公开(公告)号：US08808888B2

公开(公告)日：2014-08-19

申请号：US12868489

申请日：2010-08-25

申请人： Gregory J. Wilson ,  Kyle M. Hanson

发明人： Gregory J. Wilson ,  Kyle M. Hanson

IPC分类号： H01M2/36

CPC分类号： H01M8/186 ,  H01M4/42 ,  H01M8/0232 ,  H01M8/0245 ,  H01M8/188 ,  H01M8/20 ,  H01M12/08 ,  H01M2250/00 ,  Y02E60/528

摘要： Embodiments of the invention generally provide for flow battery cells and systems containing a plurality of flow battery cells, and methods for improving metal plating within the flow battery cell, such as by flowing and exposing the catholyte to various types of cathodes. In one embodiment, a flow battery cell is provided which includes a cathodic half cell and an anodic half cell separated by an electrolyte membrane, wherein the cathodic half cell contains a plurality of cathodic wires extending perpendicular or substantially perpendicular to and within the catholyte pathway and in contact with the catholyte, and each of the cathodic wires extends parallel or substantially parallel to each other. In some examples, the plurality of cathodic wires may have at least two arrays of cathodic wires, each array contains at least one row of cathodic wires, and each row extends along the catholyte pathway.

摘要翻译： 本发明的实施例通常提供了包含多个流动电池单元的流动电池单元和系统，以及用于改善流动电池单元内的金属电镀的方法，例如通过将阴极电解液流过和暴露于各种类型的阴极。 在一个实施例中，提供了流动电池单元，其包括阴极半电池和由电解质膜分离的阳极半电池，其中阴极半电池包含垂直于或基本垂直于阴极电解液通道延伸的多个阴极线， 与阴极电解液接触，并且每个阴极线彼此平行或基本平行延伸。 在一些示例中，多个阴极线可以具有至少两个阴极线阵列，每个阵列包含至少一排阴极线，并且每排沿着阴极电解液通道延伸。

公开(公告)号：US07909967B2

公开(公告)日：2011-03-22

申请号：US11457192

申请日：2006-07-13

申请人： Daniel J. Woodruff ,  Paul R. McHugh ,  Gregory J. Wilson ,  Kyle M. Hanson ,  Erik Lund ,  Steven L. Peace

发明人： Daniel J. Woodruff ,  Paul R. McHugh ,  Gregory J. Wilson ,  Kyle M. Hanson ,  Erik Lund ,  Steven L. Peace

IPC分类号： C25F7/00

CPC分类号： C25F7/00

摘要： An electro-chemical processor for making porous silicon or processing other substrates has first and second chamber assemblies. The first and second chamber assemblies include first and second seals for sealing against a wafer, and first and second electrodes, respectively. The first seal is moveable towards and away from a wafer in the processor, to move between a wafer load/unload position, and a wafer process position. The first electrode may move along with the first seal. The processor may be pivotable from a substantially horizontal orientation, for loading and unloading a wafer, to a substantially vertical orientation, for processing a wafer.

摘要翻译： 用于制造多孔硅或处理其它衬底的电化学处理器具有第一和第二室组件。 第一和第二室组件包括分别用于密封晶片的第一和第二密封件以及第一和第二电极。 第一密封件可朝向和远离处理器中的晶片移动，以在晶片装载/卸载位置与晶片工艺位置之间移动。 第一电极可以与第一密封件一起移动。 处理器可以从用于加载和卸载晶片的基本上水平的方向枢转到基本垂直的取向，用于处理晶片。

公开(公告)号：US07438788B2

公开(公告)日：2008-10-21

申请号：US11096477

申请日：2005-03-29

申请人： Kyle M. Hanson ,  Thomas L. Ritzdorf ,  Gregory J. Wilson ,  Paul R. McHugh

发明人： Kyle M. Hanson ,  Thomas L. Ritzdorf ,  Gregory J. Wilson ,  Paul R. McHugh

IPC分类号： C25D17/02 ,  C25D7/12

CPC分类号： C25D17/001 ,  C25D5/18 ,  C25D7/123 ,  C25D17/10

摘要： An apparatus and method for electrochemical processing of microelectronic workpieces in a reaction vessel. In one embodiment, the reaction vessel includes: an outer container having an outer wall; a distributor coupled to the outer container, the distributor having a first outlet configured to introduce a primary flow into the outer container and at least one second outlet configured to introduce a secondary flow into the outer container separate from the primary flow; a primary flow guide in the outer container coupled to the distributor to receive the primary flow from the first outlet and direct it to a workpiece processing site; a dielectric field shaping unit in the outer container coupled to the distributor to receive the secondary flow from the second outlet, the field shaping unit being configured to contain the secondary flow separate from the primary flow through at least a portion of the outer container, and the field shaping unit having at least one electrode compartment through which the secondary flow can pass while the secondary flow is separate from the primary flow; an electrode in the electrode compartment; and an interface member carried by the field shaping unit downstream from the electrode, the interface member being in fluid communication with the secondary flow in the electrode compartment, and the interface member being configured to prevent selected matter of the secondary flow from passing to the primary flow.

