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公开(公告)号：US5458529A
公开(公告)日：1995-10-17
申请号：US249933
申请日：1994-05-26
CPC分类号： B24B9/065
摘要： A polishing apparatus which can effectively polish a bottom wall of a wafer in the notch portion is disclosed. The polishing apparatus includes: a table for supporting the wafer thereon; a rotary buff having a thickness so that the periphery thereof can enter the notch portion of the wafer, and is rotated around an axis which is parallel with a plane of the surface of the wafer supported on the table; a first rotating member such as a motor for rotating the rotary buff; a movable linkage for supporting the rotary buff; an adjusting member such as a cylinder device for adjusting the pressure applied to the bottom wall of the wafer in the notch portion from the rotary buff; and a second rotating member such as a pulse motor for turning the rotary buff around a predetermined axis so that the applied pressure from the rotary buff acts on the bottom wall of the wafer in the notch portion in a direction approximately perpendicular to the surface of the bottom wall.
摘要翻译： 公开了一种可以有效地抛光切口部分中的晶片底壁的抛光装置。 抛光装置包括：用于在其上支撑晶片的工作台; 旋转抛光器，其厚度使得其周边可以进入晶片的切口部分，并且围绕与支撑在工作台上的晶片的表面的平面平行的轴线旋转; 第一旋转构件，例如用于旋转旋转抛光器的马达; 用于支撑旋转抛光器的可移动连杆; 调节构件，例如用于调节从旋转抛光器施加到切口部分中的晶片的底壁的压力的气缸装置; 以及第二旋转构件，例如脉冲电机，用于围绕预定轴线旋转旋转抛光器，使得来自旋转抛光器的施加压力在大致垂直于切割部分的表面的方向上作用在切口部分中的晶片的底壁上 底壁。
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公开(公告)号：US5429544A
公开(公告)日：1995-07-04
申请号：US265792
申请日：1994-06-27
CPC分类号： H01L21/02027 , B24B9/065
摘要： An polishing apparatus which can effectively polish a bottom wall of a wafer in a notch portion is disclosed. The apparatus includes: a table for supporting the wafer thereon; a rotary buff having a thickness so that the periphery thereof can enter the notch portion of the wafer, and is rotated around an axis which is parallel with a plane of the surface of the wafer supported on the table; a first rotating member such as a motor for rotating the rotary buff; a linkage for supporting the rotary buff; an adjusting member such as a cylinder device for adjusting the pressure applied to the bottom wall of the wafer in the notch portion from the rotary buff; and a second rotating member for turning the table around a predetermined axis which is approximately parallel with the rotary axis of the rotary buff so that the applied pressure from the rotary buff acts on the bottom wall of the wafer in the notch portion in a direction approximately perpendicular to the surface of the bottom wall.
摘要翻译： 公开了一种能够在凹口部分中有效地抛光晶片底壁的抛光装置。 该装置包括：用于在其上支撑晶片的工作台; 旋转抛光器，其厚度使得其周边可以进入晶片的切口部分，并且围绕与支撑在工作台上的晶片的表面的平面平行的轴线旋转; 第一旋转构件，例如用于旋转旋转抛光器的马达; 用于支撑旋转抛光器的连杆; 调节构件，例如用于调节从旋转抛光器施加到切口部分中的晶片的底壁的压力的气缸装置; 以及第二旋转构件，用于围绕大致平行于旋转抛光轮的旋转轴线的预定轴线旋转工作台，使得来自旋转抛光器的施加的压力在大致上的方向上作用在切口部分中的晶片的底壁上 垂直于底壁的表面。
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3.发明授权Method for mirror-polishing chamfered portion of wafer and mirror-polishing apparatus 失效用于镜面抛光的晶片倒角部分和镜面抛光装置的方法
公开(公告)号：US5727990A
公开(公告)日：1998-03-17
申请号：US779040
申请日：1997-01-06
CPC分类号： B24B9/065
摘要： A method and an apparatus, which enable mirror-polishing a peripheral chamfered portion of a semiconductor wafer effectively, are disclosed. Mirror-polishing a peripheral side surface of the chamfered portion of the wafer, beveled surfaces thereof, and rounded edges formed between the peripheral side surface and each of the beveled surfaces, are individually carried out.
