SYSTEM AND METHODS OF REMOVING A MULTI-LAYER COATING FROM A SUBSTRATE
    2.
    发明申请
    SYSTEM AND METHODS OF REMOVING A MULTI-LAYER COATING FROM A SUBSTRATE 有权
    从基板去除多层涂层的系统和方法

    公开(公告)号:US20150298288A1

    公开(公告)日:2015-10-22

    申请号:US14254052

    申请日:2014-04-16

    Abstract: A system for use in removing a multi-layer coating from a substrate is provided. The multi-layer coating includes a first coating applied to the substrate and a second coating applied over the first coating. The first coating is formed from a first material and the second coating is formed from a second material different from the first material. The system includes a grinding mechanism configured to remove the multi-layer coating from the substrate, and a controller coupled in communication with the grinding mechanism. The controller is configured to position the grinding mechanism against the multi-layer coating, initiate a first removal mode that directs the grinding mechanism to traverse across the substrate, monitor a variable operating parameter of the grinding mechanism during the first removal mode, and evaluate a value of the variable operating parameter against a predetermined threshold to determine whether the second coating has been removed from the substrate.

    Abstract translation: 提供了一种用于从基板去除多层涂层的系统。 多层涂层包括施加到基底的第一涂层和施加在第一涂层上的第二涂层。 第一涂层由第一材料形成,第二涂层由不同于第一材料的第二材料形成。 该系统包括被配置为从衬底去除多层涂层的研磨机构,以及与磨削机构连通的控制器。 所述控制器被配置成将所述研磨机构定位在所述多层涂层上,启动引导所述研磨机构穿过所述基板的第一移除模式,在所述第一移除模式期间监测所述研磨机构的可变操作参数,并评估 所述可变操作参数的值相对于预定阈值来确定所述第二涂层是否已经从所述基板移除。

    PRESSURE MASKING SYSTEMS AND METHODS FOR USING SAME IN TREATING TECHNIQUES
    3.
    发明申请
    PRESSURE MASKING SYSTEMS AND METHODS FOR USING SAME IN TREATING TECHNIQUES 审中-公开
    压力屏蔽系统及其在处理技术中的应用方法

    公开(公告)号:US20140251951A1

    公开(公告)日:2014-09-11

    申请号:US13792620

    申请日:2013-03-11

    Abstract: Systems and methods of treating, e.g., stripping and coating, a target surface of an article including a passageway are disclosed. The systems may fluidly connect a pressure masker including pressurized masking fluid to a first side of the passageway, passing the pressurized masking fluid through the passageway from the first side to a second side including the target surface, and, submerging at least a portion of the target surface in a treatment bath, wherein the pressurized masking fluid passing through the passageway prevents the treatment bath from entering the passageway.

    Abstract translation: 公开了处理,例如剥离和涂覆包括通道的制品的靶表面的系统和方法。 系统可以将包括加压掩模流体的压力掩蔽器流体连接到通道的第一侧,使加压的掩蔽流体从第一侧通过通道到包括目标表面的第二侧,并且将至少一部分 处理浴中的目标表面,其中通过通道的加压掩蔽流体防止治疗浴进入通道。

    System and methods of removing a multi-layer coating from a substrate
    5.
    发明授权
    System and methods of removing a multi-layer coating from a substrate 有权
    从基底去除多层涂层的系统和方法

    公开(公告)号:US09358663B2

    公开(公告)日:2016-06-07

    申请号:US14254052

    申请日:2014-04-16

    Abstract: A system for use in removing a multi-layer coating from a substrate is provided. The multi-layer coating includes a first coating applied to the substrate and a second coating applied over the first coating. The first coating is formed from a first material and the second coating is formed from a second material different from the first material. The system includes a grinding mechanism configured to remove the multi-layer coating from the substrate, and a controller coupled in communication with the grinding mechanism. The controller is configured to position the grinding mechanism against the multi-layer coating, initiate a first removal mode that directs the grinding mechanism to traverse across the substrate, monitor a variable operating parameter of the grinding mechanism during the first removal mode, and evaluate a value of the variable operating parameter against a predetermined threshold to determine whether the second coating has been removed from the substrate.

    Abstract translation: 提供了一种用于从基板去除多层涂层的系统。 多层涂层包括施加到基底的第一涂层和施加在第一涂层上的第二涂层。 第一涂层由第一材料形成,第二涂层由不同于第一材料的第二材料形成。 该系统包括被配置为从衬底去除多层涂层的研磨机构,以及与磨削机构连通的控制器。 所述控制器被配置成将所述研磨机构定位在所述多层涂层上,启动引导所述研磨机构穿过所述基板的第一移除模式,在所述第一移除模式期间监测所述研磨机构的可变操作参数,并评估 所述可变操作参数的值相对于预定阈值来确定所述第二涂层是否已经从所述基板移除。

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