公开(公告)号：US07786595B2

公开(公告)日：2010-08-31

申请号：US11826415

申请日：2007-07-16

申请人： Geng-Shin Shen ,  Wu-Chang Tu

发明人： Geng-Shin Shen ,  Wu-Chang Tu

IPC分类号： H01L23/48 ,  H01L23/495

CPC分类号： H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2225/06562 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

摘要： The present invention provides a chip-stacked package structure with leadframe having bus bar, comprising: a leadframe composed of a plurality of inner leads arranged in rows facing each other, a plurality of outer leads, and a die pad, wherein the die pad is provided between the plurality of inner leads and is vertically distant from the plurality of inner leads; a chip-stacked structure formed with a plurality of chips that stacked together and set on the die pad, the plurality of chips and the plurality of inner leads being electrically connected with each other; and an encapsulant covering over the chip-stacked package structure and the leadframe, in which the leadframe comprises at least a bus bar, which is provided between the plurality of inner leads arranged in rows facing each other and the die pad.

摘要翻译： 本发明提供了具有母线的引线框的芯片堆叠封装结构，包括：引线框架，由相互排列成行的多个内引线，多个外引线和管芯焊盘组成，其中管芯焊盘为 设置在所述多个内部引线之间并且与所述多个内部引线垂直; 芯片堆叠结构，形成有堆叠在一起并设置在芯片焊盘上的多个芯片，多个芯片和多个内部引线彼此电连接; 以及覆盖在所述芯片堆叠的封装结构和所述引线框架上的密封剂，其中所述引线框架至少包括汇流条，所述汇流条设置在彼此面对的所述多个排列成行的内引线和所述管芯焊盘之间。

公开(公告)号：US20090243056A1

公开(公告)日：2009-10-01

申请号：US12480105

申请日：2009-06-08

申请人： Wu-Chang Tu ,  Geng-Shin Shen

发明人： Wu-Chang Tu ,  Geng-Shin Shen

IPC分类号： H01L23/495

CPC分类号： H01L23/3107 ,  H01L23/4951 ,  H01L23/49541 ,  H01L23/49551 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： A chip package having asymmetric molding includes a lead frame, a chip, an adhesive layer, bonding wires and a molding compound. The lead frame includes a turbulent plate and a frame body having inner lead portions and outer lead portions. The turbulent plate is bended downwards to form a concave portion. The first end of the turbulent plate is connected to the frame body, and the second end is lower than the inner lead portions. The chip is fixed under the inner lead portions through the adhesive layer. The bonding wires are connected between the chip and the inner lead portions. The molding compound encapsulates the chip, the bonding wires, and the turbulent plate. The ratio between the thickness of the molding compound over and under the concave portion is larger than 1. The thickness of the molding compound under and over the outer lead portions is not equal.

摘要翻译： 具有不对称模制的芯片封装包括引线框架，芯片，粘合剂层，接合线和模塑料。 引线框架包括湍流板和具有内引线部分和外引线部分的框体。 湍流板向下弯曲以形成凹部。 湍流板的第一端连接到框体，第二端低于内引线部。 芯片通过粘合剂层固定在内引线部分的下方。 接合线连接在芯片和内引线部分之间。 模塑料封装芯片，接合线和湍流板。 凹形部分上方和下方的模塑料的厚度之比大于1.外引线部分之下和之上的模塑料的厚度不相等。

公开(公告)号：US08212347B2

公开(公告)日：2012-07-03

申请号：US12827076

申请日：2010-06-30

申请人： Geng-Shin Shen ,  Wu-Chang Tu

发明人： Geng-Shin Shen ,  Wu-Chang Tu

IPC分类号： H01L23/02 ,  H01L23/495

CPC分类号： H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2225/06562 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

摘要： The present invention provides a chip-stacked package structure with leadframe having bus bar, comprising: a leadframe composed of a plurality of inner leads arranged in rows facing each other, a plurality of outer leads, and a die pad, wherein the die pad is provided between the plurality of inner leads and is vertically distant from the plurality of inner leads; a chip-stacked structure formed with a plurality of chips that stacked together and set on the die pad, the plurality of chips and the plurality of inner leads being electrically connected with each other; and an encapsulant covering over the chip-stacked package structure and the leadframe, in which the leadframe comprises at least a bus bar, which is provided between the plurality of inner leads arranged in rows facing each other and the die pad.

