Abstract:
A MOS transistor includes a substrate, source/drain regions formed at portions of the substrate, and a channel region formed between the source/drain regions. The MOS transistor further includes a gate structure having a gate insulation layer pattern and a gate electrode formed on the channel region. The gate electrode includes a first gate conductive layer pattern and a second gate conductive layer pattern. The first gate conductive layer pattern has a nitrogen concentration gradient gradually increasing from a lower portion of the first gate conductive layer pattern to an upper portion of the first gate conductive layer pattern. The second gate conductive layer pattern includes a material having a resistance substantially lower than a resistance of the first gate conductive layer pattern.
Abstract:
A semiconductor device includes a substrate including an NMOS region, a fin active region protruding from the substrate in the NMOS region, the fin active region including an upper surface and a sidewall, a gate dielectric layer on the upper surface and the sidewall of the fin active region, a first metal gate electrode on the gate dielectric layer, the first metal gate electrode having a first thickness at the upper surface of the fin active region and a second thickness at the sidewall of the fin active region, and a second metal gate electrode on the first metal gate electrode, the second metal gate electrode having a third thickness at the upper surface of the fin active region and a fourth thickness at the sidewall of the fin active region, wherein the third thickness is less than the fourth thickness.
Abstract:
A semiconductor device includes a first source/drain region and a second source/drain region disposed in an active region of a semiconductor substrate, and a gate structure crossing the active region and disposed between the first and second source/drain regions, the gate structure including a gate electrode having a first part and a second part on the first part, the gate electrode being at a lower level than an upper surface of the active region, an insulating capping pattern on the gate electrode, a gate dielectric between the gate electrode and the active region, and an empty space between the active region and the second part of the gate electrode.