公开(公告)号：US20170157735A1

公开(公告)日：2017-06-08

申请号：US15370670

申请日：2016-12-06

Applicant: Fujikoshi Machinery Corp. ,  National Institute of Advanced Industrial Science and Technology

Inventor： Masayuki TSUKADA ,  Kazutaka SHIBUYA ,  Takayuki FUSE ,  Yoshio NAKAMURA ,  Shiro Hara

IPC: B24B37/34 ,  H01L21/306 ,  B24B37/20 ,  H01L21/67

CPC classification number: B24B37/34 ,  B24B37/20

Abstract: The work processing apparatus of the present invention comprises: a processing section for processing or treating a work; and a liquid chemical supplying section for supplying a liquid chemical to the processing section. The liquid chemical supplying section includes: a plurality of liquid chemical bags for storing the liquid chemical; a bag holding part in which the liquid chemical bags are attached and held; and a liquid feeding part, to which the liquid chemical bags are detachably connected, for feeding the liquid chemical from the liquid chemical bags to the processing section. Each of the liquid chemical bags is produced by overlapping flexible resin sheets with each other and welding their edge parts to form into a bag. Each of the liquid chemical bags has a port part communicating with an outside. A joint with a valve is attached to each of the port parts.

公开(公告)号：US20180193975A1

公开(公告)日：2018-07-12

申请号：US15834983

申请日：2017-12-07

Applicant: Fujikoshi Machinery Corp.

Inventor： Masayuki TSUKADA ,  Kazutaka SHIBUYA ,  Takayuki FUSE

IPC: B24B37/32 ,  B24B37/005

Abstract: The polishing head comprises: a head main body part; a carrier being connected to the head main body part; a pressure chamber; a fluid supplying section; a linear motion guide having an outer cylindrical body and a spline shaft, which is provided in the outer cylindrical body and capable of moving in an axial direction thereof, and which is prohibited to rotate with respect to the outer cylindrical body so as to transmit a rotational force to the spline shaft through the outer cylindrical body; and a rotation transmitting plate being provided between a lower end of the spline shaft and an upper face of the carrier, the rotation transmitting plate being capable of tiltably supporting the carrier and transmitting a rotational force of the spline shaft to the carrier.

公开(公告)号：US20140154958A1

公开(公告)日：2014-06-05

申请号：US14096226

申请日：2013-12-04

Applicant: National Institute of Advanced Industrial Science and Technology ,  Fujikoshi Machinery Corp.

Inventor： Yoshio NAKAMURA ,  Yoshio OTSUKA ,  Takashi OKUBO ,  Kazutaka SHIBUYA ,  Takayuki FUSE ,  Shiro HARA ,  Sommawan KHUMPUANG ,  Shinichi IKEDA

IPC: B24B7/22 ,  B24B37/16 ,  B24B53/017

CPC classification number: B24B7/228 ,  B24B37/105 ,  B24B37/16 ,  B24B37/26 ,  B24B37/30 ,  B24B37/345 ,  B24B53/017

Abstract: The wafer polishing apparatus comprises a polishing plate, a polishing head capable of holding a wafer, and a slurry supplying section. The polishing plate includes: a plurality of concentric polishing zones, each of which has a prescribed width for polishing the wafer and on each of which a polishing cloth is adhered; and a groove for discharging slurry being formed between the polishing zones. A head cleaning section, which cleans the polishing head, or a wafer cleaning section, which cleans the polished wafer, is provided to a center part of the polishing plate and located on the inner side of the innermost polishing zone.

Abstract translation: 晶片抛光装置包括抛光板，能够保持晶片的抛光头和浆料供应部分。 抛光板包括：多个同心抛光区，每个同心抛光区具有用于抛光晶片的规定宽度，并且其中每个抛光区附着有抛光布; 以及用于在抛光区之间形成的用于排出浆料的槽。 清洗抛光头的清洁部分或清洁抛光晶片的晶片清洁部分设置在抛光板的中心部分并位于最内侧抛光区的内侧。