公开(公告)号：US5094726A

公开(公告)日：1992-03-10

申请号：US585551

申请日：1990-09-20

申请人： Fred I. Nobel ,  Barnet D. Ostrow ,  David N. Schram

发明人： Fred I. Nobel ,  Barnet D. Ostrow ,  David N. Schram

IPC分类号： C25D3/32 ,  C25D3/36 ,  C25D3/56 ,  C25D3/60 ,  H05K3/34

CPC分类号： C25D3/32 ,  C25D3/36 ,  C25D3/56 ,  C25D3/60 ,  H05K3/3473

摘要： Baths and methods for electroplating tin or tin-lead alloys wherein the formation of tetravalent tin and stannic oxide sludge is reduced or prevented. These baths contain a soluble divalent tin compound, a soluble alkyl or alkylol sulfonic acid at least one wetting agent, and a hydroxyl phenyl compound reducing agent. Other compounds may be added to the bath for improving its performance during electroplating.

摘要翻译： 用于电镀锡或锡铅合金的浴和方法，其中减少或防止四价锡和氧化锡污泥的形成。 这些浴含有可溶性二价锡化合物，可溶性烷基或烷基磺酸至少一种润湿剂和羟基苯基化合物还原剂。 可以向浴中加入其它化合物以改善其在电镀过程中的性能。

公开(公告)号：US4701244A

公开(公告)日：1987-10-20

申请号：US738615

申请日：1985-05-28

申请人： Fred I. Nobel ,  Barnet D. Ostrow

发明人： Fred I. Nobel ,  Barnet D. Ostrow

IPC分类号： C25D3/32 ,  C25D3/36 ,  C25D3/56 ,  C25D3/60 ,  H05K3/34

CPC分类号： C25D3/36 ,  C25D3/32 ,  C25D3/56 ,  C25D3/60 ,  H05K3/3473

摘要： The invention relates to the electrolytic plating of tin and lead metals and particularly to tin-lead alloys by dissolving divalent tin or lead compounds in an excess of a lower alkyl sulfonic acid or acid salt. The electrolytic bath comprises such additives as benzal acetone, benzaldehyde or derivatives thereof, aromatic pyridines; surfactants such as betaines, alkylene oxides polymers, imidazolinium compounds and quaternary ammonium salts and formaldehyde.

摘要翻译： 本发明涉及通过将二价锡或铅化合物溶解在过量的低级烷基磺酸或酸式盐中来对锡和铅金属，特别是锡铅合金的电解电镀。 电解浴包含诸如亚苄丙酮，苯甲醛或其衍生物，芳族吡啶等添加剂; 表面活性剂如甜菜碱，环氧烷聚合物，咪唑啉鎓化合物和季铵盐和甲醛。

公开(公告)号：US4717460A

公开(公告)日：1988-01-05

申请号：US64167

申请日：1987-06-18

申请人： Fred I. Nobel ,  Barnet D. Ostrow ,  David N. Schram

发明人： Fred I. Nobel ,  Barnet D. Ostrow ,  David N. Schram

IPC分类号： C25D3/32 ,  C25D3/36 ,  C25D3/56 ,  C25D3/60 ,  H05K3/34 ,  C25D3/58

CPC分类号： C25D3/60 ,  C25D3/32 ,  C25D3/36 ,  C25D3/56 ,  H05K3/3473

摘要： Baths and methods for electroplating tin or tin-lead alloys wherein the formation of tetravalent tin and stannic oxide sludge is reduced or prevented. These baths contain a soluble divalent tin compound, a soluble alkyl or alkylol sulfonic acid at least one wetting agent, and a hydroxyl phenyl compound reducing agent. Other compounds may be added to the bath for improving its performance during electroplating.

