Abstract:
An electrical machine includes a stator assembly having an annular core and a conductive winding. The annular core includes a central bore. The conductive winding includes one or more stator winding bars disposed circumferentially around the central bore. The one or more stator winding bars include a core conductor and an insulation layer surrounding the core conductor. An end segment of the one or more stator winding bars at a connection interface includes a stress control structure surrounding the insulation layer. The stress control structure includes a printed scaffold and a dielectric backfill material. The dielectric backfill material fills pores of the printed scaffold. The porous scaffold is composed of a stress control material that is different from the dielectric backfill material.
Abstract:
A method of processing a continuous sheet of polymer material. The method includes routing the continuous sheet of polymer material from a first spool and along at least a first heated roller and a second heated roller, heating the continuous sheet of polymer material to a first temperature on the first heated roller and the second heated roller, and controlling a rotational speed of the first heated roller and the second heated roller such that the continuous sheet of polymer material is stretched when routed from the second heated roller to the first heated roller.
Abstract:
A method includes forming one or more cores, wherein each of the one or more cores has a cross section corresponding to a conductor to be subsequently formed, forming an insulator around the one or more cores, removing the one or more cores to expose one or more recesses within the insulator, and forming one or more conductors in at least one of the one or more recesses of the insulator such that the cross sections of the one or more conductors conform to an interior surface of the one or more recesses in the insulator.
Abstract:
A method includes forming one or more cores, wherein each of the one or more cores has a cross section corresponding to a conductor to be subsequently formed, forming an insulator around the one or more cores, removing the one or more cores to expose one or more recesses within the insulator, and forming one or more conductors in at least one of the one or more recesses of the insulator such that the cross sections of the one or more conductors conform to an interior surface of the one or more recesses in the insulator.
Abstract:
A dielectric film that includes a sheet fabricated from a dielectric material. The sheet has a thickness of less than about 5 microns, wherein the dielectric material includes an amorphous polymer, and wherein the dielectric material is substantially free of a solvent.
Abstract:
A film capacitor is presented. The film capacitor includes a thermally conductive support. The thermally conductive support includes a core including a first end and a second end. The thermally conductive support further includes a protrusion extending from at least one of the first end and the second end of the core, where at least one of the core and the protrusion includes a phase change material. Further, the film capacitor also includes a plurality of films disposed on at least a portion of the thermally conductive support, where the plurality of films includes a plurality of electrode films and a dielectric film. Further, the thermally conductive support for the film capacitor and a method of forming the film capacitor are also presented.
Abstract:
A process for forming a capacitor is presented. The process includes providing a laminate including a dielectric layer disposed on a sacrificial substrate, forming a free-standing metallized dielectric layer and packaging the free-standing metallized dielectric layer to form a capacitor. The dielectric layer includes a polyetherimide. The step of forming the free-standing metallized dielectric layer is performed by: (a) disposing a metal layer on the dielectric layer to form a metalized laminate such that a metalized dielectric layer is formed on the sacrificial substrate, and removing the sacrificial substrate to form the free-standing metallized dielectric layer; or (b) removing the sacrificial substrate from the laminate to form a free-standing dielectric layer, and disposing a metal layer on the free-standing dielectric layer to form the free-standing metallized dielectric layer. A capacitor formed by the process is presented. A process for forming a capacitor by a roll-to-roll processing technique is also presented.
Abstract:
A method includes forming one or more cores, wherein each of the one or more cores has a cross section corresponding to a conductor to be subsequently formed, forming an insulator around the one or more cores, removing the one or more cores to expose one or more recesses within the insulator, and forming one or more conductors in at least one of the one or more recesses of the insulator such that the cross sections of the one or more conductors conform to an interior surface of the one or more recesses in the insulator.
Abstract:
A method includes forming one or more cores, wherein each of the one or more cores has a cross section corresponding to a conductor to be subsequently formed, forming an insulator around the one or more cores, removing the one or more cores to expose one or more recesses within the insulator, and forming one or more conductors in at least one of the one or more recesses of the insulator such that the cross sections of the one or more conductors conform to an interior surface of the one or more recesses in the insulator.
Abstract:
A method for forming a bi-axially stretched dielectric film having a thickness less than 5 microns is presented. The method includes stretching a dielectric material along a transverse direction to form the bi-axially stretched dielectric film having a thickness less than 5 microns. The dielectric material is heated using infrared radiation during at least a duration of the stretching step. The dielectric material includes a substantially amorphous polymer having a glass transition temperature greater than 140 degrees Celsius.