摘要:
Systems and methods that reduce the overall cost of producing a silicon ingot are provided herein. More specifically, one or more surface pieces may be sliced from a silicon boule in relation to a plurality of nodes at a particular orientation. These one or more surface pieces may then be formed into one or more seeds having a specific length, width and thickness usable in a silicon ingot growth process. By utilizing these pieces to form one or more seeds, pieces of a boule which would have been previously discarded may now be used to form high quality seeds for use in a silicon ingot grow process.
摘要:
An electronic device comprising a cover plate is disclosed. The cover plate comprises one or more thin sapphire layers having a thickness of from about 50 microns to about 500 microns. Also disclosed are methods for preparing these thin sapphire layers.
摘要:
An electronic device comprising a cover plate is disclosed. The cover plate comprises one or more thin sapphire layers having a thickness of from about 50 microns to about 500 microns. Also disclosed are methods for preparing these thin sapphire layers.