摘要翻译： 公开了一种有效地对半导体晶片的外围倒角部进行镜面研磨的方法和装置。 对晶片的倒角部分的周边侧表面进行镜面抛光，其边缘表面和形成在周边侧表面和每个倾斜表面之间的圆形边缘分别进行。
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公开(公告)号：US5733181A
公开(公告)日：1998-03-31
申请号：US329952
申请日：1994-10-27
CPC分类号： B24B21/002 , B24B9/065
摘要： An apparatus for polishing the notch of a wafer in an effective and efficient way, which comprises: a flexible tape carrying abrasive grains in the working face thereof; an infeed reel for feeding the tape stored thereon: a take-up reel for taking up the tape fed from the infeed reel; a motor for driving to rotate the take-up reel; a means for blowing a fluid to the backside surface to the edge portion of the notch to be in direct contact along the full periphery of the notch; and a means for oscillating the tape sideways.
摘要翻译： 一种用于以有效和有效的方式抛光晶片的凹口的装置，其包括：在其工作面中承载磨料颗粒的柔性带; 用于馈送存储在其上的带的进给卷轴;卷取卷轴，用于卷取从进料卷轴进给的带; 用于驱动旋转卷取卷轴的马达; 用于将流体吹送到所述凹口的所述边缘部分的所述后侧表面沿着所述凹口的整个周边直接接触的装置; 以及用于横向摆动带的装置。
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公开(公告)号：US5476413A
公开(公告)日：1995-12-19
申请号：US306439
申请日：1994-09-19
IPC分类号： B24B9/00 , B24B9/06 , B24B21/00 , B24D9/06 , H01L21/304
CPC分类号： B24B9/065 , B24B21/002 , B24B21/004 , B24D9/06
摘要： An apparatus for polishing the periphery portion of a wafer, by which improvement on the polishing velocity may be effected and besides a more efficient spatial usage of the working layer of an abrasive tape is capable, comprising a tape holding fixed abrasive grains thereon; a feed reel for feeding the tape stored by winding itself; a take-up reel for taking up the tape by winding itself; a rotary drum inside of which both of the reels are equipped in such a manner that they are mountable or demountable, where a portion of the tape in the way from the feed reel to the take-up reel is adaptive to wind the rotary drum around the outer cylindrical surface thereof in close contact in the shape of a helicoid and one of the main faces of the wafer is positioned to be in a plane intersecting the central axis of the rotary drum at an angle.
摘要翻译： 抛光晶片周边部分的装置可以进行研磨速度的改善，并且除了可以更有效地利用砂带工作层的空间使用之外，还包括在其上保持固定磨粒的带; 用于馈送通过缠绕自身而存储的带的馈送卷轴; 用于卷绕磁带的卷取卷轴; 其中两个卷盘的两个卷轴被安装成可安装或拆卸的旋转滚筒，其中从进给卷轴到卷取卷轴的带的一部分适于卷绕旋转滚筒 其圆柱形表面紧密接触螺旋形状并且晶片的主面之一被定位成与旋转鼓的中心轴线成一定角度的平面。
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公开(公告)号：US5316620A
公开(公告)日：1994-05-31
申请号：US7888
申请日：1993-01-22
IPC分类号： B24B9/00 , B24B9/06 , H01L21/304 , H01L21/306 , B44C1/22 , H01L21/463
CPC分类号： H01L21/02021 , B24B9/065 , Y10S438/959
摘要： A method for polishing peripheral chamfers of a semiconductor wafer comprising steps of: (a) turning a cylindrical cup-like rotatory buff having an internal polish groove formed in the inner wall surface thereof, the groove having a profile complementary to the profile of the chamfered wafer edge to be polished; (b) disposing the wafer inside the turning buff; (c) turning the wafer at a relatively low rate; and (d) pressing the wafer edge into the running internal polish groove with an appropriate pressure; furthermore there is proposed an apparatus for this novel method including the cylindrical cup-like rotatory buff as described above.
摘要翻译： 一种用于抛光半导体晶片的周边倒角的方法，包括以下步骤：（a）转动在其内壁表面中形成有内部抛光槽的圆柱形杯状旋转抛光器，所述凹槽具有与倒角的轮廓互补的轮廓 晶圆边缘要抛光; （b）将晶片放置在转动抛光器内; （c）以相对较低的速率转动晶片; 和（d）以适当的压力将晶片边缘压入行进的内部抛光槽; 此外，提出了一种用于这种新方法的装置，其包括如上所述的圆柱形杯状旋转抛光器。
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公开(公告)号：US5547415A
公开(公告)日：1996-08-20
申请号：US72741
申请日：1993-06-07
CPC分类号： B24B9/065 , B24B37/00 , B24B41/005
摘要： A method and apparatus for polishing chamfers made along the periphery; of a semiconductor wafer designed such that when the wafer is once picked up by a rotatory suction cup of a transportation robot, arm, the wafer is not released from the suction cup until the entire polishing operation is completed; in an embodiment, a circular turn table having six wafer suction cups is employed which is adapted to turn step-wise, each step consisting of a turn through an angle of 60.degree. to transfer the wafers.
