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公开(公告)号：US20060113287A1
公开(公告)日：2006-06-01
申请号：US11273730
申请日：2005-11-14
IPC分类号： B23K26/38
CPC分类号： B23K26/38 , B23K26/0853 , B23K26/364 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , Y10T29/49401
摘要： At least one exemplary embodiment is directed to a laser cutting method where a laser beam is condensed at internal points inside a substrate forming processing regions, and where the laser is swept along a cutting line, where the cutting line is associated with a recess on the substrate and where the recess can be formed contemporaneously with the formation of the processing regions.
摘要翻译： 至少一个示例性实施例涉及激光切割方法，其中激光束在衬底形成处理区域内部的内部点处被冷凝，并且其中激光沿着切割线扫掠，其中切割线与所述切割线上的凹部相关联 衬底，并且可以在形成处理区域的同时形成凹部。
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公开(公告)号：US08108998B2
公开(公告)日：2012-02-07
申请号：US11273730
申请日：2005-11-14
IPC分类号： H01L21/78 , H01L21/30 , H01L21/301
CPC分类号： B23K26/38 , B23K26/0853 , B23K26/364 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , Y10T29/49401
摘要： At least one exemplary embodiment is directed to a laser cutting method where a laser beam is condensed at internal points inside a substrate forming processing regions, and where the laser is swept along a cutting line, where the cutting line is associated with a recess on the substrate and where the recess can be formed contemporaneously with the formation of the processing regions.
摘要翻译： 至少一个示例性实施例涉及激光切割方法，其中激光束在衬底形成处理区域内部的内部点处被冷凝，并且其中激光沿着切割线扫掠，其中切割线与所述切割线上的凹部相关联 衬底，并且可以在形成处理区域的同时形成凹部。
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3.发明申请Laser based splitting method, object to be split, and semiconductor element chip 有权基于激光的分裂方法，待分裂的物体和半导体元件芯片公开(公告)号：US20050199592A1
公开(公告)日：2005-09-15
申请号：US11058163
申请日：2005-02-16
IPC分类号： B28D5/00 , B23K26/06 , B23K26/38 , B23K26/40 , B23K101/40 , H01L21/301 , B23K26/00
CPC分类号： B23K26/0676 , B23K26/0617 , B23K26/40 , B23K26/53 , B23K2103/50 , B28D5/0011 , H01L21/67092 , H01L21/78
摘要： A laser splitting method for splitting off a segment from an object to be split using a laser beam, includes a surface processing step of processing the object by forming a linear recessed portion in a surface of the object, the linear recessed portion being effective to cause a stress concentration at the surface of the object; an internal processed-region forming step of forming an internal processed-regions at a depth of the object in a line along which a laser beam scans the surface of the object by a relative motion therebetween, the laser beam being converged adjacent the depth, wherein the thus formed internal processed-regions extend in a direction substantially perpendicular to the surface of the object; and an external force applying step of applying an external force to the object to form cracks between the recessed portion and the internal processed-regions.
摘要翻译： 一种激光分割方法，用于使用激光束从待分割的物体上分割出一段，包括：通过在物体表面形成线状的凹陷部分来处理物体的表面处理步骤，该线性凹入部分有效地引起 物体表面的应力集中; 内部处理区域形成步骤，在物体的深度处沿着激光束通过它们之间的相对运动扫描物体的表面的行中形成内部加工区域，激光束在相邻深度处会聚，其中， 因此形成的内部加工区域在基本上垂直于物体表面的方向上延伸; 以及向所述物体施加外力以在所述凹部与所述内部加工区域之间形成裂纹的外力施加工序。
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公开(公告)号：US08093530B2
公开(公告)日：2012-01-10
申请号：US11280874
申请日：2005-11-15
CPC分类号： B23K26/0676 , B23K26/0617 , B23K26/0622 , B23K26/38 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50
摘要： A laser cutting apparatus and a laser cutting method are provided which are adapted to concentrate laser light into a silicon substrate to produce a plurality of internal cracks. A light concentrating position, to which laser beams included in the laser light are concentrated, is temporally and spatially displaced to appropriately change lengths of the cracks according to positions in a direction of depth of the substrate. Consequently, the lengths of the internal cracks are controlled to surely lead a crack opening, the starting point of which is the internal crack formed by laser processing, to a predetermined cutting line on a surface of the substrate.
