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公开(公告)号：US5149958A
公开(公告)日：1992-09-22
申请号：US626663
申请日：1990-12-12
IPC分类号： H01L21/60 , H01L31/02 , H01L31/0203 , H01L31/0232 , H01L33/54 , H01L33/58 , H01L33/62
CPC分类号： H01L33/62 , H01L24/81 , H01L31/0203 , H01L31/0232 , H01L33/54 , H01L2224/16 , H01L2224/81801 , H01L2924/01013 , H01L2924/01082 , H01L2924/07802 , H01L33/58
摘要： An optoelectronic device component package comprises an optical element having a plano surface with a pattern of electrical conductors thereon, a photoelectric die having an optically active portion and die bond pads, and a printed circuit board having a pattern of electrical conductors thereon and further having an aperture for receiving the die. The die is attached to the plano surface of the optical element such that the die bond pads are electrically connected to corresponding electrical conductors of the optical elements. The circuit board is attached to the plano surface of the optical element and the electrical conductors of the circuit board are electrically connected to corresponding conductors of the optical element. A protective means affixed to the die, the plano surface of the optical element, and a portion of the circuit board protects the device package. The die can be (1) an emitter or detector die for camera autofocus applications; or (2) a photometer die for exposure control applications.
摘要翻译： 光电器件部件封装包括具有平面表面的光学元件，其上具有导电图案，具有光学活性部分的光电管芯和管芯接合焊盘，以及印刷电路板，其上具有导电图案，并且还具有 用于接收模具的孔。 模具附接到光学元件的平面表面，使得管芯接合焊盘电连接到光学元件的对应电导体。 电路板安装在光学元件的平面上，电路板的电导体与光学元件的相应导体电连接。 固定在模具上的保护装置，光学元件的平面表面和电路板的一部分保护装置封装。 模具可以是（1）用于相机自动对焦应用的发射器或检测器模具; 或（2）用于曝光控制应用的光度计模具。
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公开(公告)号：USRE35069E
公开(公告)日：1995-10-24
申请号：US260574
申请日：1994-06-16
IPC分类号： H01L21/60 , H01L31/02 , H01L31/0203 , H01L31/0232 , H01L33/54 , H01L33/58 , H01L33/62 , H01J3/14 , H01L27/14
CPC分类号： H01L33/62 , H01L24/81 , H01L31/0203 , H01L31/0232 , H01L33/54 , H01L2224/16 , H01L2224/81801 , H01L2924/01013 , H01L2924/01082 , H01L2924/07802 , H01L33/58
摘要： An optoelectronic device component package comprises an optical element having a plano surface with a pattern of electrical conductors thereon, a photoelectric die having an optically active portion and die bond pads, and a printed circuit board having a pattern of electrical conductors thereon and further having an aperture for receiving the die. The die is attached to the plano surface of the optical element such that the die bond pads are electrically connected to corresponding electrical conductors of the optical elements. The circuit board is attached to the plano surface of the optical element and the electrical conductors of the circuit board are electrically connected to corresponding conductors of the optical element. A protective means affixed to the die, the plano surface of the optical element, and a portion of the circuit board protects the device package. The die can be (1) an emitter or detector die for camera autofocus applications; or (2) a photometer die for exposure control applications.
摘要翻译： 光电器件部件封装包括具有平面表面的光学元件，其上具有导电图案，具有光学活性部分的光电管芯和管芯接合焊盘，以及印刷电路板，其上具有导电图案，并且还具有 用于接收模具的孔。 模具附接到光学元件的平面表面，使得管芯接合焊盘电连接到光学元件的对应电导体。 电路板安装在光学元件的平面上，电路板的电导体与光学元件的相应导体电连接。 固定在模具上的保护装置，光学元件的平面表面和电路板的一部分保护装置封装。 模具可以是（1）用于相机自动对焦应用的发射器或检测器模具; 或（2）用于曝光控制应用的光度计模具。
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公开(公告)号：US5216805A
公开(公告)日：1993-06-08
申请号：US887618
申请日：1992-05-22
IPC分类号： H01L21/60 , H01L31/0203 , H01L31/0232 , H01L33/54 , H01L33/62
CPC分类号： H01L33/62 , H01L24/81 , H01L31/0203 , H01L31/0232 , H01L33/54 , H01L2224/16 , H01L2224/81801 , H01L2924/01013 , H01L2924/01082 , H01L2924/07802 , Y10T29/49144 , Y10T29/49146
摘要： An optoelectronic device component package comprises an optical element having a plano surface with a pattern of electrical conductors thereon, a photoelectric die having an optically active portion and die bond pads, and a printed circuit board having a pattern of electrical conductors thereon and further having an aperture for receiving the die. The die is attached to the plano surface of the optical element such that the die bond pads are electrically connected to corresponding electrical conductors of the optical element. The circuit board is attached to the plano surface of the optical element and the electrical conductors of the circuit board are electrically connected to corresponding conductors of the optical element. A protective means affixed to the die, the plano surface of the optical element, and a portion of the circuit board protects the device package. The die can be (1) an emitter or detector die for camera autofocus applications; or (2) a photometer die for exposure control applications.
摘要翻译： 光电器件部件封装包括具有平面表面的光学元件，其上具有导电图案，具有光学活性部分的光电管芯和管芯接合焊盘，以及印刷电路板，其上具有导电图案，并且还具有 用于接收模具的孔。 模具附接到光学元件的平面表面，使得管芯接合焊盘电连接到光学元件的对应的电导体。 电路板安装在光学元件的平面上，电路板的电导体与光学元件的相应导体电连接。 固定在模具上的保护装置，光学元件的平面表面和电路板的一部分保护装置封装。 模具可以是（1）用于相机自动对焦应用的发射器或检测器模具; 或（2）用于曝光控制应用的光度计模具。
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公开(公告)号：US07705908B2
公开(公告)日：2010-04-27
申请号：US10737454
申请日：2003-12-16
CPC分类号： H04N1/02409 , H04N1/2112 , H04N1/215 , H04N5/343 , H04N2101/00
摘要： Methods are provided for determining an operating parameter for an image system. Evaluation images are obtained during composition of an archival image and the evaluation images are stored. The evaluation images are compared to determine common image elements and an area of importance is determined based at least in part upon some of the common image elements. An operating parameter is determined based upon analysis of the area of importance. Imaging systems that perform the methods are also provided.
摘要翻译： 提供了用于确定图像系统的操作参数的方法。 在归档图像的组合期间获得评估图像，并且存储评估图像。 将评估图像进行比较以确定共同的图像元素，并且至少部分地基于一些常见图像元素确定重要性区域。 基于对重要性区域的分析来确定操作参数。 还提供了执行方法的成像系统。
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