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公开(公告)号：US20170315443A1
公开(公告)日：2017-11-02
申请号：US15531719
申请日：2014-12-10
Applicant: GOO CHEMICAL CO., LTD.
Inventor： Nobuhito Hamada , Yoshio Sakai , Michiya Higuchi , Tokuzan Miyake
IPC: G03F7/029 , G03F7/038 , G03F7/039 , G03F7/032 , G03F7/32 , G03F7/20 , H05K1/03 , H05K3/28 , G03F7/16 , G03F7/40
CPC classification number: G03F7/029 , G03F7/004 , G03F7/031 , G03F7/032 , G03F7/033 , G03F7/0388 , G03F7/039 , G03F7/161 , G03F7/168 , G03F7/2004 , G03F7/322 , G03F7/40 , H05K1/0373 , H05K3/28
Abstract: A liquid solder resist composition contains: a carboxyl group-containing resin; a photopolymerizable compound which contains one or more kinds of compounds selected from a group consisting of a photopolymerizable monomer and a photopolymerizable prepolymer; a photopolymerization initiator; an epoxy compound; and titanium dioxide. The carboxyl group-containing resin is obtained by polymerization of a monomer composition which contains: a carboxyl group-containing monomer represented by following formula (1); and a maleimide compound represented by following formula (2). The carboxyl group-containing resin does not contain a photopolymerizable functional group. In the formula (1), X represents Ra—COO.
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公开(公告)号：US20180210336A1
公开(公告)日：2018-07-26
申请号：US15329573
申请日：2014-12-10
Applicant: GOO CHEMICAL CO., LTD.
Inventor： Yoshio Sakai , Michiya Higuchi , Nobuhito Hamada , Tokuzan Miyake
CPC classification number: G03F7/0043 , G03F7/004 , G03F7/029 , G03F7/031 , G03F7/033 , G03F7/038 , H05K3/28 , H05K2203/0562
Abstract: A liquid solder resist composition contains a carboxyl group-containing resin, a photopolymerizable compound containing at least one compound selected from a group consisting of a photopolymerizable monomer and a photopolymerizable prepolymer, a photopolymerization initiator, a titanium dioxide, and a compound having a cyclic ether skeleton. The titanium dioxide contains both of a rutile titanium dioxide manufactured by a sulfuric acid method and a rutile titanium dioxide manufactured by a chlorine method.
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公开(公告)号：US09835944B2
公开(公告)日：2017-12-05
申请号：US14651193
申请日：2014-12-10
Applicant: GOO CHEMICAL CO., LTD.
Inventor： Yoshio Sakai , Nobuhito Hamada , Michiya Higuchi , Tokuzan Miyake
CPC classification number: G03F7/031 , G03F7/0042 , G03F7/0043 , G03F7/029 , G03F7/038 , G03F7/0385 , G03F7/0388 , G03F7/20 , G03F7/2006 , G03F7/26 , G03F7/322 , H05K1/02 , H05K1/0274 , H05K1/0353 , H05K3/282 , H05K3/287 , H05K3/3452 , H05K2201/0166 , H05K2201/068
Abstract: A liquid solder resist composition contains a carboxyl group-containing resin, a photopolymerizable compound containing at least one compound selected from a group consisting of a photopolymerizable monomer and a photopolymerizable prepolymer, a photopolymerization initiator, and a titanium dioxide. The photopolymerization initiator contains a bisacylphosphine oxide-based photopolymerization initiator, a first α-hydroxyalkyl phenone-based photopolymerization initiator that is a liquid at 25° C., and a second α-hydroxyalkyl phenone-based photopolymerization initiator that is a solid at 25° C.
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公开(公告)号：US10317796B2
公开(公告)日：2019-06-11
申请号：US15531461
申请日：2014-12-10
Applicant: GOO CHEMICAL CO., LTD.
Inventor： Michiya Higuchi , Yoshio Sakai , Nobuhito Hamada , Tokuzan Miyake
IPC: G03F7/004 , G03F7/029 , G03F7/027 , G03F7/031 , G03F7/16 , G03F7/085 , H05K3/28 , G03F7/028 , G03F7/20 , G03F7/32 , G03F7/40 , G03F7/038 , H05K1/03
Abstract: A solder resist composition includes: a carboxyl group-containing resin; a photopolymerizable compound; a photopolymerization initiator containing a bisacylphosphine oxide-based photopolymerization initiator and an α-hydroxy alkylphenone-based photopolymerization initiator; and a fluorescent dye. The bisacylphosphine oxide-based photopolymerization initiator contains bis-(2,4,6-trimethylbenzoyl)-phenylphosphine oxide. The α-hydroxy alkylphenone-based photopolymerization initiator contains 2-hydroxy-2-methyl-1-phenyl-propane-1-one. A mass ratio of the bis-(2,4,6-trimethylbenzoyl)-phenylphosphine oxide to the 2-hydroxy-2-methyl-1-phenyl-propane-1-one is 2:1 to 1:10.
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Patent Agency Ranking
公开(公告)号：US20180059544A1
公开(公告)日：2018-03-01
申请号：US15805756
申请日：2017-11-07
Applicant: GOO CHEMICAL CO., LTD.