摘要翻译： 用于反应容器中微电子工件的电化学处理的装置和方法。 在一个实施例中，反应容器包括：具有外壁的外容器; 分配器，其耦合到所述外部容器，所述分配器具有构造成将主流引入所述外部容器中的第一出口和构造成将二次流引导到与所述主流分离的所述外部容器中的至少一个第二出口; 外部容器中的主要流动引导件联接到分配器以接收来自第一出口的主流并将其引导到工件加工位置; 所述外容器中的电介质场成形单元联接到所述分配器以接收来自所述第二出口的二次流，所述场整形单元构造成容纳所述次流与所述主流分离通过所述外容器的至少一部分，以及 所述场成形单元具有至少一个电极室，所述二次流可以通过所述至少一个电极室，而所述二次流与所述主流分离; 电极室中的电极; 以及由所述场成形单元承载在所述电极的下游的界面构件，所述界面构件与所述电极室中的所述次流体流体连通，并且所述界面构件被构造成防止所述二次流的选定物质通过所述主流 流。

公开(公告)号：US20080048306A1

公开(公告)日：2008-02-28

申请号：US11467232

申请日：2006-08-25

申请人： Nigel Stewart ,  Daniel J. Woodruff ,  Paul R. McHugh ,  Gregory J. Wilson ,  Kyle M. Hanson ,  Erik Lund ,  Steven L. Peace

发明人： Nigel Stewart ,  Daniel J. Woodruff ,  Paul R. McHugh ,  Gregory J. Wilson ,  Kyle M. Hanson ,  Erik Lund ,  Steven L. Peace

IPC分类号： H01L23/06

CPC分类号： H01L21/6719 ,  H01L21/67115 ,  H01L21/67126

摘要： A processor for making porous silicon or processing other substrates has first and second chamber assemblies. The first and second chamber assemblies include first and second seals for sealing against a wafer, and first and second electrodes, respectively. The second seal is moveable towards and away from a wafer in the processor, to move between a wafer load/unload position, and a wafer process position. The second electrode may move with the second seal. A light source shines light onto the first side of the wafer. The processor may be pivotable from a substantially horizontal orientation, for loading and unloading a wafer, to a substantially vertical orientation, for processing a wafer.

摘要翻译： 用于制造多孔硅或处理其它衬底的处理器具有第一和第二室组件。 第一和第二室组件包括分别用于密封晶片的第一和第二密封件以及第一和第二电极。 第二密封件可朝向和远离处理器中的晶片移动，以在晶片装载/卸载位置与晶片工艺位置之间移动。 第二电极可以与第二密封件一起移动。 光源将光照射到晶片的第一面上。 处理器可以从用于加载和卸载晶片的基本上水平的方向枢转到基本垂直的取向，用于处理晶片。

公开(公告)号：US07267749B2

公开(公告)日：2007-09-11

申请号：US10400186

申请日：2003-03-26

申请人： Gregory J. Wilson ,  Paul R. McHugh ,  Kyle M. Hanson

发明人： Gregory J. Wilson ,  Paul R. McHugh ,  Kyle M. Hanson

IPC分类号： C25D5/08 ,  C25D17/06 ,  C25B9/12 ,  C25D3/38

CPC分类号： C25D17/02 ,  C25D5/08 ,  C25D17/001 ,  Y10S204/07

摘要： A processing container (610) for providing a flow of a processing fluid during immersion processing of at least one surface of a microelectronic workpiece is set forth. The processing container comprises a principal fluid flow chamber (505) providing a flow of processing fluid to at least one surface of the workpiece and a plurality of nozzles (535) disposed to provide a flow of processing fluid to the principal fluid flow chamber. The plurality of nozzles are arranged and directed to provide vertical and radial fluid flow components that combine to generate a substantially uniform normal flow component radially across the surface of the workpiece. An exemplary apparatus using such a processing container is also set forth that is particularly adapted to carry out an electroplating process. In accordance with a further aspect of the present disclosure, an improved fluid removal path (640) is provided for removing fluid from a principal fluid flow chamber during immersion processing of a microelectronic workpiece.

