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    SYSTEMS FOR MODULE AND MODULAR MOBILE ELECTRONIC DEVICE TESTING
    1.
    发明申请
    SYSTEMS FOR MODULE AND MODULAR MOBILE ELECTRONIC DEVICE TESTING 审中-公开
    用于模块和模块化移动电子设备测试的系统

    公开(公告)号：US20160056902A1

    公开(公告)日：2016-02-25

    申请号：US14834227

    申请日：2015-08-24

    Applicant: Google, Inc.

    Inventor： Paul Eremenko ,  David Fishman ,  Seth Newburg ,  Ara Knaian ,  Marisa Bober

    IPC: H04B17/00 ,  H04M1/02

    CPC classification number: H04B17/16 ,  H04M1/24 ,  H04M1/72569

    Abstract: A system for module testing includes a module interface that includes a power interface, a data interface, and a mechanical interface; a functional testing system that simulates at least one of power conditions and data conditions for the module; and a model generator, wherein the module generator generates models of a modular mobile electronic device based on module operations data.

    Abstract translation: 用于模块测试的系统包括模块接口，其包括电源接口，数据接口和机械接口; 功能测试系统，模拟模块的功率条件和数据条件中的至少一个; 以及模型发生器，其中所述模块发生器基于模块操作数据生成模块化移动电子设备的模型。

    Systems and methods for thermal management of a chassis-coupled modular mobile electronic device
    4.
    发明授权
    Systems and methods for thermal management of a chassis-coupled modular mobile electronic device 有权

    公开(公告)号：US10042402B2

    公开(公告)日：2018-08-07

    申请号：US14680955

    申请日：2015-04-07

    Applicant: Google Inc.

    Inventor： Paul Eremenko ,  David Fishman ,  Seth Newburg ,  Ara Knaian ,  Marisa Bober

    IPC: G06F1/20

    Abstract: Systems and methods for thermal management of a mobile electronic device. During operation of a modular mobile electronic device that is coupled to one or more modules via respective module interfaces of the electronic device, a thermal controller of the electronic device is used to update at least one system thermal goal based on a change for a module thermal model for at least one module coupled to the electronic device. A determination is made as to whether the updated at least one system thermal goal is satisfied based on thermal data provided by a plurality of thermal sensors arranged at locations associated with the electronic device. Responsive to a determination that the updated at least one system thermal goal is not satisfied, the thermal controller controls heat transfer to satisfy the updated at least one thermal goal.

    SYSTEMS FOR ENABLING CHASSIS-COUPLED MODULAR MOBILE ELECTRONIC DEVICES
    9.
    发明申请
    SYSTEMS FOR ENABLING CHASSIS-COUPLED MODULAR MOBILE ELECTRONIC DEVICES 有权
    用于启用联机模块化移动电子设备的系统

    公开(公告)号：US20150288801A1

    公开(公告)日：2015-10-08

    申请号：US14679351

    申请日：2015-04-06

    Applicant: Google, Inc.

    Inventor： David Fishman ,  Seth Newburg ,  Ara Knaian ,  Marisa Bober ,  Paul Eremenko

    IPC: H04M1/725 ,  G06F1/20

    CPC classification number: H04B5/0037 ,  G06F1/203 ,  H04B5/0012 ,  H04B5/0075 ,  H04M1/0254 ,  H04M1/72575 ,  H04W4/80

    Abstract: A system for enabling a chassis-coupled modular mobile electronic device includes a thermally conductive chassis, a set of module couplers that couple modules of the modular mobile electronic device to the chassis (both thermally and mechanically), a module communication network configured to enable data transfer between the modules, and a module power network configured to enable power transfer between the modules when the modules are coupled to the chassis.

    Abstract translation: 一种用于启用机箱耦合的模块化移动电子设备的系统包括导热底盘，将模块化移动电子设备的模块耦合到机箱（热和机械）的一组模块耦合器，模块通信网络，被配置为使能数据 模块之间的传输以及模块电源网络，其被配置为当模块耦合到机箱时在模块之间实现功率传输。

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