公开(公告)号：US20180231957A1

公开(公告)日：2018-08-16

申请号：US15951547

申请日：2018-04-12

Applicant: GLOBALFOUNDRIES INC.

Inventor： Cyril CABRAL, JR. ,  Lawrence A. CLEVENGER ,  John M. COHN ,  Jeffrey P. GAMBINO ,  William J. MURPHY ,  Anthony J. TELENSKY

IPC: G05B19/418 ,  H01L21/67

CPC classification number: H01L21/67253 ,  C23C14/546 ,  G01B7/066 ,  G03F7/70916 ,  G03F7/70925 ,  G05B19/418 ,  G05B2219/2602

Abstract: Systems and methods are provided for implementing a crystal oscillator to monitor and control semiconductor fabrication processes. More specifically, a method is provided for that includes performing at least one semiconductor fabrication process on a material of an integrated circuit (IC) disposed within a processing chamber. The method further includes monitoring by at least one electronic oscillator disposed within the processing chamber for the presence or absence of a predetermined substance generated by the at least one semiconductor fabrication process. The method further includes controlling the at least one semiconductor fabrication process based on the presence or absence of the predetermined substance detected by the at least one electronic oscillator.

公开(公告)号：US20190121022A1

公开(公告)日：2019-04-25

申请号：US16216321

申请日：2018-12-11

Applicant: GLOBALFOUNDRIES INC.

Inventor： John J. ELLIS-MONAGHAN ,  Jeffrey P. GAMBINO ,  Mark D. JAFFE ,  Kirk D. PETERSON ,  Jed H. RANKIN

IPC: G02B6/122 ,  G02B6/136 ,  G02B6/125

Abstract: Methods and structures for shielding optical waveguides are provided. A method includes forming a first optical waveguide core and forming a second optical waveguide core adjacent to the first optical waveguide core. The method also includes forming an insulator layer over the first optical waveguide core and the second optical waveguide core. The method further includes forming a shielding structure in the insulator layer between the first optical waveguide core and the second optical waveguide core.

公开(公告)号：US20180164508A1

公开(公告)日：2018-06-14

申请号：US15874210

申请日：2018-01-18

Applicant: GLOBALFOUNDRIES INC.

Inventor： Jeffrey P. GAMBINO ,  Wolfgang SAUTER ,  Christopher D. MUZZY ,  Charles L. ARVIN ,  Robert LEIDY

IPC: G02B6/34 ,  G02B6/13 ,  G02B6/30 ,  G02B6/124

CPC classification number: G02B6/34 ,  G02B6/124 ,  G02B6/13 ,  G02B6/30

Abstract: The present disclosure relates to semiconductor structures and, more particularly, to photonics chips and methods of manufacture. A structure includes: a photonics chip having a grated optical coupler; an interposer attached to the photonics chip, the interposer having a grated optical coupler; an optical epoxy material provided between the grated optical coupler of the photonics chip and the grated optical coupler of the interposer; and epoxy underfill material provided at interstitial regions between the photonics chip and the interposer which lie outside of an area of the grated optical couplers of the photonics chip and the interposer.