公开(公告)号：US08169061B2

公开(公告)日：2012-05-01

申请号：US12827133

申请日：2010-06-30

申请人： Geng-Shin Shen ,  Wu-Chang Tu

发明人： Geng-Shin Shen ,  Wu-Chang Tu

IPC分类号： H01L23/48 ,  H01L23/495

CPC分类号： H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2225/06562 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

摘要： The present invention provides a chip-stacked package structure with leadframe having bus bar, comprising: a leadframe composed of a plurality of inner leads arranged in rows facing each other, a plurality of outer leads, and a die pad, wherein the die pad is provided between the plurality of inner leads and is vertically distant from the plurality of inner leads; a chip-stacked structure formed with a plurality of chips that stacked together and set on the die pad, the plurality of chips and the plurality of inner leads being electrically connected with each other; and an encapsulant covering over the chip-stacked package structure and the leadframe, in which the leadframe comprises at least a bus bar, which is provided between the plurality of inner leads arranged in rows facing each other and the die pad.

摘要翻译： 本发明提供了具有母线的引线框的芯片堆叠封装结构，包括：引线框架，由相互排列成行的多个内引线，多个外引线和管芯焊盘组成，其中管芯焊盘为 设置在所述多个内部引线之间并且与所述多个内部引线垂直; 芯片堆叠结构，形成有堆叠在一起并设置在芯片焊盘上的多个芯片，多个芯片和多个内部引线彼此电连接; 以及覆盖在所述芯片堆叠的封装结构和所述引线框架上的密封剂，其中所述引线框架至少包括汇流条，所述汇流条设置在彼此面对的所述多个排列成行的内引线和所述管芯焊盘之间。

公开(公告)号：US07816771B2

公开(公告)日：2010-10-19

申请号：US11826516

申请日：2007-07-16

申请人： Geng-Shin Shen ,  Wu-Chang Tu

发明人： Geng-Shin Shen ,  Wu-Chang Tu

IPC分类号： H01L23/495 ,  H01L23/48

CPC分类号： H01L23/49541 ,  H01L23/49531 ,  H01L23/49551 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48147 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/4911 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/838 ,  H01L2224/92247 ,  H01L2225/06562 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： The present invention provides a stacked chip package structure with leadframe having inner leads with transfer pad, comprising: a leadframe composed of a plurality of inner leads arranged in rows facing each other, a plurality of outer leads, and a die pad, wherein the die pad is provided between the plurality of inner leads arranged in rows facing each other and vertically distant from the plurality of inner leads; an offset chip-stacked structure formed with a plurality of chips stacked together, the offset chip-stacked structure being set on the die pad and electrically connected to the plurality of inner leads arranged in rows facing each other; and an encapsulant covering the offset chip-stacked structure and the leadframe, the plurality of outer leads extending out of said encapsulant; the improvement of which being that the inner leads of the leadframe are coated with an insulating layer and a plurality of metal pads are selectively formed on the insulating layer.

摘要翻译： 本发明提供一种具有引线框架的堆叠式芯片封装结构，其具有带有传输焊盘的内引线，包括：引线框架，由相互排列成行的多个内引线，多个外引线和管芯焊盘构成， 衬垫设置在彼此相对并且彼此垂直远离多个内引线的行中排列的多个内引线之间; 偏移芯片堆叠结构，其形成有堆叠在一起的多个芯片，所述偏移芯片堆叠结构设置在所述管芯焊盘上并电连接到彼此面对的行布置的所述多个内部引线; 以及覆盖所述偏移芯片堆叠结构和所述引线框的密封剂，所述多个外引线从所述密封剂延伸出来; 其改进之处在于引线框架的内引线被覆有绝缘层，并且绝缘层上选择性地形成多个金属焊盘。

公开(公告)号：US20070085176A1

公开(公告)日：2007-04-19

申请号：US11352001

申请日：2006-02-10

申请人： Wu-Chang Tu ,  Geng-Shin Shen

发明人： Wu-Chang Tu ,  Geng-Shin Shen

IPC分类号： H01L23/495

CPC分类号： H01L23/3107 ,  H01L23/4951 ,  H01L23/49541 ,  H01L23/49551 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： A chip package having asymmetric molding includes a lead frame, a chip, an adhesive layer, bonding wires and a molding compound. The lead frame includes a turbulent plate and a frame body having inner lead portions and outer lead portions. The turbulent plate is bended downwards to form a concave portion. The first end of the turbulent plate is connected to the frame body, and the second end is lower than the inner lead portions. The chip is fixed under the inner lead portions through the adhesive layer. The bonding wires are connected between the chip and the inner lead portions. The molding compound encapsulates the chip, the bonding wires, and the turbulent plate. The ratio between the thickness of the molding compound over and under the concave portion is larger than 1. The thickness of the molding compound under and over the outer lead portions is not equal.