摘要翻译： 用于电镀锡或锡铅合金的浴和方法，其中减少或防止四价锡和氧化锡污泥的形成。 这些浴含有可溶性二价锡化合物，可溶性烷基或烷基磺酸至少一种润湿剂和羟基苯基化合物还原剂。 可以向浴中加入其它化合物以改善其在电镀过程中的性能。

公开(公告)号：US4000047A

公开(公告)日：1976-12-28

申请号：US535146

申请日：1974-12-20

申请人： Barnet D. Ostrow ,  Fred I. Nobel ,  Lazaro Yoen

发明人： Barnet D. Ostrow ,  Fred I. Nobel ,  Lazaro Yoen

IPC分类号： C25D3/32 ,  C25D3/36 ,  C25D3/60

CPC分类号： C25D3/60 ,  C25D3/32 ,  C25D3/36

摘要： A bath for the electrodeposition of bright tin-lead alloys which comprises an aqueous acidic bath containing at least one soluble tin compound and one soluble lead compound to which there has been added:A. a lower alkylene oxide condensation product, andB. an effective amount of at least one pyridine or quinoline compound having the structure ##STR1## wherein the substituents R.sub.1, R.sub.2, R.sub.3, R.sub.4 and R.sub.5 each is a hydrogen or halogen atom, a lower alkyl radical containing a hydroxyl group, an alkenyl radical, the radical (C.sub.n H.sub.2n --CO.sub.2 H in which n has a value from 0 to 6 or a carbamide radical or R.sub.4 and R.sub.5 combined form a divalent radical to provide a compound having the structure ##STR2## in which R.sub.6 is nothing or a hydroxyl radical; Z is nothing, 0.sup.- or a quaternary ammonium forming hydrocarbon radical provided that when Z is nothing, at least one of the substituents R.sub.1, R.sub.2, R.sub.3, R.sub.4 and R.sub.5 is a halogen atom, a lower alkyl radical containing a hydroxyl group, an alkenyl radical, the radical (C.sub.n H.sub.2n --CO.sub.2 H in which n has a value from 0 to 6 or a carbamide radical or R.sub.6 is a hydroxy radical; and X is nothing or when Z is a quaternary ammonium forming hydrocarbon radical X is an anion.The invention also includes the addition of an aromatic aldehyde in combination with pyridine or quinoline compounds and the alkylene oxide condensation product which results in the production of even brighter to brilliant deposits over a wide current density range.

摘要翻译： 用于电沉积明亮的锡铅合金的浴，其包含含有至少一种可溶性锡化合物和一种可溶性铅化合物的水性酸性浴，其中加入有：

公开(公告)号：US5066367A

公开(公告)日：1991-11-19

申请号：US585768

申请日：1990-09-20

申请人： Fred I. Nobel ,  Barnet D. Ostrow

发明人： Fred I. Nobel ,  Barnet D. Ostrow

IPC分类号： C25D3/32 ,  C25D3/36 ,  C25D3/56 ,  C25D3/60 ,  H05K3/34

CPC分类号： C25D3/36 ,  C25D3/32 ,  C25D3/56 ,  C25D3/60 ,  H05K3/3473

摘要： Baths and methods for electroplating tin or tin-lead alloys wherein the formation of tetravalent tin and stannic oxide sludge is reduced or prevented. These baths contain a soluble divalent tin compound, a soluble alkyl or alkylol sulfonic acid at least one wetting agent, and a hydroxyl phenyl compound reducing agent. Other compounds may be added to the bath for improving its performance during electroplating.