摘要翻译： 提供了一种激光切割装置和激光切割方法，其适于将激光聚焦到硅衬底中以产生多个内部裂纹。 包括在激光中的激光束被集中的聚光位置在时间和空间上移位，以根据衬底的深度方向上的位置适当地改变裂纹的长度。 因此，内部裂纹的长度受到控制，从而将其起点是由激光加工形成的内部裂纹确定地导向基板表面上的规定的切断线。
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公开(公告)号：US07807940B2
公开(公告)日：2010-10-05
申请号：US11283262
申请日：2005-11-17
IPC分类号： B23K26/14
CPC分类号： B23K26/032 , B23K26/064 , B23K26/0648 , B23K26/0665 , B23K26/0853 , B23K26/38 , B23K26/40 , B23K26/53 , B23K26/57 , B23K2101/40 , B23K2103/50
摘要： A laser processing apparatus, in accordance with at least one exemplary embodiment, is configured to contemporaneously perform the functions of observing a surface of a substrate and concentrating laser light to a given position inside the substrate. The laser processing apparatus can include an optical system having an afocal optical subsystem configured to concentrate laser light inside the substrate. Adjustment of the position of a laser light concentrating point can be achieved independent of adjustment of a focal point by the automatic focusing mechanism to observe the surface of the substrate irradiated with laser light.
摘要翻译： 根据至少一个示例性实施例的激光加工设备被配置为同时执行观察衬底的表面并将激光聚集到衬底内的给定位置的功能。 激光加工设备可以包括具有配置成将激光集中在衬底内的无焦光学子系统的光学系统。 可以通过自动对焦机构调节焦点来观察激光照射的基板的表面，可以实现激光聚光点的位置的调节。
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6.发明授权Laser based splitting method, object to be split, and semiconductor element chip 有权基于激光的分裂方法，待分裂的物体和半导体元件芯片公开(公告)号：US07211526B2
公开(公告)日：2007-05-01
申请号：US11058163
申请日：2005-02-16
IPC分类号： H01L21/36
CPC分类号： B23K26/0676 , B23K26/0617 , B23K26/40 , B23K26/53 , B23K2103/50 , B28D5/0011 , H01L21/67092 , H01L21/78
摘要： A laser splitting method for splitting off a segment from an object to be split using a laser beam, includes a surface processing step of processing the object by forming a linear recessed portion in a surface of the object, the linear recessed portion being effective to cause a stress concentration at the surface of the object; an internal processed-region forming step of forming an internal processed-regions at a depth of the object in a line along which a laser beam scans the surface of the object by a relative motion therebetween, the laser beam being converged adjacent the depth, wherein the thus formed internal processed-regions extend in a direction substantially perpendicular to the surface of the object; and an external force applying step of applying an external force to the object to form cracks between the recessed portion and the internal processed-regions.
摘要翻译： 一种激光分割方法，用于使用激光束从待分割的物体上分割出一段，包括：通过在物体表面形成线状的凹陷部分来处理物体的表面处理步骤，该线性凹入部分有效地引起 物体表面的应力集中; 内部处理区域形成步骤，在物体的深度处沿着激光束通过它们之间的相对运动扫描物体的表面的行中形成内部加工区域，激光束在相邻深度处会聚，其中， 因此形成的内部加工区域在基本上垂直于物体表面的方向上延伸; 以及向所述物体施加外力以在所述凹部与所述内部加工区域之间形成裂纹的外力施加工序。
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公开(公告)号：US20060108339A1
公开(公告)日：2006-05-25
申请号：US11283262
申请日：2005-11-17
CPC分类号： B23K26/032 , B23K26/064 , B23K26/0648 , B23K26/0665 , B23K26/0853 , B23K26/38 , B23K26/40 , B23K26/53 , B23K26/57 , B23K2101/40 , B23K2103/50
摘要： A laser processing apparatus, in accordance with at least one exemplary embodiment, is configured to contemporaneously perform the functions of observing a surface of a substrate and concentrating laser light to a given position inside the substrate. The laser processing apparatus can include an optical system having an afocal optical subsystem configured to concentrate laser light inside the substrate. Adjustment of the position of a laser light concentrating point can be achieved independent of adjustment of a focal point by the automatic focusing mechanism to observe the surface of the substrate irradiated with laser light.
