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公开(公告)号:US08350703B2
公开(公告)日:2013-01-08
申请号:US12987995
申请日:2011-01-10
IPC分类号: G08B13/14
CPC分类号: G06K19/07749 , D10B2401/18 , G06K19/027 , G06K19/07722 , G06K19/07758 , H01L24/24 , H01L24/82 , H01L2224/24227 , H01L2224/76155 , H01L2224/82039 , H01L2224/82102 , H01L2924/01004 , H01L2924/01005 , H01L2924/01027 , H01L2924/01033 , H01L2924/01047 , H01L2924/01051 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/19041 , H01L2924/19042 , H01L2924/3011 , Y10T29/49018 , Y10T29/49155 , H01L2924/00
摘要: A Radio Frequency Identification (RFID) tag. The RFID tag comprises a flexible substrate and an integrated circuit embedded within the flexible substrate. The top surface of the integrated circuit is coplanar with the flexible substrate. At least one conductive element is formed on the flexible substrate. The conductive element is electrically connected to the integrated circuit. The conductive element serves as an antenna for the RFID tag.