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公开(公告)号：US10784746B2
公开(公告)日：2020-09-22
申请号：US15624456
申请日：2017-06-15
Applicant: General Electric Company
Inventor： Karthik Kumar Bodla , Naveenan Thiagarajan , Patel Bhageerath Reddy , Yogen Vishwas Utturkar
Abstract: A method includes fabricating a core, wherein the core comprises a chemically soluble first polymer, forming a body around the core, wherein the body comprises a second polymer, and etching away the core to reveal a cooling channel extending through the body.
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公开(公告)号：US10277096B2
公开(公告)日：2019-04-30
申请号：US15070333
申请日：2016-03-15
Applicant: General Electric Company
Inventor： Karthik Kumar Bodla , Joo Han Kim , Yogen Vishwas Utturkar
IPC: H02K9/20
Abstract: A component for an electrical machine is disclosed. The component is a stator and/or a rotor. The component includes a core, a magnetic field-generating component, and an oscillating heat pipe assembly. The core includes a plurality of slots and the magnetic field-generating component is disposed in at least one slot of the plurality of slots. The oscillating heat pipe assembly is disposed in the core and the at least one slot of the plurality of slots. The oscillating heat pipe assembly is in contact with the core and the magnetic field-generating component. The oscillating heat pipe assembly includes a dielectric material, and where the oscillating heat pipe assembly has an in-plane thermal conductivity higher than a through-plane thermal conductivity.
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公开(公告)号：US09826662B2
公开(公告)日：2017-11-21
申请号：US14103868
申请日：2013-12-12
Applicant: General Electric Company
Inventor： Joo Han Kim , Graham Charles Kirk , Jay Todd Labhart , Binoy Milan Shah , Yogen Vishwas Utturkar , Pramod Charmarthy , Tao Deng
IPC: H05K7/20 , F28F21/08 , C09K5/06 , H01L23/427 , H05K1/02
CPC classification number: H05K7/20454 , C09K5/063 , F28F21/08 , H01L23/4275 , H01L2924/0002 , H05K1/0203 , H05K7/20672 , H01L2924/00
Abstract: A reusable phase-change thermal interface structure having a metal based foam and a fusible metal based alloy is provided. In a solid phase of the fusible metal based alloy the fusible metal based alloy is disposed at least in a portion of the metal based foam. Further, in a liquid phase of the fusible metal based alloy the fusible metal based alloy is disposed at least on a portion of one or more outer surfaces of the metal based foam.
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公开(公告)号：US09556889B2
公开(公告)日：2017-01-31
申请号：US14182098
申请日：2014-02-17
Applicant: General Electric Company
Inventor： Mehmet Arik , Stanton Earl Weaver , Charles Erklin Seeley , Yogen Vishwas Utturkar
IPC: B05B1/08 , F15D1/00 , F04B43/09 , H01L23/467
CPC classification number: F15D1/0095 , F04B43/095 , H01L23/467 , H01L2223/00 , H01L2924/0002 , H01L2924/00
Abstract: A synthetic jet includes a first backer structure, one and only one actuator, a wall member coupled to and positioned between the first backer structure and the one and only one actuator to form a cavity, and wherein the wall member has an orifice formed therethrough, and wherein the orifice fluidically couples the cavity to an environment external to the cavity.
Abstract translation: 合成射流包括第一支撑结构，仅一个致动器;壁构件，其联接到第一支撑结构和仅一个致动器之间并且位于第一支撑结构之间并形成空腔，并且其中壁构件具有通过其形成的孔， 并且其中所述孔口将所述空腔流体耦合到所述空腔外部的环境。
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公开(公告)号：US10966615B2
公开(公告)日：2021-04-06
申请号：US15163195
申请日：2016-05-24
Applicant: General Electric Company
Inventor： Karen Starr , Steven Falk , Yogen Vishwas Utturkar
Abstract: A method and apparatus includes an infant holding area, a display area, a heating system for warming the infant holding area, an environmental sensor, a physiological sensor, and a processor. The processor is configured to receive an environmental sensor input from the environmental sensor and a physiological sensor input from the physiological sensor. The processor is configured to determine a recommended skin temperature based on the environmental sensor input and the physiological sensor input. The processor is configured to display the recommended skin temperature on the display area.
