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公开(公告)号：US10156870B2
公开(公告)日：2018-12-18
申请号：US15010125
申请日：2016-01-29
Applicant: GOOGLE INC.
Inventor： James Cooper , Joshua Norman Lilje
Abstract: An electronic device may include a printed circuit board (PCB) including at least one electronic component, and an electrically conductive enclosure surrounding the at least one electronic component to provide electromagnetic interference (EMI) shielding for the at least one component. The electrically conductive enclosure may include a frame, made of a resilient, electrically conductive material, on a mounting surface of the PCB, surrounding the at least one component, and an electrically conductive shielding cover extending across an open top area defined by the frame. The frame may be attached to the PCB and the cover by an electrically conductive material to provide for electrical continuity. The frame may be made of a resilient, electrically conductive material so that the frame may compress in response to an externally applied force, and may return to an original, non-compressed form upon removal of the externally applied force.
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公开(公告)号：US10275000B2
公开(公告)日：2019-04-30
申请号：US15257192
申请日：2016-09-06
Applicant: Google Inc.
Inventor： Joshua Norman Lilje , James Cooper
IPC: G06F1/20 , H05K7/20 , H01L23/367 , H01L23/373
Abstract: Techniques of managing heat within an electronic device involve routing a flexible cable or a set of flexible cables within the electronic device to deliver heat to desired locations within the electronic device. Advantageously, it is possible to distribute heat uniformly while using existing components, thus not adding significantly to cost. Furthermore, the flexible cables may be routed in any way that accomplishes it goals of distributing heat and/or electricity.
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公开(公告)号：US10180709B1
公开(公告)日：2019-01-15
申请号：US15460049
申请日：2017-03-15
Applicant: Google Inc.
Inventor： William Riis Hamburgen , James Cooper
IPC: G06F1/20 , H01L23/367 , H01L23/373 , H05K7/18 , H01L23/34 , H05K7/20 , G06F1/16 , H01L23/36 , H01L23/46 , H05K7/00 , H01L23/42
Abstract: A computing device includes a case enclosure, a heat-generating electrical component, and a thermal insulator. The thermal insulator has a first surface adhesively bonded to the surface of the case enclosure and has a second surface adhesively bonded to the surface of the heat-generating component. The thermal insulator includes a layer of thermally-insulating material between the first and second surfaces, and the thermally-insulating material has a thermal conductivity less than 35 mW/m-K.
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公开(公告)号：US10162383B2
公开(公告)日：2018-12-25
申请号：US15465125
申请日：2017-03-21
Applicant: GOOGLE INC.
Inventor： Joshua Boilard , Amy Lai Wong , Kelvin Kwong , James Cooper
Abstract: An electronic device includes: an enclosure having a first surface, a second surface, and a side surface disposed between the first and second surfaces; an edge-to-edge component mounted in an edge-to-edge opening that extends across substantially an entire width of the side surface between the first surface and the second surface; and a brace disposed in the enclosure, the brace extending along the edge-to-edge opening.
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Patent Agency Ranking
公开(公告)号：US20170105278A1
公开(公告)日：2017-04-13
申请号：US14881915
申请日：2015-10-13
Applicant: GOOGLE INC.
Inventor： James Cooper , Joshua Norman Lilje
CPC classification number: H05K1/0203 , H01L23/36 , H01L23/3672 , H01L23/373 , H01L23/427 , H01L23/552 , H05K1/0209 , H05K1/0216 , H05K1/111 , H05K1/181 , H05K3/303 , H05K3/321 , H05K2201/0323 , H05K2201/064 , H05K2201/0707 , H05K2201/10371 , H05K2201/2018
Abstract: An electronic device includes a printed circuit board (PCB), the PCB including at least one grounding pad, an integrated circuit mounted on the PCB; an electrically-conductive frame mounted on the PCB and surrounding the integrated circuit, the frame being electrically connected to the at least one grounding pad, and a flexible electrically-conductive, high-thermal-conductivity heat spreader in electrical contact with the frame and in thermal contact with the integrated circuit. The frame, the heat spreader, and the at least one grounding pad form an EMI shield that reduces EMI leakage from the integrated circuit outside a volume defined by the frame, the heat spreader, and the at least one grounding pad.
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公开(公告)号：US10162381B2
公开(公告)日：2018-12-25
申请号：US15465135
申请日：2017-03-21
Applicant: Google Inc.
Inventor： Roger Hsu , Valentin de la Fuente , Vivek Saini , James Cooper , Farzam Sajed
Abstract: An electronic device includes: a first body portion having a first face and a second face; a second body portion having a first face and a second face, the second body portion and the first body portion hinged to each other for the electronic device to define at least a first configuration where the first face of the first body portion is adjacent the first face of the second body portion, and a second configuration where the second face of the first body portion is adjacent the second face of the second body portion; a first magnet mounted to the first body portion; and a second magnet mounted to the second body portion, wherein the first magnet and the second magnet are separated by a common closest distance in the first configuration and in the second configuration.
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公开(公告)号：US20180067526A1
公开(公告)日：2018-03-08
申请号：US15257192
申请日：2016-09-06
Applicant: Google Inc.
Inventor： Joshua Norman Lilje , James Cooper
CPC classification number: G06F1/203 , H01L23/3677 , H01L23/3736 , H05K7/2039
Abstract: Techniques of managing heat within an electronic device involve routing a flexible cable or a set of flexible cables within the electronic device to deliver heat to desired locations within the electronic device. Advantageously, it is possible to distribute heat uniformly while using existing components, thus not adding significantly to cost. Furthermore, the flexible cables may be routed in any way that accomplishes it goals of distributing heat and/or electricity.
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公开(公告)号：US20180275718A1
公开(公告)日：2018-09-27
申请号：US15465135
申请日：2017-03-21
Applicant: Google Inc.
Inventor： Roger Hsu , Valentin de la Fuente , Vivek Saini , James Cooper , Farzam Sajed
IPC: G06F1/16 , H01F7/02 , G01C19/5776 , G01B7/30
CPC classification number: G06F1/1618 , G01B7/30 , G01C19/5776 , G06F1/1616 , H01F7/0205
Abstract: An electronic device includes: a first body portion having a first face and a second face; a second body portion having a first face and a second face, the second body portion and the first body portion hinged to each other for the electronic device to define at least a first configuration where the first face of the first body portion is adjacent the first face of the second body portion, and a second configuration where the second face of the first body portion is adjacent the second face of the second body portion; a first magnet mounted to the first body portion; and a second magnet mounted to the second body portion, wherein the first magnet and the second magnet are separated by a common closest distance in the first configuration and in the second configuration.
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公开(公告)号：US10073500B2
公开(公告)日：2018-09-11
申请号：US15284903
申请日：2016-10-04
Applicant: GOOGLE INC.
Inventor： William Riis Hamburgen , Joshua Norman Lilje , James Cooper
CPC classification number: G06F1/20 , G06F1/203 , H05K7/20336
Abstract: Techniques of managing heat within an electronic device involve providing a vapor chamber in a ring shape within an electronic device. In some implementations, the vapor chamber forms an outer case wall of an enclosure of the electronic device. In further implementations, the vapor chamber has a fill port attached to the inner edge of the vapor chamber. Advantageously, by using a vapor chamber with a ring geometry in an electronic device according to the improved techniques, a form factor of the electronic device (e.g., a laptop, a tablet, etc.) is not affected by the introduction of the vapor chamber as an outer case wall.
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