摘要:
A method for polishing peripheral chamfers of a semiconductor wafer comprising steps of: (a) turning a cylindrical cup-like rotatory buff having an internal polish groove formed in the inner wall surface thereof, the groove having a profile complementary to the profile of the chamfered wafer edge to be polished; (b) disposing the wafer inside the turning buff; (c) turning the wafer at a relatively low rate; and (d) pressing the wafer edge into the running internal polish groove with an appropriate pressure; furthermore there is proposed an apparatus for this novel method including the cylindrical cup-like rotatory buff as described above.
摘要:
An apparatus for polishing edge chamfers of a semiconductor wafer to mirror gloss, having a rotatory cylindrical buff formed with annular groove(s) in its side and a wafer vacuum holder capable of holding and turning the wafer circumferentially, wherein the cylindrical buff is adapted to shift axially, and the annular groove has a width substantially greater than the thickness of the wafer, and a drive mechanism for axially biasing the cylindrical buff is provided.
摘要:
A connector 1 includes: a terminal 2; an inner housing 5; and an outer housing 30 receiving the terminal 2 and the inner housing 5. The terminal 2 is provided with a first electric connecting part 21 received and held in the inner housing 5 and electrically connected to the mating connector, a second electric connecting part 22, and a flexible coupling part 23 made of conductive material, movably coupling and electrically connecting the first electric connecting part 21 and the second electric connecting part 22. The outer housing 30 is provided with a receiving part 36 movably receiving the inner housing 5 which receives the first electric connecting part 21, and a fixing part 35 to which the second electric connecting part 22 is fixed.
摘要:
A storage system has multiple disk controller (DKC) units that are coupled to one another in accordance with a coupling mode that satisfies the following (a1) through (a3): (a1) One DKC inside one DKC unit and one DKC inside another DKC unit are coupled via a second type of coupling medium that differs from the internal bus of the DKC and has a longer maximum communication distance than a first type of coupling medium, which is the same type of coupling medium as the internal bus of the DKC; (a2) the one DKC unit virtualizes a logical volume of the other DKC unit and provides this virtualized logical volume to host(s) coupled to the one DKC unit; and (a3) the other DKC unit virtualizes a logical volume of the DKC unit and provides this virtualized logical volume to host(s) coupled to the other DKC unit.
摘要:
To provide a screw fastening device that, when performing a screw tightening operation, can substantially reduce the running torque directly applied by external force to a screw driving device.A characteristic constitution is adopted that is equips a screw driving device α2 with a device body 1 that stacks a plurality of piezoelectric elements 3 and 4 that generate predetermined ultrasonic oscillations with the application of a predetermined AC voltage and excites mechanical oscillations in a predetermined direction on an oscillating end surface 1a based on the ultrasonic oscillations; and a male distal end portion 21 that is correspondingly formed to be capable of fitting in a female recess 103 formed in a screw β1 and integrally fixed to the device body 1 on the oscillating end surface 1a of the device body 1 to impart running torque, which is directly applied to the screw driving device α2 by external force, and transmit the mechanical oscillations in the predetermined direction that the device body 1 excites to the screw β1, with which contact is made by fitting in the female recess 103.
摘要:
To provide a screw fastening device that, when performing a screw tightening operation, can substantially reduce the running torque directly applied by external force to a screw driving device.A characteristic constitution is adopted that is equips a screw driving device α2 with a device body 1 that stacks a plurality of piezoelectric elements 3 and 4 that generate predetermined ultrasonic oscillations with the application of a predetermined AC voltage and excites mechanical oscillations in a predetermined direction on an oscillating end surface 1a based on the ultrasonic oscillations; and a male distal end portion 21 that is correspondingly formed to be capable of fitting in a female recess 103 formed in a screw β1 and integrally fixed to the device body 1 on the oscillating end surface 1a of the device body 1 to impart running torque, which is directly applied to the screw driving device α2 by external force, and transmit the mechanical oscillations in the predetermined direction that the device body 1 excites to the screw β1, with which contact is made by fitting in the female recess 103.
摘要:
A communication terminal device and a method for controlling the same which can operate a mail restriction function effectively without increasing a mail address registered for the mail restriction function are provided. The transmission and the reception of the mail is restricted by storing by a domain conversion table a corresponding relationship between an original domain by the automatic address conversion unit and the domain after the conversion, acquiring by the original domain acquiring unit the original domain based on the domain of the mail address converted by the automatic address conversion unit by referring to the domain conversion table, and controlling by the mail transmission and reception control means the transmission and the reception of the mail by comparing the mail address replaced with the domain of the mail address of the transmitting/receiving mail by the original domain acquired by the original domain acquiring unit with the registered mail address.
摘要:
A resin molded type semiconductor device has an inner portion sandwiched between two outer surfaces. The device includes a chip support with a first, inwardly facing surface and a second, outwardly facing surface. The device also includes a semiconductor element with a first, inwardly facing surface and a second, outwardly facing surface. The respective first surfaces of the chip support and semiconductor element are fixed to each other. A mold resin is provided to seal the entire semiconductor device except for the respective second surfaces of the chip support and semiconductor element which remain exposed as part of the two outer surfaces of the device, in order to keep the semiconductor device thin.