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Patent Agency Ranking
公开(公告)号：US09668334B2
公开(公告)日：2017-05-30
申请号：US14285720
申请日：2014-05-23
Applicant: General Electric Company
Inventor： Gamal Refai-Ahmed , Hendrik Pieter Jacobus de Bock , Yogen Vishwas Utturkar , Christian M. Giovanniello
CPC classification number: H05K1/0203 , G06F1/203 , H05K7/20154 , H05K7/20163 , H05K7/20336 , H05K7/2039 , Y10T29/49126
Abstract: An electronic device includes an outer case defining an internal volume, a circuit board positioned within the internal volume and having a first surface and a second surface, one or more active components mounted on the first surface of the circuit board, and a thermal management system to provide cooling for the active components. The thermal management system includes a first heat spreader in thermal contact with an active component, a second heat spreader in thermal contact with the second surface of the circuit board, thermal carriers coupled to the first and second heat spreaders to remove thermal energy therefrom, and a heat exchanger coupled to the thermal carriers to receive thermal energy therefrom and dissipate the thermal energy, wherein one thermal carrier is routed between the first heat spreader and the heat exchanger and the other thermal carrier is routed between the second heat spreader and the heat exchanger.
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公开(公告)号：US20150342023A1
公开(公告)日：2015-11-26
申请号：US14285720
申请日：2014-05-23
Applicant: General Electric Company
Inventor： Gamal Refai-Ahmed , Hendrik Pieter Jacobus de Bock , Yogen Vishwas Utturkar , Christian M. Giovanniello
CPC classification number: H05K1/0203 , G06F1/203 , H05K7/20154 , H05K7/20163 , H05K7/20336 , H05K7/2039 , Y10T29/49126
Abstract: An electronic device includes an outer case defining an internal volume, a circuit board positioned within the internal volume and having a first surface and a second surface, one or more active components mounted on the first surface of the circuit board, and a thermal management system to provide cooling for the active components. The thermal management system includes a first heat spreader in thermal contact with an active component, a second heat spreader in thermal contact with the second surface of the circuit board, thermal carriers coupled to the first and second heat spreaders to remove thermal energy therefrom, and a heat exchanger coupled to the thermal carriers to receive thermal energy therefrom and dissipate the thermal energy, wherein one thermal carrier is routed between the first heat spreader and the heat exchanger and the other thermal carrier is routed between the second heat spreader and the heat exchanger.
Abstract translation: 电子设备包括限定内部体积的外壳，位于内部容积内的电路板，具有第一表面和第二表面，安装在电路板的第一表面上的一个或多个主动元件，以及热管理系统 以为活性组分提供冷却。 热管理系统包括与活性组件热接触的第一散热器，与电路板的第二表面热接触的第二散热器，耦合到第一和第二散热器的热载体以从其中去除热能，以及 热交换器，其耦合到热载体以从其接收热能并消散热能，其中一个热载体在第一散热器和热交换器之间布线，另一个热载体在第二散热器和热交换器之间 。
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公开(公告)号：US20140360713A1
公开(公告)日：2014-12-11
申请号：US14468558
申请日：2014-08-26
Applicant: General Electric Company
Inventor： Mehmet Arik , Stanton Earl Weaver , Thomas Elliot Stecher , Charles Erklin Seeley , Glenn Howard Kuenzler , Charles Franklin Wolfe, JR. , Yogen Vishwas Utturkar , Rajdeep Sharma , Satish Prabhakaran , Tunc Icoz
CPC classification number: H05B33/0803 , F21K9/23 , F21K9/232 , F21K9/238 , F21V23/006 , F21V29/02 , F21V29/63 , F21V29/74 , F21V29/763 , F21V29/83 , F21Y2101/00 , F21Y2105/10 , F21Y2115/10 , F28F3/02 , H01L2924/0002 , H01L2924/00
Abstract: Lighting systems having unique configurations are provided. For instance, the lighting system may include a light source, a thermal management system and driver electronics, each contained within a housing structure. The light source is configured to provide illumination visible through an opening in the housing structure. The thermal management system is configured to provide an air flow, such as a unidirectional air flow, through the housing structure in order to cool the light source. The driver electronics are configured to provide power to each of the light source and the thermal management system.
