 具有接触突起的独特的引线框架也避免了以后的引线接合。 公开了独特的引线框架/间隔件/盖子组合，其允许在一个步骤中将引线框架结合到凸缘，电接触管芯和封装。