公开(公告)号：US11720733B2

公开(公告)日：2023-08-08

申请号：US17340825

申请日：2021-06-07

申请人： Google LLC

发明人： Evan Jeffrey ,  Julian Shaw Kelly ,  Joshua Yousouf Mutus

IPC分类号： G06F30/39 ,  G06F30/327 ,  G06F30/337 ,  G06F30/398 ,  G06F30/33 ,  G06F30/392 ,  G06F111/02 ,  G06F111/04

CPC分类号： G06F30/39 ,  G06F30/327 ,  G06F30/33 ,  G06F30/337 ,  G06F30/392 ,  G06F30/398 ,  G06F2111/02 ,  G06F2111/04

摘要： Methods, systems, and apparatus, including computer programs encoded on a computer storage medium, for parameterization of physical dimensions of discrete circuit components for component definitions that define discrete circuit components. The component definitions may be selected for use in a device design. When a parametrization of a particular version of a discrete circuit component definition is changed, the version level of the device design is also changed and the circuit layout for the device design is physically verified for the new version level.

公开(公告)号：US20200006621A1

公开(公告)日：2020-01-02

申请号：US16557412

申请日：2019-08-30

申请人： Google LLC

发明人： Joshua Yousouf Mutus ,  Erik Anthony Lucero

IPC分类号： H01L39/04 ,  H01L23/00 ,  H01L25/065 ,  H01L25/18

摘要： A device includes a first chip having a first circuit element, a first interconnect pad in electrical contact with the first circuit element, and a barrier layer on the first interconnect pad, a superconducting bump bond on the barrier layer, and a second chip joined to the first chip by the superconducting bump bond, the second chip having a first quantum circuit element, in which the superconducting bump bond provides an electrical connection between the first circuit element and the first quantum circuit element.

公开(公告)号：US20230084122A1

公开(公告)日：2023-03-16

申请号：US17989833

申请日：2022-11-18

申请人： Google LLC

发明人： Julian Shaw Kelly ,  Joshua Yousouf Mutus

IPC分类号： H01L27/18 ,  G06N10/00 ,  H01L25/065

摘要： A stacked quantum computing device including: a first chip including a superconducting qubit, where the superconducting qubit includes a superconducting quantum interference device (SQUID) region, a control region, and a readout region, and a second chip bonded to the first chip, where the second chip includes a first control element overlapping with the SQUID region, a second control element displaced laterally from the control region and without overlapping the control region, and a readout device overlapping the readout region.

公开(公告)号：US11508781B2

公开(公告)日：2022-11-22

申请号：US17178853

申请日：2021-02-18

申请人： Google LLC

发明人： Julian Shaw Kelly ,  Joshua Yousouf Mutus

IPC分类号： H01L27/18 ,  H01L25/065 ,  G06N10/00

摘要： A stacked quantum computing device including: a first chip including a superconducting qubit, where the superconducting qubit includes a superconducting quantum interference device (SQUID) region, a control region, and a readout region, and a second chip bonded to the first chip, where the second chip includes a first control element overlapping with the SQUID region, a second control element displaced laterally from the control region and without overlapping the control region, and a readout device overlapping the readout region.

公开(公告)号：US11133450B2

公开(公告)日：2021-09-28

申请号：US16557378

申请日：2019-08-30

申请人： Google LLC

发明人： Joshua Yousouf Mutus ,  Erik Anthony Lucero

IPC分类号： H01L23/00 ,  H01L39/04 ,  H01L25/065 ,  H01L23/498 ,  H01L27/18 ,  H01L25/00 ,  H01L25/18

摘要： A device includes a first chip having a first circuit element, a first interconnect pad in electrical contact with the first circuit element, and a barrier layer on the first interconnect pad, a superconducting bump bond on the barrier layer, and a second chip joined to the first chip by the superconducting bump bond, the second chip having a first quantum circuit element, in which the superconducting bump bond provides an electrical connection between the first circuit element and the first quantum circuit element.

公开(公告)号：US20210202573A1

公开(公告)日：2021-07-01

申请号：US17178853

申请日：2021-02-18

申请人： Google LLC

发明人： Julian Shaw Kelly ,  Joshua Yousouf Mutus

IPC分类号： H01L27/18 ,  G06N10/00 ,  H01L25/065

摘要： A stacked quantum computing device including: a first chip including a superconducting qubit, where the superconducting qubit includes a superconducting quantum interference device (SQUID) region, a control region, and a readout region, and a second chip bonded to the first chip, where the second chip includes a first control element overlapping with the SQUID region, a second control element displaced laterally from the control region and without overlapping the control region, and a readout device overlapping the readout region.

公开(公告)号：US20230004847A1

公开(公告)日：2023-01-05

申请号：US17902695

申请日：2022-09-02

申请人： Google LLC

发明人： Julian Shaw Kelly ,  Joshua Yousouf Mutus

IPC分类号： G06N10/00 ,  H01L25/065 ,  H01L39/14

摘要： A stacked quantum computing device including a first chip that includes a first dielectric substrate and a superconducting qubit on the first dielectric substrate, and a second chip that is bonded to the first chip and includes a second dielectric substrate, a qubit readout element on the second dielectric substrate, a control wire on the second dielectric substrate, a dielectric layer covering the control wire, and a shielding layer covering the dielectric layer.

公开(公告)号：US11436516B2

公开(公告)日：2022-09-06

申请号：US16493400

申请日：2017-12-15

申请人： Google LLC

发明人： Julian Shaw Kelly ,  Joshua Yousouf Mutus

IPC分类号： H01L39/14 ,  G06N10/00 ,  H01L25/065

摘要： A stacked quantum computing device including a first chip that includes a first dielectric substrate and a superconducting qubit on the first dielectric substrate, and a second chip that is bonded to the first chip and includes a second dielectric substrate, a qubit readout element on the second dielectric substrate, a control wire on the second dielectric substrate, a dielectric layer covering the control wire, and a shielding layer covering the dielectric layer.

公开(公告)号：US20200012961A1

公开(公告)日：2020-01-09

申请号：US16493400

申请日：2017-12-15

申请人： Google LLC

发明人： Julian Shaw Kelly ,  Joshua Yousouf Mutus

IPC分类号： G06N10/00 ,  H01L25/065 ,  H01L39/14

摘要： A stacked quantum computing device including a first chip that includes a first dielectric substrate and a superconducting qubit on the first dielectric substrate, and a second chip that is bonded to the first chip and includes a second dielectric substrate, a qubit readout element on the second dielectric substrate, a control wire on the second dielectric substrate, a dielectric layer covering the control wire, and a shielding layer covering the dielectric layer.

公开(公告)号：US10468579B2

公开(公告)日：2019-11-05

申请号：US16062064

申请日：2015-12-30

申请人： Google LLC

发明人： Joshua Yousouf Mutus ,  Erik Anthony Lucero

IPC分类号： H01L23/498 ,  H01L39/04 ,  H01L23/00 ,  H01L25/065 ,  H01L27/18 ,  H01L25/00 ,  H01L25/18

摘要： A device (100) includes a first chip (104) having a first circuit element (112), a first interconnect pad (116) in electrical contact (118) with the first circuit element, and a barrier layer (120) on the first interconnect pad, a superconducting bump bond (106) on the barrier layer, and a second chip (102) joined to the first chip by the superconducting bump bond, the second chip having a quantum circuit element (108), in which the superconducting bump bond provides an electrical connection between the first circuit element and the quantum circuit element.