Abstract translation: 提供具有独特配置的照明系统。 例如，照明系统可以包括光源，热管理系统和驱动器电子器件，每个都包含在外壳结构内。 光源构造成通过壳体结构中的开口提供可见的照明。 热管理系统被配置为通过壳体结构提供诸如单向空气流的空气流，以便冷却光源。 驱动器电子器件被配置为向每个光源和热管理系统提供电力。
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9.发明申请METHOD AND APPARATUS FOR REMOVING HEAT FROM ELECTRONIC DEVICES USING SYNTHETIC JETS 有权使用合成喷嘴从电子设备中除去热量的方法和装置公开(公告)号：US20140202657A1
公开(公告)日：2014-07-24
申请号：US14219130
申请日：2014-03-19
Applicant: General Electric Company
Inventor： Rajdeep Sharma , Stanton Earl Weaver , Charles Erklin Seeley , Mehmet Arik , Tunc Icoz , Charles Franklin Wolfe, JR. , Yogen Vishwas Utturkar
IPC: H05K7/20
CPC classification number: H05K7/20154 , F21K9/23 , F21V29/507 , F21V29/63 , F21V29/83 , F21Y2115/10 , H01L23/467 , H01L2924/0002 , H05K7/20172 , H05K7/20409 , Y10T29/4935 , H01L2924/00
Abstract: An apparatus for removing heat comprises a heat sink having a cavity, and a synthetic jet stack comprising at least one synthetic jet mounted within the cavity. At least one rod and at least one engaging structure to provide a rigid positioning of the at least one synthetic jet with respect to the at least one rod. The synthetic jet comprises at least one orifice through which a fluid is ejected.
Abstract translation: 一种用于去除热量的装置包括具有空腔的散热器和包括安装在该空腔内的至少一个合成射流的合成喷射叠层。 至少一个杆和至少一个接合结构，以提供至少一个合成射流相对于至少一个杆的刚性定位。 合成射流包括至少一个孔口，流体被喷射通过该孔口。
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公开(公告)号：US20130241415A1
公开(公告)日：2013-09-19
申请号：US13887793
申请日：2013-05-06
Applicant: GENERAL ELECTRIC COMPANY
Inventor： Mehmet Arik , Stanton Earl Weaver , Thomas Elliot Stecher , Charles Erklin Seeley , Glenn Howard Kuenzler , Charles Franklin Wolfe, JR. , Yogen Vishwas Utturkar , Rajdeep Sharma , Satish Prabhakaran , Tunc Icoz
CPC classification number: H05B33/0803 , F21K9/23 , F21K9/232 , F21K9/238 , F21V23/006 , F21V29/02 , F21V29/63 , F21V29/74 , F21V29/763 , F21V29/83 , F21Y2101/00 , F21Y2105/10 , F21Y2115/10 , F28F3/02 , H01L2924/0002 , H01L2924/00
Abstract: Lighting systems having unique configurations are provided. For instance, the lighting system may include a light source, a thermal management system and driver electronics, each contained within a housing structure. The light source is configured to provide illumination visible through an opening in the housing structure. The thermal management system is configured to provide an air flow, such as a unidirectional air flow, through the housing structure in order to cool the light source. The driver electronics are configured to provide power to each of the light source and the thermal management system.
Abstract translation: 提供具有独特配置的照明系统。 例如，照明系统可以包括光源，热管理系统和驱动器电子器件，每个都包含在外壳结构内。 光源构造成通过壳体结构中的开口提供可见的照明。 热管理系统被配置为通过壳体结构提供诸如单向空气流的空气流，以便冷却光源。 驱动器电子器件被配置为向每个光源和热管理系统提供电力。
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