摘要翻译： 具有不对称模制的芯片封装包括引线框架，芯片，粘合剂层，接合线和模塑料。 引线框架包括湍流板和具有内引线部分和外引线部分的框体。 湍流板向下弯曲以形成凹部。 湍流板的第一端连接到框体，第二端低于内引线部。 芯片通过粘合剂层固定在内引线部分的下方。 接合线连接在芯片和内引线部分之间。 模塑料封装芯片，接合线和湍流板。 凹形部分上方和下方的模塑料的厚度之比大于1.外引线部分之下和之上的模塑料的厚度不相等。

公开(公告)号：US08207603B2

公开(公告)日：2012-06-26

申请号：US12849188

申请日：2010-08-03

申请人： Geng-Shin Shen ,  Wu-Chang Tu

发明人： Geng-Shin Shen ,  Wu-Chang Tu

IPC分类号： H01L23/02 ,  H01L23/48

CPC分类号： H01L23/49541 ,  H01L23/49531 ,  H01L23/49551 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48147 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/4911 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/838 ,  H01L2224/92247 ,  H01L2225/06562 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： The present invention provides a stacked chip package structure with leadframe having inner leads with transfer pad, comprising: a leadframe composed of a plurality of inner leads arranged in rows facing each other, a plurality of outer leads, and a die pad, wherein the die pad is provided between the plurality of inner leads arranged in rows facing each other and vertically distant from the plurality of inner leads; an offset chip-stacked structure formed with a plurality of chips stacked together, the offest chip-stacked structure being set on the die pad and electrically connected to the plurality of inner leads arranged in rows facing each other; and an encapsulant covering the offset chip-stacked structure and the leadframe, the plurality of outer leads extending out of said encapsulant; the improvement of which being that the inner leads of the leadframe are coated with an insulating layer and a plurality of metal pads are selectively formed on the insulating layer.

摘要翻译： 本发明提供一种具有引线框架的堆叠式芯片封装结构，其具有带有传输焊盘的内引线，包括：引线框架，由相互排列成行的多个内引线，多个外引线和管芯焊盘构成， 衬垫设置在彼此相对并且彼此垂直远离多个内引线的行中排列的多个内引线之间; 叠置了多个芯片的偏置芯片堆叠结构，最小的芯片堆叠结构被设置在芯片焊盘上并电连接到彼此相对布置的多个内部引线; 以及覆盖所述偏移芯片堆叠结构和所述引线框的密封剂，所述多个外引线从所述密封剂延伸出来; 其改进之处在于引线框架的内引线被覆有绝缘层，并且绝缘层上选择性地形成多个金属焊盘。

公开(公告)号：US07615853B2

公开(公告)日：2009-11-10

申请号：US11826413

申请日：2007-07-16

申请人： Geng-Shin Shen ,  Wu-Chang Tu

发明人： Geng-Shin Shen ,  Wu-Chang Tu

IPC分类号： H01L23/495 ,  H01L23/043 ,  H05K7/18

CPC分类号： H01L23/49575 ,  H01L23/49531 ,  H01L23/49541 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/4911 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/838 ,  H01L2224/92247 ,  H01L2225/06562 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/48145 ,  H01L2924/00

摘要： The present invention provides a chip-stacked package structure with leadframe having multi-piece bus bar, comprising: a leadframe composed of a plurality of inner leads arranged in rows facing each other, a plurality of outer leads, and a die pad, wherein the die pad is provided between the plurality of inner leads arranged in rows facing each other and is vertically distant from the plurality of inner leads; a chip-stacked structure formed with a plurality of chips stacked together and provided on the die pad, the plurality of chips and the plurality of inner leads arranged in rows facing each other being electrically connected with each other; and an encapsulant provided to cover the chip-stacked structure and the leadframe; wherein the leadframe comprises at least a bus bar provided between the plurality of inner leads arranged in rows facing each other and the die pad, the bus bar being formed by multiple pieces.

