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公开(公告)号：US08350703B2
公开(公告)日：2013-01-08
申请号：US12987995
申请日：2011-01-10
IPC分类号： G08B13/14
CPC分类号： G06K19/07749 , D10B2401/18 , G06K19/027 , G06K19/07722 , G06K19/07758 , H01L24/24 , H01L24/82 , H01L2224/24227 , H01L2224/76155 , H01L2224/82039 , H01L2224/82102 , H01L2924/01004 , H01L2924/01005 , H01L2924/01027 , H01L2924/01033 , H01L2924/01047 , H01L2924/01051 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/19041 , H01L2924/19042 , H01L2924/3011 , Y10T29/49018 , Y10T29/49155 , H01L2924/00
摘要： A Radio Frequency Identification (RFID) tag. The RFID tag comprises a flexible substrate and an integrated circuit embedded within the flexible substrate. The top surface of the integrated circuit is coplanar with the flexible substrate. At least one conductive element is formed on the flexible substrate. The conductive element is electrically connected to the integrated circuit. The conductive element serves as an antenna for the RFID tag.
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公开(公告)号：US20090167534A1
公开(公告)日：2009-07-02
申请号：US12366617
申请日：2009-02-05
IPC分类号： G08B13/22
CPC分类号： G06K19/07749 , D10B2401/18 , G06K19/027 , G06K19/07722 , G06K19/07758 , H01L24/24 , H01L24/82 , H01L2224/24227 , H01L2224/76155 , H01L2224/82039 , H01L2224/82102 , H01L2924/01004 , H01L2924/01005 , H01L2924/01027 , H01L2924/01033 , H01L2924/01047 , H01L2924/01051 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/19041 , H01L2924/19042 , H01L2924/3011 , Y10T29/49018 , Y10T29/49155 , H01L2924/00
摘要： A Radio Frequency Identification (RFID) tag. The RFID tag comprises a flexible substrate and an integrated circuit embedded within the flexible substrate. The top surface of the integrated circuit is coplanar with the flexible substrate. At least one conductive element is formed on the flexible substrate. The conductive element is electrically connected to the integrated circuit. The conductive element serves as an antenna for the RFID tag.
摘要翻译： 射频识别（RFID）标签。 RFID标签包括柔性基板和嵌入柔性基板内的集成电路。 集成电路的顶表面与柔性基板共面。 在柔性基板上形成至少一个导电元件。 导电元件电连接到集成电路。 导电元件用作RFID标签的天线。
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公开(公告)号：US07489248B2
公开(公告)日：2009-02-10
申请号：US11497402
申请日：2006-07-31
IPC分类号： G08B13/14
CPC分类号： G06K19/07749 , D10B2401/18 , G06K19/027 , G06K19/07722 , G06K19/07758 , H01L24/24 , H01L24/82 , H01L2224/24227 , H01L2224/76155 , H01L2224/82039 , H01L2224/82102 , H01L2924/01004 , H01L2924/01005 , H01L2924/01027 , H01L2924/01033 , H01L2924/01047 , H01L2924/01051 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/19041 , H01L2924/19042 , H01L2924/3011 , Y10T29/49018 , Y10T29/49155 , H01L2924/00
摘要： A Radio Frequency Identification (RFID) tag. The RFID tag comprises a flexible substrate and an integrated circuit embedded within the flexible substrate. The top surface of the integrated circuit is coplanar with the flexible substrate. At least one conductive element is formed on the flexible substrate. The conductive element is electrically connected to the integrated circuit. The conductive element serves as an antenna for the RFID tag.
摘要翻译： 射频识别（RFID）标签。 RFID标签包括柔性基板和嵌入柔性基板内的集成电路。 集成电路的顶表面与柔性基板共面。 在柔性基板上形成至少一个导电元件。 导电元件电连接到集成电路。 导电元件用作RFID标签的天线。
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公开(公告)号：US07868766B2
公开(公告)日：2011-01-11
申请号：US12366617
申请日：2009-02-05
IPC分类号： G08B13/14
CPC分类号： G06K19/07749 , D10B2401/18 , G06K19/027 , G06K19/07722 , G06K19/07758 , H01L24/24 , H01L24/82 , H01L2224/24227 , H01L2224/76155 , H01L2224/82039 , H01L2224/82102 , H01L2924/01004 , H01L2924/01005 , H01L2924/01027 , H01L2924/01033 , H01L2924/01047 , H01L2924/01051 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/19041 , H01L2924/19042 , H01L2924/3011 , Y10T29/49018 , Y10T29/49155 , H01L2924/00
摘要： A Radio Frequency Identification (RFID) tag. The RFID tag comprises a flexible substrate and an integrated circuit embedded within the flexible substrate. The top surface of the integrated circuit is coplanar with the flexible substrate. At least one conductive element is formed on the flexible substrate. The conductive element is electrically connected to the integrated circuit. The conductive element serves as an antenna for the RFID tag.