摘要翻译： 阐述了用于在微电子工件的至少一个表面的浸入处理期间提供处理流体流的处理容器（610）。 处理容器包括主流体流动室（505），其向工件的至少一个表面提供处理流体流，以及设置成向主流体流动室提供处理流体流的多个喷嘴（535）。 多个喷嘴被布置和引导以提供垂直和径向的流体流动分量，其组合以在工件的表面上径向产生基本上均匀的正常流动分量。 还提出了使用这种处理容器的示例性装置，其特别适用于进行电镀工艺。 根据本公开的另一方面，提供改进的流体移除路径（640），用于在微电子工件的浸没处理期间从主流体流动室中移除流体。

公开(公告)号：US20120292181A1

公开(公告)日：2012-11-22

申请号：US13110728

申请日：2011-05-18

申请人： Paul R. McHugh ,  Gregory J. Wilson ,  Kyle M. Hanson

发明人： Paul R. McHugh ,  Gregory J. Wilson ,  Kyle M. Hanson

IPC分类号： C25D17/00

CPC分类号： C25D17/001 ,  C25D5/08 ,  C25D17/005 ,  C25D17/007 ,  C25D17/008 ,  C25D17/12

摘要： An electrochemical processor may include a head having a rotor configured to hold a workpiece, with the head moveable to position the rotor in a vessel. Inner and outer anodes are in inner and outer anolyte chambers within the vessel. An upper cup in the vessel, has a curved upper surface and inner and outer catholyte chambers. A current thief is located adjacent to the curved upper surface. Annular slots in the curved upper curved surface connect into passageways, such as tubes, leading into the outer catholyte chamber. Membranes may separate the inner and outer anolyte chambers from the inner and outer catholyte chambers, respectively.

摘要翻译： 电化学处理器可以包括具有被配置为保持工件的转子的头部，头部可移动以将转子定位在容器中。 内阳极和外阳极在容器内部和外部阳极电解液室中。 容器中的上杯具有弯曲的上表面和内部和外部阴极电解液室。 目前的小偷位于弯曲的上表面附近。 弯曲的上曲面中的环形槽连接到通道，例如管，通向外阴极室。 膜可以分别将内部和外部阳极电解液室与内部和外部阴极电解液室分开。

公开(公告)号：US07264698B2

公开(公告)日：2007-09-04

申请号：US09872151

申请日：2001-05-31

申请人： Kyle M. Hanson ,  Thomas L. Ritzdorf ,  Gregory J. Wilson ,  Paul R. McHugh

发明人： Kyle M. Hanson ,  Thomas L. Ritzdorf ,  Gregory J. Wilson ,  Paul R. McHugh

IPC分类号： C25D17/00 ,  C25D17/02 ,  C25D7/12

CPC分类号： H01L21/6719 ,  C25D7/123 ,  C25D17/001 ,  H01L21/67103 ,  H01L21/6723

摘要： An apparatus and method for electrochemical processing of microelectronic workpieces in a reaction vessel. In one embodiment, the reaction vessel includes: an outer container having an outer wall; a distributor coupled to the outer container, the distributor having a first outlet configured to introduce a primary flow into the outer container and at least one second outlet configured to introduce a secondary flow into the outer container separate from the primary flow; a primary flow guide in the outer container coupled to the distributor to receive the primary flow from the first outlet and direct it to a workpiece processing site; a dielectric field shaping unit in the outer container coupled to the distributor to receive the secondary flow from the second outlet, the field shaping unit being configured to contain the secondary flow separate from the primary flow through at least a portion of the outer container, and the field shaping unit having at least one electrode compartment through which the secondary flow can pass while the secondary flow is separate from the primary flow; an electrode in the electrode compartment; and an interface member carried by the field shaping unit downstream from the electrode, the interface member being in fluid communication with the secondary flow in the electrode compartment, and the interface member being configured to prevent selected matter of the secondary flow from passing to the primary flow.

摘要翻译： 用于反应容器中微电子工件的电化学处理的装置和方法。 在一个实施例中，反应容器包括：具有外壁的外容器; 分配器，其耦合到所述外部容器，所述分配器具有构造成将主流引入所述外部容器中的第一出口和构造成将二次流引导到与所述主流分离的所述外部容器中的至少一个第二出口; 外部容器中的主要流动引导件联接到分配器以接收来自第一出口的主流并将其引导到工件加工位置; 所述外容器中的电介质场成形单元联接到所述分配器以接收来自所述第二出口的二次流，所述场整形单元构造成容纳所述次流与所述主流分离通过所述外容器的至少一部分，以及 所述场成形单元具有至少一个电极室，所述二次流可以通过所述至少一个电极室，而所述二次流与所述主流分离; 电极室中的电极; 以及由所述场成形单元承载在所述电极的下游的界面构件，所述界面构件与所述电极室中的所述次流体流体连通，并且所述界面构件被构造成防止所述二次流的选定物质通过所述主流 流。

