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    Electrical contacts for flexible displays
    8.
    发明授权
    Electrical contacts for flexible displays 有权
    柔性显示器的电触点

    公开(公告)号：US06864435B2

    公开(公告)日：2005-03-08

    申请号：US10131517

    申请日：2002-04-23

    申请人： Anno Hermanns ,  Randolph W. Eisenhardt ,  Glenn W. Gengel

    发明人： Anno Hermanns ,  Randolph W. Eisenhardt ,  Glenn W. Gengel

    IPC分类号： G09F9/30 ,  H01L23/538 ,  H01L27/32 ,  H05K3/00 ,  H05K3/40 ,  H01R12/04 ,  H05K1/11

    CPC分类号： H01L23/5387 ,  H01L27/3241 ,  H01L27/3276 ,  H01L2924/0002 ,  H01L2924/12044 ,  H01L2924/3011 ,  H05K3/0035 ,  H05K3/4038 ,  H01L2924/00

    摘要： A flexible electronic, Radio Frequency Identification (RF ID) or display device and methods of making the same. The flexible electronic, Radio Frequency Identification (RF ID) or display device comprises a flexible substrate having a top surface and a bottom surface. The top surface comprises electrical components. The flexible substrate comprises openings cutting therethrough from the top surface to the bottom surface. A conductive layer is coupled to the flexible substrate wherein the openings expose at least a portion of the conductive layer. The openings are filled with conductive elements to make first electrical contacts to at least a portion of the conductive layer and second electrical contacts to the electrical components on the flexible substrate.

    摘要翻译： 灵活的电子，射频识别（RF ID）或显示设备及其制作方法。 灵活的电子射频识别（RF ID）或显示装置包括具有顶表面和底表面的柔性基底。 顶表面包括电气部件。 柔性基板包括从顶表面到底表面切割穿过的开口。 导电层耦合到柔性基板，其中开口暴露导电层的至少一部分。 开口填充有导电元件，以使导电层的至少一部分和与柔性基板上的电气部件的第二电接触的第一电接触。

    Heat sink structure comprising a microarray of thermal metal heat channels or vias in a polymeric or film layer
    9.
    发明授权
    Heat sink structure comprising a microarray of thermal metal heat channels or vias in a polymeric or film layer 失效
    散热结构包括聚合物或薄膜层中的热金属热通道或通孔的微阵列

    公开(公告)号：US5930117A

    公开(公告)日：1999-07-27

    申请号：US646522

    申请日：1996-05-07

    申请人： Glenn W. Gengel

    发明人： Glenn W. Gengel

    IPC分类号： H01L23/367 ,  H05T7/20

    CPC分类号： H01L23/3677 ,  H01L2924/0002 ,  Y10S428/901

    摘要： A printed circuit, chip carrier or other substrate for an electronic power circuit can comprise a heat transfer device engineered to dissipate heat generated from the electrical operation of the circuit. The heat transfer characteristic or heat sink capacity of the device results from formation in a polymer film of an array of cylindrical metallic portions in the film that draw heat from the circuit package. We have found that by forming such an array of metallic cylinders wherein each cylinder has a diameter less than about 25 .mu.m, the array defined by a distance on center of about 50-125 .mu.m has a substantial heat transfer characteristic. We have found that when the polymer film has the array of metallic cylinders within the film to a degree that at least about 8%, preferably 10-15% of the surface area of the film is occupied by the metallic cylinder, that the heat transfer characteristics of the film is virtually identical to copper metal. The surprisingly high heat transfer characteristics of the film is surprising and unusual when considering the heat transfer characteristics of the polymeric material surrounding the relatively small proportion of metal. The metallic cylinders are the preferred structure of the metallic portions in the film, however, such cylinders can have some variation of the cylinder structure. Further, any regular array of the cylinders in the film can be used.

    摘要翻译： 用于电子电源电路的印刷电路，芯片载体或其它基底可以包括设计用于散发由电路的电气操作产生的热量的传热装置。 该装置的传热特性或散热能力由膜中的圆柱形金属部分阵列的聚合物膜中形成，从而从电路封装中吸取热量。 我们已经发现，通过形成这样的金属圆筒阵列，其中每个圆柱体的直径小于约25μm，由中心距离约为50-125μm限定的阵列具有显着的传热特性。 我们已经发现，当聚合物膜在膜内具有金属圆柱体阵列的程度至少大约8％，优选10-15％的薄膜的表面积被金属圆筒占据时，传热 膜的特性与铜金属几乎相同。 考虑到围绕相对较小比例金属的聚合材料的传热特性，膜的出人意料的高的传热特性是惊人的和不寻常的。 金属圆筒是薄膜中金属部分的优选结构，然而，这种圆柱体可以具有气缸结构的一些变化。 此外，可以使用膜中的任何规则的圆筒阵列。