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公开(公告)号：US20180041742A1
公开(公告)日：2018-02-08
申请号：US15439882
申请日：2017-02-22
Applicant: Google Inc.
Inventor： Philip Sean Stetson
CPC classification number: H04N9/43 , G06T5/50 , G06T11/001 , G06T2207/10024 , H04N1/40012 , H04N1/465 , H04N5/2258 , H04N5/23232 , H04N5/332 , H04N9/045 , H04N9/07
Abstract: This document describes techniques and apparatuses for implementing monochrome-color mapping using a monochromatic imager and a color map sensor. These techniques and apparatuses enable better resolution, depth of color, or low-light sensitivity than many conventional sensor arrays.
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公开(公告)号：US09332201B2
公开(公告)日：2016-05-03
申请号：US14283067
申请日：2014-05-20
Applicant: Google Inc.
Inventor： Roman Lewkow , Philip Sean Stetson
CPC classification number: H04N5/374 , H04N5/225 , H04N5/2253 , H04N5/369
Abstract: This document describes curved image sensors capable of sensing light from a monocentric lens. This curved image sensor receives light focused at a curved focal surface and then provides electric signals from this curved image sensor to a planar computing chip, such as a CMOS chip. By so doing, the higher image quality, smaller size, and often smaller weight of monocentric lenses can be gained while using generally high-quality, low-cost planar chips.
Abstract translation: 本文件描述了能够感测来自单中心透镜的光的弯曲图像传感器。 该弯曲图像传感器接收聚焦在弯曲焦面上的光，然后将该弯曲图像传感器的电信号提供给诸如CMOS芯片的平面计算芯片。 通过这样做，可以获得更高的图像质量，更小的尺寸和通常更小的单中心透镜的重量，同时使用通常高质量，低成本的平面芯片。
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公开(公告)号：US20150341578A1
公开(公告)日：2015-11-26
申请号：US14283067
申请日：2014-05-20
Applicant: Google Inc.
Inventor： Roman Lewkow , Philip Sean Stetson
CPC classification number: H04N5/374 , H04N5/225 , H04N5/2253 , H04N5/369
Abstract: This document describes curved image sensors capable of sensing light from a monocentric lens. This curved image sensor receives light focused at a curved focal surface and then provides electric signals from this curved image sensor to a planar computing chip, such as a CMOS chip. By so doing, the higher image quality, smaller size, and often smaller weight of monocentric lenses can be gained while using generally high-quality, low-cost planar chips.
Abstract translation: 本文件描述了能够感测来自单中心透镜的光的弯曲图像传感器。 该弯曲图像传感器接收聚焦在弯曲焦面上的光，然后将该弯曲图像传感器的电信号提供给诸如CMOS芯片的平面计算芯片。 通过这样做，可以获得更高的图像质量，更小的尺寸和通常更小的单中心透镜的重量，同时使用通常高质量，低成本的平面芯片。
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公开(公告)号：US09560298B2
公开(公告)日：2017-01-31
申请号：US15142393
申请日：2016-04-29
Applicant: Google Inc.
Inventor： Roman Lewkow , Philip Sean Stetson
CPC classification number: H04N5/374 , H04N5/225 , H04N5/2253 , H04N5/369
Abstract: This document describes curved image sensors capable of sensing light from a monocentric lens. This curved image sensor receives light focused at a curved focal surface and then provides electric signals from this curved image sensor to a planar computing chip, such as a CMOS chip. By so doing, the higher image quality, smaller size, and often smaller weight of monocentric lenses can be gained while using generally high-quality, low-cost planar chips.
Abstract translation: 本文件描述了能够感测来自单中心透镜的光的弯曲图像传感器。 该弯曲图像传感器接收聚焦在弯曲焦面上的光，然后将该弯曲图像传感器的电信号提供给诸如CMOS芯片的平面计算芯片。 通过这样做，可以获得更高的图像质量，更小的尺寸和通常更小的单中心透镜的重量，同时使用通常高质量，低成本的平面芯片。
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公开(公告)号：US09560178B1
公开(公告)日：2017-01-31
申请号：US14724265
申请日：2015-05-28
Applicant: GOOGLE INC.
Inventor： Philip Sean Stetson , Roman Lewkow , Kevin D. Brune
IPC: H04M1/02
CPC classification number: G06F1/1626 , G06F1/1656 , G06F1/1686 , G06F1/1688 , H04M1/0254 , H04M1/026 , H04M1/0264 , H04M1/03
Abstract: Embodiments are provided for a support housing for an electronic device configured to removably secure a set of hardware modules. According to certain aspects, the support housing may be defined by a set of front slots, a set of rear slots, and a center plate. The support housing may include an opening that extends through the center plate from one of the front slots to one of the rear slots. When a front module is secured to the front slot and a rear module is secured to the rear slot, the opening in the center plate enables the front module to physically interface with the rear module.
Abstract translation: 提供了用于电子设备的支撑壳体的实施例，其被配置为可移除地固定一组硬件模块。 根据某些方面，支撑壳体可以由一组前槽，一组后槽和中心板限定。 支撑壳体可以包括从其中一个前槽延伸穿过中心板到一个后槽的开口。 当前模块固定在前槽上，后模块固定在后槽时，中间板上的开口使前模块与后模块物理连接。
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Patent Agency Ranking
公开(公告)号：US20150022643A1
公开(公告)日：2015-01-22
申请号：US14335841
申请日：2014-07-18
Applicant: Google Inc.