摘要翻译： 用于电镀锡或锡铅合金的浴和方法，其中减少或防止四价锡和氧化锡污泥的形成。 这些浴含有可溶性二价锡化合物，可溶性烷基或烷基磺酸至少一种润湿剂和羟基苯基化合物还原剂。 可以向浴中加入其它化合物以改善其在电镀过程中的性能。

公开(公告)号：US4871429A

公开(公告)日：1989-10-03

申请号：US188233

申请日：1988-04-29

申请人： Fred I. Nobel ,  Barnet D. Ostrow ,  David N. Schram

发明人： Fred I. Nobel ,  Barnet D. Ostrow ,  David N. Schram

IPC分类号： C25D3/32 ,  C25D3/36 ,  C25D3/56 ,  C25D3/60 ,  H05K3/34

CPC分类号： C25D3/36 ,  C25D3/32 ,  C25D3/56 ,  C25D3/60 ,  H05K3/3473

摘要： Baths and methods for electroplating tin or tin-lead alloys wherein the formation of tetravalent tin and stannic oxide sludge is reduced or prevented. These baths contain a soluble divalent tin compound, a soluble alkyl or alkylol sulfonic acid at least one wetting agent, and a hydroxyl phenyl compound reducing agent. Other compounds may be added to the bath for improving its performance during electroplating.

摘要翻译： 用于电镀锡或锡铅合金的浴和方法，其中减少或防止四价锡和氧化锡污泥的形成。 这些浴含有可溶性二价锡化合物，可溶性烷基或烷基磺酸至少一种润湿剂和羟基苯基化合物还原剂。 可以向浴中加入其它化合物以改善其在电镀过程中的性能。

公开(公告)号：US4617097A

公开(公告)日：1986-10-14

申请号：US778353

申请日：1985-09-20

申请人： Fred I. Nobel ,  Barnet D. Ostrow ,  David N. Schram

发明人： Fred I. Nobel ,  Barnet D. Ostrow ,  David N. Schram

IPC分类号： C25D3/32 ,  C25D3/36 ,  C25D3/56 ,  C25D3/60 ,  H05K3/34

CPC分类号： C25D3/56 ,  C25D3/32 ,  C25D3/36 ,  C25D3/60 ,  H05K3/3473

摘要： A process and bath for electroplating tin, lead and tin-lead alloys. Improved brightness, solderability and broader current density ranges are achieved by the use in the baths of a soluble alkylene oxide condensate to provide a cloud point of the bath above about 90.degree. F., a soluble bismuth compound, an aromatic aldehyde and acetaldehyde. Tin and lead are supplied to the bath as salts of alkyl or alkylol sulfonic acids with sufficient free alkyl or alkylol sulfonic acid to provide a bath pH of less than 3.

摘要翻译： 用于电镀锡，铅和锡铅合金的工艺和浴。 通过在可溶性环氧烷缩合物的浴中使用提供高于约90°F的浴的浊点，可溶性铋化合物，芳族醛和乙醛来实现亮度提高，可焊性和更宽的电流密度范围。 将锡和铅作为具有足够游离烷基或烷基磺酸的烷基或烷基磺酸的盐提供到浴中以提供小于3的浴pH。

公开(公告)号：US3963455A

公开(公告)日：1976-06-15

申请号：US553145

申请日：1975-02-26

申请人： Fred I. Nobel ,  Barnet D. Ostrow

发明人： Fred I. Nobel ,  Barnet D. Ostrow

IPC分类号： C25D5/10 ,  B32B15/00

CPC分类号： C25D5/10 ,  Y10S428/926 ,  Y10S428/935 ,  Y10T428/1284 ,  Y10T428/12889 ,  Y10T428/12931

摘要： The method of preventing or inhibiting diffusion of a base metal into an electrodeposited gold layer on said base metal which comprises electrodepositing a barrier layer on the base metal comprising a tungsten-cobalt alloy or a tungsten-nickel alloy and subsequently electrodepositing gold on the alloy barrier layer. The invention also includes the use of chelating agents in tungsten-cobalt and tungsten-nickel plating baths.

摘要翻译： 防止或抑制贱金属扩散到所述母金属上的电沉积金层中的方法，其包括在包含钨 - 钴合金或钨 - 镍合金的基底金属上电沉积阻挡层，并随后在合金屏障上电沉积金 层。 本发明还包括在钨 - 钴和钨 - 镍电镀浴中使用螯合剂。