公开(公告)号：US10857368B2

公开(公告)日：2020-12-08

申请号：US15936495

申请日：2018-03-27

Applicant: Greatbatch Ltd.

Inventor： Keith W. Seitz ,  Xiaohong Tang ,  William C. Thiebolt ,  Jonathan Calamel ,  Thomas Shi ,  Thomas Marzano

IPC: A61N1/375 ,  H05K5/00 ,  H05K1/03 ,  H05K3/00 ,  H01L23/15 ,  C03C8/14 ,  H01L23/00 ,  H01L23/10

Abstract: Disclosed herein are electrically conductive and hermetic vias disposed within an insulator substrate of a feedthrough assembly and methods for making and using the same. Such aspects of the present invention consequently provide for the miniaturization of feedthrough assemblies inasmuch as the feedthrough components of the present invention are capable of supporting very small and hermetic conductively filled via holes in the absence of additional components, such as, for example, terminal pins, leadwires, and the like.

公开(公告)号：US20180272137A1

公开(公告)日：2018-09-27

申请号：US15936495

申请日：2018-03-27

Applicant: Greatbatch Ltd.

Inventor： Keith W. Seitz ,  Xiaohong Tang ,  William C. Thiebolt ,  Jonathan Calamel ,  Thomas Shi ,  Thomas Marzano

IPC: A61N1/375 ,  H01L23/10 ,  H05K5/00 ,  H05K1/03 ,  H05K3/00 ,  H01L23/15 ,  C03C8/14 ,  H01L23/00

CPC classification number: A61N1/3754 ,  C03C8/14 ,  C04B2237/343 ,  C04B2237/348 ,  C04B2237/361 ,  C04B2237/363 ,  C04B2237/365 ,  C04B2237/403 ,  C04B2237/408 ,  H01L23/10 ,  H01L23/15 ,  H01L24/26 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K3/0047 ,  H05K5/0095

Abstract: Disclosed herein are electrically conductive and hermetic vias disposed within an insulator substrate of a feedthrough assembly and methods for making and using the same. Such aspects of the present invention consequently provide for the miniaturization of feedthrough assemblies inasmuch as the feedthrough components of the present invention are capable of supporting very small and hermetic conductively filled via holes in the absence of additional components, such as, for example, terminal pins, leadwires, and the like.