摘要翻译： 射频识别（RFID）标签。 RFID标签包括柔性基板和嵌入柔性基板内的集成电路。 集成电路的顶表面与柔性基板共面。 在柔性基板上形成至少一个导电元件。 导电元件电连接到集成电路。 导电元件用作RFID标签的天线。
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公开(公告)号：US07253735B2
公开(公告)日：2007-08-07
申请号：US10807775
申请日：2004-03-23
IPC分类号： G08B13/14
CPC分类号： G06K19/07749 , D10B2401/18 , G06K19/027 , G06K19/07722 , G06K19/07758 , H01L24/24 , H01L24/82 , H01L2224/24227 , H01L2224/76155 , H01L2224/82039 , H01L2224/82102 , H01L2924/01004 , H01L2924/01005 , H01L2924/01027 , H01L2924/01033 , H01L2924/01047 , H01L2924/01051 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/19041 , H01L2924/19042 , H01L2924/3011 , Y10T29/49018 , Y10T29/49155 , H01L2924/00
摘要： A Radio Frequency Identification (RFID) tag. The RFID tag comprises a flexible substrate and an integrated circuit embedded within the flexible substrate. The top surface of the integrated circuit is coplanar with the flexible substrate. At least one conductive element is formed on the flexible substrate. The conductive element is electrically connected to the integrated circuit. The conductive element serves as an antenna for the RFID tag.
摘要翻译： 射频识别（RFID）标签。 RFID标签包括柔性基板和嵌入柔性基板内的集成电路。 集成电路的顶表面与柔性基板共面。 在柔性基板上形成至少一个导电元件。 导电元件电连接到集成电路。 导电元件用作RFID标签的天线。
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公开(公告)号：US20080156445A1
公开(公告)日：2008-07-03
申请号：US11820603
申请日：2007-06-19
IPC分类号： B32B37/00
CPC分类号： G06K19/07718 , G06K19/07745 , H01L21/673 , H01L21/6835 , H01L23/49855 , H01L23/544 , H01L24/19 , H01L24/76 , H01L24/81 , H01L24/95 , H01L2221/68313 , H01L2221/68354 , H01L2223/54473 , H01L2223/6677 , H01L2224/0401 , H01L2224/04105 , H01L2224/20 , H01L2224/7665 , H01L2224/81801 , H01L2224/83192 , H01L2224/92144 , H01L2224/95085 , H01L2924/01027 , H01L2924/01033 , H01L2924/01039 , H01L2924/01043 , H01L2924/01047 , H01L2924/01057 , H01L2924/01075 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/10329 , H01L2924/12042 , H01L2924/12043 , H01L2924/14 , H01L2924/1461 , H01L2924/15153 , H01L2924/15155 , H01L2924/15165 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H05K3/303 , H05K2201/10636 , H05K2203/0173 , Y02P70/611 , Y02P70/613 , Y10T156/17 , Y10T156/171 , Y10T156/1744 , Y10T156/1798 , H01L2924/00
摘要： A method for assembling a device. The method comprises placing a functional element in a first opening formed in a template substrate and transferring the functional element to a device substrate having a second opening formed therein wherein the functional element is held within the second opening and against an adhesive film coupled to the device substrate.