公开(公告)号：US08496789B2

公开(公告)日：2013-07-30

申请号：US13110728

申请日：2011-05-18

申请人： Paul R. McHugh ,  Gregory J. Wilson ,  Kyle M. Hanson

发明人： Paul R. McHugh ,  Gregory J. Wilson ,  Kyle M. Hanson

IPC分类号： C25D17/02 ,  C25D7/12

CPC分类号： C25D17/001 ,  C25D5/08 ,  C25D17/005 ,  C25D17/007 ,  C25D17/008 ,  C25D17/12

摘要： An electrochemical processor may include a head having a rotor configured to hold a workpiece, with the head moveable to position the rotor in a vessel. Inner and outer anodes are in inner and outer anolyte chambers within the vessel. An upper cup in the vessel, has a curved upper surface and inner and outer catholyte chambers. A current thief is located adjacent to the curved upper surface. Annular slots in the curved upper curved surface connect into passageways, such as tubes, leading into the outer catholyte chamber. Membranes may separate the inner and outer anolyte chambers from the inner and outer catholyte chambers, respectively.

公开(公告)号：US07935230B2

公开(公告)日：2011-05-03

申请号：US11608151

申请日：2006-12-07

申请人： Daniel J. Woodruff ,  Paul R. McHugh ,  Gregory J. Wilson ,  Kyle M. Hanson ,  Nigel Stewart ,  Erik Lund ,  Steven L. Peace

发明人： Daniel J. Woodruff ,  Paul R. McHugh ,  Gregory J. Wilson ,  Kyle M. Hanson ,  Nigel Stewart ,  Erik Lund ,  Steven L. Peace

IPC分类号： C25F7/00

CPC分类号： C25D17/001 ,  C25D17/004

摘要： A processor for making porous silicon or processing other substrates has first and second chamber assemblies. The first and second chamber assemblies include first and second seals for sealing against a wafer, and first and second electrodes, respectively. The first and/or second seal is moveable towards and away from a wafer in the processor, to move between a wafer load/unload position, and a wafer process position. The first electrode may move along with the first seal, and the second electrode may move along with the second seal. A light source shines light onto the first side of the wafer. The processor may be pivotable from a substantially horizontal orientation, for loading and unloading a wafer, to a substantially vertical orientation, for processing a wafer.

摘要翻译： 用于制造多孔硅或处理其它衬底的处理器具有第一和第二室组件。 第一和第二室组件包括分别用于密封晶片的第一和第二密封件以及第一和第二电极。 第一和/或第二密封件可朝向和远离处理器中的晶片移动，以在晶片装载/卸载位置与晶片工艺位置之间移动。 第一电极可以与第一密封件一起移动，并且第二电极可以与第二密封件一起移动。 光源将光照射到晶片的第一面上。 处理器可以从用于加载和卸载晶片的基本上水平的方向枢转到基本垂直的取向，用于处理晶片。

公开(公告)号：US07252714B2

公开(公告)日：2007-08-07

申请号：US10295302

申请日：2002-11-15

申请人： Kyle M. Hanson ,  Robert W. Batz, Jr. ,  Rajesh Baskaran ,  Nolan Zimmerman ,  Zhongmin Hu ,  Gregory J. Wilson ,  Paul R. McHugh

发明人： Kyle M. Hanson ,  Robert W. Batz, Jr. ,  Rajesh Baskaran ,  Nolan Zimmerman ,  Zhongmin Hu ,  Gregory J. Wilson ,  Paul R. McHugh

IPC分类号： B05C3/00

CPC分类号： H01L21/6723 ,  C23C18/1676 ,  H01L21/67109 ,  Y10T137/0318

摘要： Apparatus and method for thermally controlled processing of microelectronic workpieces with liquids. An apparatus in accordance with and embodiment of the invention includes a process vessel configured to carry a processing liquid, such as an electroless processing liquid. The vessel has a thermally transmissive wall for transferring heat to and/or from the processing liquid within. A heat transfer device, such as a reservoir that receives processing liquid spilling over from the process vessel, transfers heat to or from the processing liquid within the process vessel. The heat transfer device can also transfer heat to or from an internal or external heat source, such as a conduit carrying a heat transfer fluid, or an electrical resistance heater. The interaction between the microelectronic workpiece and the processing liquid can be further controlled by controlling the rate at which the microelectronic workpiece rotates and/or the manner in which the microelectronic workpiece is introduced to and/or withdrawn from the processing liquid.

摘要翻译： 用液体对微电子工件进行热处理的装置和方法。 根据本发明的实施例的装置包括配置成承载诸如无电处理液体的处理液体的处理容器。 容器具有用于将热量传递到和/或内部的处理液体的热传递壁。 传热装置，例如容纳从处理容器溢出的处理液体的储存器，将热量传递到处理容器内或从处理容器内的处理液体。 传热装置还可以将热量传递到内部或外部热源，例如承载传热流体的导管或电阻加热器。 通过控制微电子工件旋转的速度和/或微电子工件被引入和/或从处理液中取出的方式，可以进一步控制微电子工件和处理液之间的相互作用。