公开(公告)号：US3766440A

公开(公告)日：1973-10-16

申请号：US3766440D

申请日：1972-08-11

Applicant: GEN MOTORS CORP

Inventor： BAIRD D

IPC: H01L21/60 ,  H01L23/15 ,  H01L23/367 ,  H01L25/16 ,  H02B1/00

CPC classification number: H01L24/85 ,  H01L23/15 ,  H01L23/367 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/16 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An integrated circuit assembly which includes a ceramic substrate for thick film power circuits having a cermet circuit pattern and semiconductor dies on one generally flat face and a convector surface configuration on the opposite face.

Abstract translation: 一种集成电路组件，其包括用于厚膜电源电路的陶瓷衬底，其具有金属陶瓷电路图案，并且半导体裸片位于一个大体上平坦的表面上，并且在对面上具有对流表面构造。