METHOD FOR LASER HARDENING OF A CARD WIRE
    2.
    发明公开

    公开(公告)号:US20240102120A1

    公开(公告)日:2024-03-28

    申请号:US18263937

    申请日:2021-12-17

    CPC classification number: C21D1/09 C21D1/74 C21D9/26 C21D9/525

    Abstract: A method for laser beam hardening of sections to be hardened (A) of a card wire (10) is disclosed. Thereby the card wire (10) is moved in a conveying direction through a working space (26). In the working space (26), an inert gas atmosphere is created by continuously or discontinuously introducing inert gas (G). In the working space (26), a laser beam area (27) is generated through which the sections to be hardened (A) of the card wire (10) are moved. Thereby the sections to be hardened (A) are heated. After exiting out of the laser beam area (27) the sections to be hardened (A) cool and are hardened by progressing through this temperature profile. The hardening in the inert gas atmosphere inside working space (26) avoids formation of oxide layers (scaling) and annealing colors.

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