Inventor： Philip Sean Stetson , Mark A. Neifeld , Yuriy Musatenko
CPC classification number: H04N9/09 , H01L27/14627 , H04N5/2254 , H04N5/33 , H04N5/3696 , H04N13/243
Abstract: This document describes techniques and apparatuses for implementing an asymmetric sensor array for capturing images. These techniques and apparatuses enable better resolution, depth of color, or low-light sensitivity than many conventional sensor arrays.
Abstract translation: 本文档描述了用于实现用于捕获图像的非对称传感器阵列的技术和装置。 与许多常规传感器阵列相比，这些技术和装置能够实现更好的分辨率，较深的颜色或低光的灵敏度。
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公开(公告)号：US20150334300A1
公开(公告)日：2015-11-19
申请号：US14314613
申请日：2014-06-25
Applicant: Google Inc.
Inventor： Kaigham Jacob Gabriel , Philip Sean Stetson
CPC classification number: G02B9/02 , G02B2207/101 , H04N5/2253 , H04N5/2254 , H04N5/23238 , H04N5/247 , H04N5/335 , H04N5/369 , H04N5/3742
Abstract: This document describes MEMS-released curved image sensors capable of sensing light from a monocentric lens. This MEMS-released curved image sensor receives light focused on a curved focal surface by releasing a photodetector side of a computing and sensing wafer, such as a Complementary Metal-Oxide Semiconductor (CMOS) sensor. This releasing is effective to allow the photodetector side to conform to the curved focal surface of the monocentric lens. By so doing, the wider field of view, smaller size, and often smaller weight of monocentric lenses can be gained while using generally high-quality, low-cost computing and sensing wafers by processing these wafers to give them a curved surface at which to sense light from a monocentric lens.
Abstract translation: 该文件描述了能够感测来自单中心透镜的光的MEMS释放的弯曲图像传感器。 该MEMS释放的弯曲图像传感器通过释放诸如互补金属氧化物半导体（CMOS）传感器的计算和感测晶片的光电检测器侧来接收聚焦在弯曲焦点表面上的光。 这种释放对于允许光电检测器侧符合单中心透镜的弯曲焦点表面是有效的。 通过这样做，可以通过处理这些晶片来获得更广泛的视野，更小的尺寸和更小的单中心透镜重量，同时通常通过高质量，低成本的计算和感测晶片来获得弯曲表面， 感测来自单中心透镜的光。
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公开(公告)号：US10341628B2
公开(公告)日：2019-07-02
申请号：US15439882
申请日：2017-02-22
Applicant: Google Inc.
Inventor： Philip Sean Stetson
IPC: H04N9/43 , H04N9/04 , H04N9/07 , G06T5/50 , G06T11/00 , H04N1/46 , H04N5/225 , H04N5/232 , H04N5/33 , H04N1/40
Abstract: This document describes techniques and apparatuses for implementing monochrome-color mapping using a monochromatic imager and a color map sensor. These techniques and apparatuses enable better resolution, depth of color, or low-light sensitivity than many conventional sensor arrays.
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公开(公告)号：US09961246B2
公开(公告)日：2018-05-01
申请号：US15175318
申请日：2016-06-07
Applicant: Google Inc.
Inventor： Philip Sean Stetson , Guangxun Liao
CPC classification number: H04N5/2254 , H04N5/2257 , H04N5/2258 , H04N5/23212 , H04N5/247 , H04N5/332
Abstract: Techniques and apparatuses are described that enable non-canting VCM-actuated autofocus. These techniques and apparatuses enable multiple focal distances that are substantially free of imaging errors caused by canting of a lens housing. These multiple focal distances are provided by multiple positions of a lens housing relative to an image sensor. These positions can be free of cant through use of mechanical stops and corresponding mechanical stop-mates. By so doing, lower cost, faster focusing, higher image quality, lower power, or lower settling time can be achieved.
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公开(公告)号：US09551856B2
公开(公告)日：2017-01-24
申请号：US14314613
申请日：2014-06-25
Applicant: Google Inc.
Inventor： Kaigham Jacob Gabriel , Philip Sean Stetson
CPC classification number: G02B9/02 , G02B2207/101 , H04N5/2253 , H04N5/2254 , H04N5/23238 , H04N5/247 , H04N5/335 , H04N5/369 , H04N5/3742
Abstract: This document describes MEMS-released curved image sensors capable of sensing light from a monocentric lens. This MEMS-released curved image sensor receives light focused on a curved focal surface by releasing a photodetector side of a computing and sensing wafer, such as a Complementary Metal-Oxide Semiconductor (CMOS) sensor. This releasing is effective to allow the photodetector side to conform to the curved focal surface of the monocentric lens. By so doing, the wider field of view, smaller size, and often smaller weight of monocentric lenses can be gained while using generally high-quality, low-cost computing and sensing wafers by processing these wafers to give them a curved surface at which to sense light from a monocentric lens.
Abstract translation: 该文件描述了能够感测来自单中心透镜的光的MEMS释放的弯曲图像传感器。 该MEMS释放的弯曲图像传感器通过释放诸如互补金属氧化物半导体（CMOS）传感器的计算和感测晶片的光电检测器侧来接收聚焦在弯曲焦点表面上的光。 这种释放对于允许光电检测器侧符合单中心透镜的弯曲焦点表面是有效的。 通过这样做，可以通过处理这些晶片来获得更广泛的视野，更小的尺寸和更小的单中心透镜重量，同时通常通过高质量，低成本的计算和感测晶片来获得弯曲表面， 感测来自单中心透镜的光。
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