摘要翻译： 本发明提供了一种具有多片汇流条的引线框的芯片堆叠封装结构，包括：引线框架，由相互面对排列的多个内引线，多个外引线和管芯焊盘组成，其中， 芯片焊盘设置在彼此相对排列的多个内部引线之间，并且与多个内部引线垂直; 芯片堆叠结构，其形成有堆叠在一起并设置在芯片焊盘上的多个芯片，多个芯片和布置成彼此面对的多个内部引线彼此电连接; 以及提供以覆盖芯片堆叠结构和引线框架的密封剂; 其中，所述引线框架至少包括设置在彼此面对的所述多个内引线之间的汇流条和所述管芯焊盘，所述母线由多个部件形成。

公开(公告)号：US07576416B2

公开(公告)日：2009-08-18

申请号：US11352001

申请日：2006-02-10

申请人： Wu-Chang Tu ,  Geng-Shin Shen

发明人： Wu-Chang Tu ,  Geng-Shin Shen

IPC分类号： H01L23/495

CPC分类号： H01L23/3107 ,  H01L23/4951 ,  H01L23/49541 ,  H01L23/49551 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： A chip package having asymmetric molding includes a lead frame, a chip, an adhesive layer, bonding wires and a molding compound. The lead frame includes a turbulent plate and a frame body having inner lead portions and outer lead portions. The turbulent plate is bended downwards to form a concave portion. The first end of the turbulent plate is connected to the frame body, and the second end is lower than the inner lead portions. The chip is fixed under the inner lead portions through the adhesive layer. The bonding wires are connected between the chip and the inner lead portions. The molding compound encapsulates the chip, the bonding wires, and the turbulent plate. The ratio between the thickness of the molding compound over and under the concave portion is larger than 1. The thickness of the molding compound under and over the outer lead portions is not equal.

摘要翻译： 具有不对称模制的芯片封装包括引线框架，芯片，粘合剂层，接合线和模塑料。 引线框架包括湍流板和具有内引线部分和外引线部分的框体。 湍流板向下弯曲以形成凹部。 湍流板的第一端连接到框体，第二端低于内引线部。 芯片通过粘合剂层固定在内引线部分的下方。 接合线连接在芯片和内引线部分之间。 模塑料封装芯片，接合线和湍流板。 凹形部分上方和下方的模塑料的厚度之比大于1.外引线部分之下和之上的模塑料的厚度不相等。

公开(公告)号：US20080061421A1

公开(公告)日：2008-03-13

申请号：US11826415

申请日：2007-07-16

申请人： Geng-Shin Shen ,  Wu-Chang Tu

发明人： Geng-Shin Shen ,  Wu-Chang Tu

IPC分类号： H01L23/495

CPC分类号： H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2225/06562 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

摘要： The present invention provides a chip-stacked package structure with leadframe having bus bar, comprising: a leadframe composed of a plurality of inner leads arranged in rows facing each other, a plurality of outer leads, and a die pad, wherein the die pad is provided between the plurality of inner leads and is vertically distant from the plurality of inner leads; a chip-stacked structure formed with a plurality of chips that stacked together and set on the die pad, the plurality of chips and the plurality of inner leads being electrically connected with each other; and an encapsulant covering over the chip-stacked package structure and the leadframe, in which the leadframe comprises at least a bus bar, which is provided between the plurality of inner leads arranged in rows facing each other and the die pad.

摘要翻译： 本发明提供了具有母线的引线框的芯片堆叠封装结构，包括：引线框架，由相互排列成行的多个内引线，多个外引线和管芯焊盘组成，其中管芯焊盘为 设置在所述多个内部引线之间并且与所述多个内部引线垂直; 芯片堆叠结构，形成有堆叠在一起并设置在芯片焊盘上的多个芯片，多个芯片和多个内部引线彼此电连接; 以及覆盖在所述芯片堆叠的封装结构和所述引线框架上的密封剂，其中所述引线框架至少包括汇流条，所述汇流条设置在彼此面对的所述多个排列成行的内引线和所述管芯焊盘之间。