摘要翻译： 一种组装装置的方法。 该方法包括将功能元件放置在形成于模板衬底中的第一开口中，并将功能元件转移到具有形成在其中的第二开口的器件衬底，其中功能元件保持在第二开口内并抵靠与该器件相连的粘合膜 基质。
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公开(公告)号：US07931063B2
公开(公告)日：2011-04-26
申请号：US11820603
申请日：2007-06-19
IPC分类号： B32B37/00
CPC分类号： G06K19/07718 , G06K19/07745 , H01L21/673 , H01L21/6835 , H01L23/49855 , H01L23/544 , H01L24/19 , H01L24/76 , H01L24/81 , H01L24/95 , H01L2221/68313 , H01L2221/68354 , H01L2223/54473 , H01L2223/6677 , H01L2224/0401 , H01L2224/04105 , H01L2224/20 , H01L2224/7665 , H01L2224/81801 , H01L2224/83192 , H01L2224/92144 , H01L2224/95085 , H01L2924/01027 , H01L2924/01033 , H01L2924/01039 , H01L2924/01043 , H01L2924/01047 , H01L2924/01057 , H01L2924/01075 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/10329 , H01L2924/12042 , H01L2924/12043 , H01L2924/14 , H01L2924/1461 , H01L2924/15153 , H01L2924/15155 , H01L2924/15165 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H05K3/303 , H05K2201/10636 , H05K2203/0173 , Y02P70/611 , Y02P70/613 , Y10T156/17 , Y10T156/171 , Y10T156/1744 , Y10T156/1798 , H01L2924/00
摘要： A method for assembling a device. The method comprises placing a functional element in a first opening formed in a template substrate and transferring the functional element to a device substrate having a second opening formed therein wherein the functional element is held within the second opening and against an adhesive film coupled to the device substrate.
摘要翻译： 一种组装装置的方法。 该方法包括将功能元件放置在形成于模板衬底中的第一开口中，并将功能元件转移到具有形成在其中的第二开口的器件衬底，其中功能元件保持在第二开口内并抵靠与该器件相连的粘合膜 基质。
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公开(公告)号：US07244326B2
公开(公告)日：2007-07-17
申请号：US10846753
申请日：2004-05-13
IPC分类号： B32B37/00
CPC分类号： G06K19/07718 , G06K19/07745 , H01L21/673 , H01L21/6835 , H01L23/49855 , H01L23/544 , H01L24/19 , H01L24/76 , H01L24/81 , H01L24/95 , H01L2221/68313 , H01L2221/68354 , H01L2223/54473 , H01L2223/6677 , H01L2224/0401 , H01L2224/04105 , H01L2224/20 , H01L2224/7665 , H01L2224/81801 , H01L2224/83192 , H01L2224/92144 , H01L2224/95085 , H01L2924/01027 , H01L2924/01033 , H01L2924/01039 , H01L2924/01043 , H01L2924/01047 , H01L2924/01057 , H01L2924/01075 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/10329 , H01L2924/12042 , H01L2924/12043 , H01L2924/14 , H01L2924/1461 , H01L2924/15153 , H01L2924/15155 , H01L2924/15165 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H05K3/303 , H05K2201/10636 , H05K2203/0173 , Y02P70/611 , Y02P70/613 , Y10T156/17 , Y10T156/171 , Y10T156/1744 , Y10T156/1798 , H01L2924/00
摘要： A method for assembling a device. The method comprises placing a functional element in a first opening formed in a template substrate and transferring the functional element to a device substrate having a second opening formed therein wherein the functional element is held within the second opening and against an adhesive film coupled to the device substrate.
摘要翻译： 一种组装装置的方法。 该方法包括将功能元件放置在形成于模板衬底中的第一开口中，并将功能元件转移到具有形成在其中的第二开口的器件衬底，其中功能元件保持在第二开口内并抵靠与该器件相连的粘合膜 基质。
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公开(公告)号：US07353598B2
公开(公告)日：2008-04-08
申请号：US11268837
申请日：2005-11-07
申请人： Gordon S. W. Craig , Ali A. Tootoonchi , Randolph W. Eisenhardt , Scott Herrmann , Mark A. Hadley , Paul S. Drzaic
发明人： Gordon S. W. Craig , Ali A. Tootoonchi , Randolph W. Eisenhardt , Scott Herrmann , Mark A. Hadley , Paul S. Drzaic
IPC分类号： H05K3/32
CPC分类号： G06K19/07752 , G06K19/07749 , H01L23/49855 , H01L24/19 , H01L24/24 , H01L24/82 , H01L24/95 , H01L24/97 , H01L25/50 , H01L29/0657 , H01L2223/6677 , H01L2224/0401 , H01L2224/04105 , H01L2224/16 , H01L2224/20 , H01L2224/24101 , H01L2224/24227 , H01L2224/32225 , H01L2224/73267 , H01L2224/76155 , H01L2224/82102 , H01L2224/95085 , H01L2224/95122 , H01L2224/95136 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01023 , H01L2924/01025 , H01L2924/01027 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/10155 , H01L2924/10158 , H01L2924/14 , H01L2924/15153 , H01L2924/15155 , H01L2924/15157 , H01L2924/15165 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , Y10T29/4913 , Y10T29/49144 , Y10T29/49155 , H01L2224/82
摘要： Methods and apparatuses for an electronic assembly. A material is selectively printed on a web substrate at one or more selected areas. The web substrate includes a plurality of functional components having integrated circuits. A local printing system equipped with a print head that dispenses the selected material is used to print. The print head is coupled to a guidance system capable of registering an alignment feature on the web substrate.