摘要翻译： 一种沿周边抛光倒角的方法和装置; 半导体晶片被设计成使得当晶片被传送机器人臂的旋转吸盘拾取时，晶片不会从吸盘释放直到整个抛光操作完成; 在一个实施例中，使用具有六个晶片吸盘的圆形转台，其适于逐步转动，每个步骤包括60°的转角，以转移晶片。
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公开(公告)号：US5404678A
公开(公告)日：1995-04-11
申请号：US72776
申请日：1993-06-07
CPC分类号： B24B9/065 , B24B27/0023 , B24B41/005
摘要： A wafer chamfer polishing apparatus with a rotary circular dividing table, wherein the vacuum pump for pneumatically activating the wafer suction cups is mounted on an integral part of the rotary circular dividing table and the drive motors for dynamically activating the wafer suction cups are installed on an independent stationary body.
摘要翻译： 具有旋转圆形分割台的晶片倒角抛光装置，其中用于气动激活晶片吸盘的真空泵安装在旋转圆形分割台的一体部分上，用于动态启动晶片吸盘的驱动马达安装在 独立静止体。
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公开(公告)号：US06234879B1
公开(公告)日：2001-05-22
申请号：US08619882
申请日：1996-03-20
IPC分类号： B24B900
CPC分类号： B24B9/065 , B24B37/00 , B24B41/005
摘要： A method and apparatus for polishing chamfers made along the periphery of a semiconductor wafer designed such that when the wafer is once picked up by a rotatory suction cup of a transportation robot arm, the wafer is not released from the suction cup until the entire polishing operation is completed; in an embodiment, a circular turn table having six wafer suction cups is employed which is adapted to turn step-wise, each step consisting of a turn through an angle of 60° to transfer the wafers.
摘要翻译： 一种用于抛光沿半导体晶片的周边形成的倒角的方法和装置，其设计成使得当晶片被传送机器人臂的旋转吸盘一次拾取时，晶片不会从吸盘释放直到整个抛光操作 完成了; 在一个实施例中，使用具有六个晶片吸盘的圆形转台，其适于逐步转动，每个步骤包括60°的转角以转移晶片。
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公开(公告)号：US5538463A
公开(公告)日：1996-07-23
申请号：US156829
申请日：1993-11-24
摘要： An apparatus for bevelling the edge of a wafer, comprising a framework, a table rotatably mounted to the framework and capable of holding down the wafer, a buff rotatably mounted to the framework opposite the table and having a formed groove for bevelling the wafer edge, an air cylinder assembly mounted to the framework and pressing the buff by different forces on the orientation flat, the circular edge and the round joints of the wafer held down by the table, a sensor sensing the orientation flat, the circular edge and the round joints of the wafer held down by the table and producing corresponding signals, and a control controlling the air cylinder assembly to select between the forces in response to the signals. The apparatus may comprise a grooving cutter assembly removably held by the table, a lock locking the rotation of the table when the apparatus produces the formed groove in the buff, and a stopper stopping the air cylinder assembly and positioning the cutter assembly relative to the buff.
摘要翻译： 一种用于斜切晶片边缘的装置，包括框架，可旋转地安装到框架并能够保持晶片的台子，可旋转地安装到与桌子相对的框架上的抛光轮，并具有用于斜切晶片边缘的形成的凹槽， 安装到框架上的气缸组件，并且通过由定位平面，圆形边缘和由桌子压下的晶片的圆形接头上的不同的力来挤压凸轮，感测定向平面，圆形边缘和圆形接头的传感器 并且产生对应的信号，以及控制气缸组件以响应于信号在力之间进行选择的控制。 该设备可以包括可移动地由工作台保持的切槽刀具组件，当设备在抛光器中产生形成的凹槽时锁定桌子的旋转，并且止动器阻止气缸组件并且相对于凸轮定位刀具组件 。
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