公开(公告)号：US20130099270A1

公开(公告)日：2013-04-25

申请号：US13714000

申请日：2012-12-13

Applicant: Furukawa Electric Co., Ltd.

Inventor： Yoshiaki KOBAYASHI ,  Akira MATSUDA ,  Satoshi SUZUKI ,  Shin KIKUCHI ,  Akira TACHIBANA ,  Satoru ZAMA

IPC: H01L33/60

CPC classification number: H01L33/60 ,  C25D3/12 ,  C25D3/38 ,  C25D3/46 ,  C25D3/64 ,  C25D5/022 ,  C25D5/10 ,  C25D5/12 ,  C25D5/34 ,  C25D5/36 ,  C25D5/44 ,  C25D5/48 ,  C25D5/50 ,  C25D7/08 ,  H01L33/486 ,  H01L2924/0002 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A lead frame for an optical semiconductor device, having a reflection layer at least on one side or each side of the outermost surface of a substrate, partially or entirely, in which the reflection layer has, on the outermost surface at least in a region where light emitted by an optical semiconductor element is reflected, a microstructure with at least the surface thereof having been mechanically deformed, which is converted from a plating microstructure formed of a metal or an alloy thereof; a method of producing the same, and an optical semiconductor device having the same.

Abstract translation: 一种用于光学半导体器件的引线框架，其中反射层至少在基板的最外表面的一侧或每一侧上部分或全部地被反射层，其中反射层在其最外表面上至少在 由光学半导体元件发出的光被反射，其至少表面的机械变形的微观结构由金属或其合金形成的电镀微结构转变; 其制造方法和具有该半导体器件的光半导体器件。