MICROMECHANICAL SOUND TRANSDUCER
    5.
    发明申请

    公开(公告)号:US20200100033A1

    公开(公告)日:2020-03-26

    申请号:US16693016

    申请日:2019-11-22

    IPC分类号: H04R17/00 H04R7/06 H04R7/26

    摘要: A micromechanical sound transducer according to a first aspect includes a first bending transducer with a free end and a second bending transducer with a free end, the two bending transducers being arranged in a mutual plane, wherein the free end of the first bending transducer is separated from the free end of the second bending transducer via a slit. The second bending transducer is excited in-phase with the vertical vibration of the first bending transducer. A micromechanical sound transducer according to a second aspect includes a first bending transducer that is excited to vibrate vertically and a diaphragm element extending vertically to the first bending transducer, the diaphragm element being separated from a free end of the first bending transducer via a slit.