Semiconductor device and a method of manufacturing the same
    7.
    发明授权
    Semiconductor device and a method of manufacturing the same 有权
    半导体装置及其制造方法

    公开(公告)号:US07087955B2

    公开(公告)日:2006-08-08

    申请号:US10811830

    申请日:2004-03-30

    IPC分类号: H01L29/788

    摘要: A semiconductor device has a nonvolatile memory employing a split-gate type memory cell structure, using a nitride film as a charge storage layer. An n-type semiconductor region is formed in a main surface of a semiconductor substrate, and then, a memory gate electrode of a memory cell of a split gate type and a charge storage layer are formed over the semiconductor region. Subsequently, side walls are formed on side surfaces of the memory gate electrode, and a photoresist pattern is formed over the main surface of the semiconductor substrate. The photoresist pattern serves as an etching mask, and a part of the main surface of the semiconductor substrate is removed by etching to form a dent. In the region of the dent, the n-type semiconductor region is removed. Then, a p-type semiconductor region for forming a channel of an nMIS transistor for selecting a memory cell is formed.

    摘要翻译: 半导体器件具有使用氮化物膜作为电荷存储层的采用分离栅型存储单元结构的非易失性存储器。 在半导体衬底的主表面中形成n型半导体区域,然后在半导体区域上形成分裂栅型存储单元的存储栅电极和电荷存储层。 随后,在存储栅电极的侧表面上形成侧壁,并且在半导体衬底的主表面上形成光刻胶图形。 光致抗蚀剂图案用作蚀刻掩模,并且通过蚀刻去除半导体衬底的主表面的一部分以形成凹陷。 在凹陷的区域中,去除n型半导体区域。 然后,形成用于形成用于选择存储单元的nMIS晶体管的沟道的p型半导体区域。