Inventor： Yoshio Sakai , Nobuhito Hamada , Michiya Higuchi , Tokuzan Miyake
Abstract: A liquid solder resist composition contains a carboxyl group-containing resin, a photopolymerizable compound containing at least one compound selected from a group consisting of a photopolymerizable monomer and a photopolymerizable prepolymer, a photopolymerization initiator, and a titanium dioxide. The photopolymerization initiator contains a bisacylphosphine oxide-based photopolymerization initiator, a first α-hydroxyalkyl phenone-based photopolymerization initiator that is a liquid at 25° C., and a second α-hydroxyalkyl phenone-based photopolymerization initiator that is a solid at 25° C.
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公开(公告)号：US20160342085A1
公开(公告)日：2016-11-24
申请号：US14651193
申请日：2014-12-10
Applicant: GOO CHEMICAL CO., LTD.
Inventor： Yoshio Sakai , Nobuhito Hamada , Michiya Higuchi , Tokuzan Miyake
CPC classification number: G03F7/031 , G03F7/0042 , G03F7/0043 , G03F7/029 , G03F7/038 , G03F7/0385 , G03F7/0388 , G03F7/20 , G03F7/2006 , G03F7/26 , G03F7/322 , H05K1/02 , H05K1/0274 , H05K1/0353 , H05K3/282 , H05K3/287 , H05K3/3452 , H05K2201/0166 , H05K2201/068
Abstract: A liquid solder resist composition contains a carboxyl group-containing resin, a photopolymerizable compound containing at least one compound selected from a group consisting of a photopolymerizable monomer and a photopolymerizable prepolymer, a photopolymerization initiator, and a titanium dioxide. The photopolymerization initiator contains a bisacylphosphine oxide-based photopolymerization initiator, a first α-hydroxyalkyl phenone-based photopolymerization initiator that is a liquid at 25° C., and a second α-hydroxyalkyl phenone-based photopolymerization initiator that is a solid at 25° C.
Abstract translation: 液体阻焊剂组合物含有含羧基的树脂，含有选自光聚合性单体和光聚合性预聚物，光聚合引发剂和二氧化钛中的至少一种化合物的光聚合性化合物。 光聚合引发剂含有双酰基氧化膦类光聚合引发剂，25℃下为液体的第一α-羟烷基苯酮系光聚合引发剂和25℃固体的第二α-羟烷基苯酮系光聚合引发剂 C。
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公开(公告)号：US10527937B2
公开(公告)日：2020-01-07
申请号：US15805756
申请日：2017-11-07
Applicant: GOO CHEMICAL CO., LTD.
Inventor： Yoshio Sakai , Nobuhito Hamada , Michiya Higuchi , Tokuzan Miyake
IPC: G03F7/031 , G03F7/038 , G03F7/20 , G03F7/004 , G03F7/029 , G03F7/32 , H05K3/28 , H05K1/02 , G03F7/26 , H05K1/03
Abstract: A liquid solder resist composition contains a carboxyl group-containing resin, a photopolymerizable compound containing at least one compound selected from a group consisting of a photopolymerizable monomer and a photopolymerizable prepolymer, a photopolymerization initiator, and a titanium dioxide. The photopolymerization initiator contains a bisacylphosphine oxide-based photopolymerization initiator, a first α-hydroxyalkyl phenone-based photopolymerization initiator that is a liquid at 25° C., and a second α-hydroxyalkyl phenone-based photopolymerization initiator that is a solid at 25° C.
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公开(公告)号：US10234758B2
公开(公告)日：2019-03-19
申请号：US15329573
申请日：2014-12-10
Applicant: GOO CHEMICAL CO., LTD.
Inventor： Yoshio Sakai , Michiya Higuchi , Nobuhito Hamada , Tokuzan Miyake
Abstract: A liquid solder resist composition contains a carboxyl group-containing resin, a photopolymerizable compound containing at least one compound selected from a group consisting of a photopolymerizable monomer and a photopolymerizable prepolymer, a photopolymerization initiator, a titanium dioxide, and a compound having a cyclic ether skeleton. The titanium dioxide contains both of a rutile titanium dioxide manufactured by a sulfuric acid method and a rutile titanium dioxide manufactured by a chlorine method.
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公开(公告)号：US20170269477A1
公开(公告)日：2017-09-21
申请号：US15531461
申请日：2014-12-10
Applicant: GOO CHEMICAL CO., LTD.
Inventor： Michiya Higuchi , Yoshio Sakai , Nobuhito Hamada , Tokuzan Miyake
IPC: G03F7/029 , G03F7/16 , G03F7/20 , H05K3/28 , G03F7/40 , G03F7/031 , H05K1/03 , G03F7/038 , G03F7/32
CPC classification number: G03F7/029 , G03F7/004 , G03F7/031 , G03F7/038 , G03F7/16 , G03F7/168 , G03F7/2004 , G03F7/322 , G03F7/40 , H05K1/0353 , H05K3/285 , H05K2201/2081
Abstract: A solder resist composition includes: a carboxyl group-containing resin; a photopolymerizable compound; a photopolymerization initiator containing a bisacylphosphine oxide-based photopolymerization initiator and an α-hydroxy alkylphenone-based photopolymerization initiator; and a phosphorescent dye. The bisacylphosphine oxide-based photopolymerization initiator contains bis-(2,4,6-trimethylbenzoyl)-phenylphosphine oxide. The α-hydroxy alkylphenone-based photopolymerization initiator contains 2-hydroxy-2-methyl-1-phenyl-propane-1-one. A mass ratio of the bis-(2,4,6-trimethylbenzoyl)-phenylphosphine oxide to the 2-hydroxy-2-methyl-1-phenyl-propane-1-one is 2:1 to 1:10.
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