公开(公告)号：US10156870B2

公开(公告)日：2018-12-18

申请号：US15010125

申请日：2016-01-29

Applicant: GOOGLE INC.

Inventor： James Cooper ,  Joshua Norman Lilje

IPC: G06F1/16 ,  H05K3/32 ,  H05K9/00

Abstract: An electronic device may include a printed circuit board (PCB) including at least one electronic component, and an electrically conductive enclosure surrounding the at least one electronic component to provide electromagnetic interference (EMI) shielding for the at least one component. The electrically conductive enclosure may include a frame, made of a resilient, electrically conductive material, on a mounting surface of the PCB, surrounding the at least one component, and an electrically conductive shielding cover extending across an open top area defined by the frame. The frame may be attached to the PCB and the cover by an electrically conductive material to provide for electrical continuity. The frame may be made of a resilient, electrically conductive material so that the frame may compress in response to an externally applied force, and may return to an original, non-compressed form upon removal of the externally applied force.

公开(公告)号：US20170105278A1

公开(公告)日：2017-04-13

申请号：US14881915

申请日：2015-10-13

Applicant: GOOGLE INC.

Inventor： James Cooper ,  Joshua Norman Lilje

IPC: H05K1/02 ,  H05K3/32 ,  H05K3/30 ,  H05K1/18 ,  H05K1/11

CPC classification number: H05K1/0203 ,  H01L23/36 ,  H01L23/3672 ,  H01L23/373 ,  H01L23/427 ,  H01L23/552 ,  H05K1/0209 ,  H05K1/0216 ,  H05K1/111 ,  H05K1/181 ,  H05K3/303 ,  H05K3/321 ,  H05K2201/0323 ,  H05K2201/064 ,  H05K2201/0707 ,  H05K2201/10371 ,  H05K2201/2018

Abstract: An electronic device includes a printed circuit board (PCB), the PCB including at least one grounding pad, an integrated circuit mounted on the PCB; an electrically-conductive frame mounted on the PCB and surrounding the integrated circuit, the frame being electrically connected to the at least one grounding pad, and a flexible electrically-conductive, high-thermal-conductivity heat spreader in electrical contact with the frame and in thermal contact with the integrated circuit. The frame, the heat spreader, and the at least one grounding pad form an EMI shield that reduces EMI leakage from the integrated circuit outside a volume defined by the frame, the heat spreader, and the at least one grounding pad.

公开(公告)号：US10275000B2

公开(公告)日：2019-04-30

申请号：US15257192

申请日：2016-09-06

Applicant: Google Inc.

Inventor： Joshua Norman Lilje ,  James Cooper

IPC: G06F1/20 ,  H05K7/20 ,  H01L23/367 ,  H01L23/373

Abstract: Techniques of managing heat within an electronic device involve routing a flexible cable or a set of flexible cables within the electronic device to deliver heat to desired locations within the electronic device. Advantageously, it is possible to distribute heat uniformly while using existing components, thus not adding significantly to cost. Furthermore, the flexible cables may be routed in any way that accomplishes it goals of distributing heat and/or electricity.

公开(公告)号：US10073500B2

公开(公告)日：2018-09-11

申请号：US15284903

申请日：2016-10-04

Applicant: GOOGLE INC.

Inventor： William Riis Hamburgen ,  Joshua Norman Lilje ,  James Cooper

IPC: G06F1/20 ,  H05K7/20

CPC classification number: G06F1/20 ,  G06F1/203 ,  H05K7/20336

Abstract: Techniques of managing heat within an electronic device involve providing a vapor chamber in a ring shape within an electronic device. In some implementations, the vapor chamber forms an outer case wall of an enclosure of the electronic device. In further implementations, the vapor chamber has a fill port attached to the inner edge of the vapor chamber. Advantageously, by using a vapor chamber with a ring geometry in an electronic device according to the improved techniques, a form factor of the electronic device (e.g., a laptop, a tablet, etc.) is not affected by the introduction of the vapor chamber as an outer case wall.

公开(公告)号：US20180081408A1

公开(公告)日：2018-03-22

申请号：US15269007

申请日：2016-09-19

Applicant: Google Inc.

Inventor： Joshua Norman Lilje

IPC: G06F1/18 ,  H01R12/70 ,  H01R13/52 ,  H01R24/76 ,  G06F1/16 ,  H01R24/60

CPC classification number: G06F1/182 ,  F16J15/00 ,  G06F1/16 ,  G06F1/1601 ,  G06F1/1656 ,  H01R12/7076 ,  H01R13/52 ,  H01R13/5202 ,  H01R13/521 ,  H01R13/6584 ,  H01R24/60 ,  H01R24/76 ,  H01R2107/00 ,  H05K5/069 ,  H05K9/0015

Abstract: An electronic device may comprise a chassis, a tongue, and a gasket. The chassis may enclose electronic components, and may define a receptacle. The tongue may extend through the receptacle, and may comprise at least one electrical contact. The gasket may surround the tongue and be located inside the receptacle. The gasket may be non-porous and compressible. A first side of the gasket may be in continuous contact with the tongue. A second side of the gasket may be in continuous contact with the chassis.

公开(公告)号：US10191519B2

公开(公告)日：2019-01-29

申请号：US15269007

申请日：2016-09-19

Applicant: Google Inc.

Inventor： Joshua Norman Lilje

IPC: G06F1/16 ,  G06F1/18 ,  H01R13/52 ,  H05K5/06 ,  H05K9/00 ,  H01R12/70 ,  H01R24/60 ,  H01R24/76 ,  H01R107/00

Abstract: An electronic device may comprise a chassis, a tongue, and a gasket. The chassis may enclose electronic components, and may define a receptacle. The tongue may extend through the receptacle, and may comprise at least one electrical contact. The gasket may surround the tongue and be located inside the receptacle. The gasket may be non-porous and compressible. A first side of the gasket may be in continuous contact with the tongue. A second side of the gasket may be in continuous contact with the chassis.

公开(公告)号：US20180067526A1

公开(公告)日：2018-03-08

申请号：US15257192

申请日：2016-09-06

Applicant: Google Inc.

Inventor： Joshua Norman Lilje ,  James Cooper

IPC: G06F1/20 ,  H05K7/20

CPC classification number: G06F1/203 ,  H01L23/3677 ,  H01L23/3736 ,  H05K7/2039

Abstract: Techniques of managing heat within an electronic device involve routing a flexible cable or a set of flexible cables within the electronic device to deliver heat to desired locations within the electronic device. Advantageously, it is possible to distribute heat uniformly while using existing components, thus not adding significantly to cost. Furthermore, the flexible cables may be routed in any way that accomplishes it goals of distributing heat and/or electricity.