摘要翻译： 电子组件的方法和装置。 在一个或多个选定区域上将材料选择性地印刷在网状基材上。 网状基板包括具有集成电路的多个功能部件。 使用配备有分配所选材料的打印头的本地打印系统进行打印。 打印头连接到能够在纸幅基材上记录对准特征的引导系统。
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10.发明授权Apparatus incorporating small-feature-size and large-feature-size components and method for making same 有权具有小特征尺寸和大特征尺寸部件的装置及其制造方法公开(公告)号：US07214569B2
公开(公告)日：2007-05-08
申请号：US10769572
申请日：2004-01-30
申请人： Susan Swindlehurst , Mark A. Hadley , Paul S. Drzaic , Gordon S. W. Craig , Glenn Gengel , Scott Hermann , Aly Tootoochi , Randolph W. Eisenhardt
发明人： Susan Swindlehurst , Mark A. Hadley , Paul S. Drzaic , Gordon S. W. Craig , Glenn Gengel , Scott Hermann , Aly Tootoochi , Randolph W. Eisenhardt
CPC分类号： G06K19/07752 , G06K19/077 , H01L23/49855 , H01L23/5389 , H01L24/13 , H01L24/19 , H01L24/24 , H01L24/29 , H01L24/81 , H01L24/82 , H01L24/83 , H01L24/90 , H01L24/95 , H01L24/97 , H01L29/0657 , H01L2224/05568 , H01L2224/05573 , H01L2224/13019 , H01L2224/13099 , H01L2224/1319 , H01L2224/13499 , H01L2224/16225 , H01L2224/16227 , H01L2224/24011 , H01L2224/2402 , H01L2224/24137 , H01L2224/24225 , H01L2224/24227 , H01L2224/29101 , H01L2224/2929 , H01L2224/293 , H01L2224/29339 , H01L2224/73104 , H01L2224/73204 , H01L2224/76155 , H01L2224/81201 , H01L2224/81205 , H01L2224/81207 , H01L2224/81224 , H01L2224/81801 , H01L2224/81898 , H01L2224/81903 , H01L2224/82102 , H01L2224/83191 , H01L2224/83192 , H01L2224/838 , H01L2224/83865 , H01L2224/83868 , H01L2224/83871 , H01L2224/83874 , H01L2224/95085 , H01L2224/95136 , H01L2224/97 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01055 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/0781 , H01L2924/10158 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/15155 , H01L2924/15165 , H01L2924/3011 , H01L2224/82 , H01L2924/00 , H01L2924/3512 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2924/00012 , H01L2224/05599
摘要： An apparatus incorporating small-feature size and large-feature-size components. The apparatus comprise a strap including a substrate with an integrated circuit contained therein. The integrated circuit coupling to a first conductor disposed on the substrate. The first conductor is made of a thermosetting or a thermoplastic material including conductive fillers. A large-scale component having a second conductor is electrically coupled to the first conductor to electrically couple the large-scale component to the integrated circuit. The large-scale component includes a second substrate.
摘要翻译： 包含小特征尺寸和大特征尺寸组件的装置。 该装置包括带状物，其带有包含集成电路的基板。 集成电路耦合到设置在基板上的第一导体。 第一导体由包括导电填料的热固性或热塑性材料制成。 具有第二导体的大规模部件电耦合到第一导体，以将大尺寸部件电耦合到集成电路。 大规模部件包括第二基板。
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