Eddy current device for inspecting a component having a flexible support
with a plural sensor array
    1.
    发明授权
    Eddy current device for inspecting a component having a flexible support with a plural sensor array 失效
    用于检查具有多个传感器阵列的具有柔性支撑件的部件的涡流装置

    公开(公告)号:US5315234A

    公开(公告)日:1994-05-24

    申请号:US862950

    申请日:1992-04-03

    CPC分类号: G01N27/902 G01N27/904

    摘要: An eddy current device for inspecting a component includes an eddy current array circuit having respective pluralities of drive and sense elements and having an active face for positioning on a surface of the component during the inspection operation. A backing is disposed on a face of the eddy current array circuit opposite to the active face for concentrating an electromagnetic flux from the eddy current array circuit into the component when each of the plurality of drive elements is being energized. A mechanical arrangement is provided for supporting and deploying the backing and the array circuit to substantially conform with the surface portion under inspection and to cause each of the pluralities of drive and sense elements to be maintained at their respective substantially constant distances from the inspection surface during scanning, preferably at a controlled rate of scan.

    摘要翻译: 用于检查部件的涡流装置包括具有相应多个驱动和感测元件的涡流阵列电路,并且在检查操作期间具有用于定位在部件的表面上的主动面。 背衬设置在与有源面相对的涡流阵列电路的表面上,用于当多个驱动元件中的每一个被通电时,将来自涡流阵列电路的电磁通量集中到部件中。 提供了用于支撑和展开背衬和阵列电路以基本上与被检查的表面部分一致的机械装置,并且使多个驱动和感测元件中的每一个在检测表面期间保持在它们各自基本恒定的距离 优选以受控的扫描速率进行扫描。

    Method of making hermetic feedthrough in ceramic substrate
    4.
    发明授权
    Method of making hermetic feedthrough in ceramic substrate 失效
    在陶瓷基板中制造密封馈通的方法

    公开(公告)号:US4732780A

    公开(公告)日:1988-03-22

    申请号:US33368

    申请日:1987-04-02

    摘要: A process for producing an hermetic feedthrough in a ceramic substrate by providing a sheet of liquid phase sinterable ceramic composition having a feedthrough hole, filling the feedthrough hole with refractory metal metallization material, firing the resulting structure to produce a sintered substrate and adherent metallization wherein the metallization is comprised of continuous phases of refractory metal and glass, contacting the refractory metal with electrically conductive intrusion metal and heating the resulting structure to a temperature at which the glassy phase is fluid, the refractory metal is solid, and the intrusion metal is liquid whereby the liquid metal preferentially wets the refractory metal, migrates into the metallization displacing glass and, upon subsequent solidification, partially or wholly occupies the volume space originally containing the continuous glass phase.

    摘要翻译: 一种通过提供一种具有馈通孔的液相可烧结陶瓷组合物制成密封馈通的方法,用耐火金属金属化材料填充馈通孔,烧制所得结构以产生烧结基底和粘附金属化,其中, 金属化由耐火金属和玻璃的连续相组成,使难熔金属与导电侵入金属接触,并将所得结构加热至玻璃相为流体的温度,难熔金属为固体,侵入金属为液体,由此 液体金属优先润湿难熔金属,迁移到金属化位移玻璃中,并且在随后的固化时,部分或全部占据原始包含连续玻璃相的体积空间。

    Ferrite composite containing silver metallization
    9.
    发明授权
    Ferrite composite containing silver metallization 失效
    含银金属化的铁素体复合材料

    公开(公告)号:US4966625A

    公开(公告)日:1990-10-30

    申请号:US361183

    申请日:1989-06-05

    IPC分类号: C04B35/26 C04B41/51 C04B41/88

    摘要: A composite comprises of a sintered matrix of spinel ferrite and an electrically conductive phase of elemental silver is produced by co-firing a laminated structure of ferrite powder-containing tapes containing a silver metallization-forming material having two end portions wherein only the end portions are exposed.

    摘要翻译: 复合材料包括尖晶石型铁素体的烧结基体和元素银的导电相,其是通过共烧烧包含银金属化形成材料的铁素体粉末含有带的层叠结构而制造的,所述金属银形成材料具有两个端部,其中仅端部为 裸露。

    Hermetic feedthrough in ceramic substrate
    10.
    发明授权
    Hermetic feedthrough in ceramic substrate 失效
    陶瓷衬底中的密封馈通

    公开(公告)号:US4833039A

    公开(公告)日:1989-05-23

    申请号:US125091

    申请日:1987-11-25

    摘要: A process for producing an hermetic feedthrough in a ceramic substrate by providing a sheet of liquid phase sinterable ceramic composition having a feedthrough hole, filling the feedthrough hole with refractory metal metallization material, firing the resulting structure to produce a sintered substrate and adherent metallization wherein the metallization is comprised of continuous phases of refractory metal and glass, contacting the refractory metal with electrically conductive intrusion metal and heating the resulting structure to a temperature at which the glassy phase is fluid, the refractory metal is solid, and the intrusion metal is liquid whereby the liquid metal preferentially wets the refractory metal, migrates into the metallization displacing glass and, upon subsequent solidification, partially or wholly occupies the volume space originally containing the continuous glass phase.

    摘要翻译: 一种通过提供一种具有馈通孔的液相可烧结陶瓷组合物制成密封馈通的方法,用耐火金属金属化材料填充馈通孔,烧制所得结构以产生烧结基底和粘附金属化,其中, 金属化由耐火金属和玻璃的连续相组成,使难熔金属与导电侵入金属接触,并将所得结构加热至玻璃相为流体的温度,难熔金属为固体,侵入金属为液体,由此 液体金属优先润湿难熔金属,迁移到金属化位移玻璃中,并且在随后的固化时,部分或全部占据原始包含连续玻璃相的体积空间。