摘要翻译： 根据至少一个示例性实施例的激光加工设备被配置为同时执行观察衬底的表面并将激光聚集到衬底内的给定位置的功能。 激光加工设备可以包括具有配置成将激光集中在衬底内的无焦光学子系统的光学系统。 可以通过自动对焦机构调节焦点来观察激光照射的基板的表面，可以实现激光聚光点的位置的调节。
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8.发明授权Automatic focusing apparatus, laser processing apparatus, and laser cutting apparatus 有权自动聚焦装置，激光加工装置和激光切割装置公开(公告)号：US07791001B2
公开(公告)日：2010-09-07
申请号：US11280886
申请日：2005-11-15
CPC分类号： H01L21/67092 , B23K26/046 , B23K26/048 , B23K26/361 , B23K26/40 , B23K26/53 , B23K2103/50 , B23K2103/52
摘要： At least one exemplary embodiment is directed to a laser processing apparatus that can use the shape of a plurality of reflected light fluxes to adjust the position of workpiece relative to an optical system, where the laser processing apparatus facilitates both the viewing of the workpiece and a focusing of a processing laser into the workpiece.
摘要翻译： 至少一个示例性实施例涉及可以使用多个反射光束的形状来调节工件相对于光学系统的位置的激光加工设备，其中激光加工设备有助于工件的观察和 将加工激光聚焦到工件上。
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9.发明申请Automatic focusing apparatus, laser processing apparatus, and laser cutting apparatus 有权自动聚焦装置，激光加工装置和激光切割装置公开(公告)号：US20060109757A1
公开(公告)日：2006-05-25
申请号：US11280886
申请日：2005-11-15
IPC分类号： G11B7/00
CPC分类号： H01L21/67092 , B23K26/046 , B23K26/048 , B23K26/361 , B23K26/40 , B23K26/53 , B23K2103/50 , B23K2103/52
摘要： At least one exemplary embodiment is directed to a laser processing apparatus that can use the shape of a plurality of reflected light fluxes to adjust the position of workpiece relative to an optical system, where the laser processing apparatus facilitates both the viewing of the workpiece and a focusing of a processing laser into the workpiece.
摘要翻译： 至少一个示例性实施例涉及可以使用多个反射光束的形状来调节工件相对于光学系统的位置的激光加工设备，其中激光加工设备有助于工件的观察和 将加工激光聚焦到工件上。
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公开(公告)号：US20060108338A1
公开(公告)日：2006-05-25
申请号：US11280874
申请日：2005-11-15
CPC分类号： B23K26/0676 , B23K26/0617 , B23K26/0622 , B23K26/38 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50
摘要： A laser cutting apparatus and a laser cutting method are provided which are adapted to concentrate laser light into a silicon substrate to produce a plurality of internal cracks. A light concentrating position, to which laser beams included in the laser light are concentrated, is temporally and spatially displaced to appropriately change lengths of the cracks according to positions in a direction of depth of the substrate. Consequently, the lengths of the internal cracks are controlled to surely lead a crack opening, the starting point of which is the internal crack formed by laser processing, to a predetermined cutting line on a surface of the substrate.
摘要翻译： 提供了一种激光切割装置和激光切割方法，其适于将激光聚焦到硅衬底中以产生多个内部裂纹。 包括在激光中的激光束被集中的聚光位置在时间和空间上移位，以根据衬底的深度方向上的位置适当地改变裂纹的长度。 因此，内部裂纹的长度受到控制，从而将其起点是由激光加工形成的内部裂纹确定地导向基板表面上的规定的切断线。
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