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    Device for milling and lathing
    4.
    发明申请
    Device for milling and lathing 有权
    铣刨装置

    公开(公告)号：US20050188516A1

    公开(公告)日：2005-09-01

    申请号：US10964036

    申请日：2004-10-13

    申请人： Gunther Schneider ,  Helwig Buchenauer ,  Klaus Kraemer

    发明人： Gunther Schneider ,  Helwig Buchenauer ,  Klaus Kraemer

    IPC分类号： B23B3/06 ,  B23Q1/01 ,  B24B9/14 ,  B24B13/06 ,  B24B47/16 ,  B23B25/00

    CPC分类号： B23Q1/015 ,  B23B3/065 ,  B24B9/14 ,  B24B13/06 ,  B24B47/16 ,  Y10T29/511 ,  Y10T29/5114 ,  Y10T82/10

    摘要： A device for milling and/or lathing workpieces including at least one machine bed, on which there is at least one tool holder and one workpiece spindle as part of a workpiece holder with an axis of rotation, whereby the tool holder has at least one tool drive with an axis of oscillation running parallel to the axis of rotation, whereby the workpiece holder and the tool holder can travel relative to each other in the direction of an axis of translation that runs at a right angle to the axis of oscillation. The workpiece holder has a linear drive that can travel in the direction of the axis of translation.

    摘要翻译： 一种用于铣削和/或车削工件的装置，其包括至少一个机床，在其上存在至少一个工具保持器和一个工件主轴作为具有旋转轴线的工件保持器的一部分，由此工具保持器具有至少一个工具 以平行于旋转轴线的摆动轴线驱动，由此工件保持器和刀架能够沿与摆动轴线成直角的平移轴线的方向相对移动。 工件夹具具有可沿平移轴线方向行进的直线驱动。

    Device for milling and lathing
    5.
    发明授权
    Device for milling and lathing 有权
    铣刨装置

    公开(公告)号：US07219407B2

    公开(公告)日：2007-05-22

    申请号：US10964036

    申请日：2004-10-13

    申请人： Gunther Schneider ,  Helwig Buchenauer ,  Klaus Kraemer

    发明人： Gunther Schneider ,  Helwig Buchenauer ,  Klaus Kraemer

    IPC分类号： B23B25/00

    CPC分类号： B23Q1/015 ,  B23B3/065 ,  B24B9/14 ,  B24B13/06 ,  B24B47/16 ,  Y10T29/511 ,  Y10T29/5114 ,  Y10T82/10

    摘要： A device for milling and/or lathing workpieces including at least one machine bed, on which there is at least one tool holder and one workpiece spindle as part of a workpiece holder with an axis of rotation, whereby the tool holder has at least one tool drive with an axis of oscillation running parallel to the axis of rotation, whereby the workpiece holder and the tool holder can travel relative to each other in the direction of an axis of translation that runs at a right angle to the axis of oscillation. The workpiece holder has a linear drive that can travel in the direction of the axis of translation.

    摘要翻译： 一种用于铣削和/或车削工件的装置，其包括至少一个机床，在其上存在至少一个工具保持器和一个工件主轴作为具有旋转轴线的工件保持器的一部分，由此工具保持器具有至少一个工具 以平行于旋转轴线的摆动轴线驱动，由此工件保持器和刀架能够沿与摆动轴线成直角的平移轴线的方向相对移动。 工件夹具具有可沿平移轴线方向行进的直线驱动。

    Method and Appartus For Detection Of Mechanical Defects In An Ingot Piece Composed Of Semiconductor Material
    6.
    发明申请
    Method and Appartus For Detection Of Mechanical Defects In An Ingot Piece Composed Of Semiconductor Material 有权
    用于检测由半导体材料组成的锭中的机械缺陷的方法和附件

    公开(公告)号：US20080041159A1

    公开(公告)日：2008-02-21

    申请号：US11764854

    申请日：2007-06-19

    申请人： Ludwig Koester ,  Peter Czurratis ,  Klaus Kraemer

    发明人： Ludwig Koester ,  Peter Czurratis ,  Klaus Kraemer

    IPC分类号： G01N29/26 ,  H01L21/00

    CPC分类号： G01N29/28 ,  G01N29/043 ,  G01N29/0681 ,  G01N29/11 ,  G01N29/265 ,  G01N2291/044 ,  G01N2291/2697 ,  G01N2291/2698 ,  H01L21/67288

    摘要： A method for detection of mechanical defects in a semiconductor ingot section which has at least one planar surface, and a thickness at right angles to this surface of 1 cm to 100 cm, involves scanning the planar surface by at least one ultrasound head which is coupled via a liquid coupling medium to the planar surface and, at each measurement point (x,y) producing at least one ultrasound pulse which is directed at the planar surface of the ingot section, recording the ultrasound-pulse echo as a function of time, such that an echo from the planar surface, an echo from a surface opposite the planar surface, and further echoes are detected, with the positions (xp, yp, zp) of mechanical defects in the ingot section being determined from the further echoes.

    摘要翻译： 一种用于检测半导体块部分中的机械缺陷的方法，其具有至少一个平坦表面，并且与该表面成直角的厚度为1cm至100cm，包括通过至少一个超声头扫描平面， 通过液体耦合介质到平面表面，并且在每个测量点（x，y）处产生至少一个针对晶锭部分的平面表面的超声脉冲，记录超声波脉冲回波作为时间的函数， 使得来自平面表面的回波，来自与平面表面相对的表面的回波和另外的回波被检测，其中位置（x，p，y，p， 根据进一步的回波确定锭块部分中的机械缺陷。

    Method and appartus for detection of mechanical defects in an ingot piece composed of semiconductor material
    7.
    发明授权
    Method and appartus for detection of mechanical defects in an ingot piece composed of semiconductor material 有权
    用于检测由半导体材料构成的锭块中的机械缺陷的方法和附件

    公开(公告)号：US08038895B2

    公开(公告)日：2011-10-18

    申请号：US11764854

    申请日：2007-06-19

    申请人： Ludwig Koester ,  Peter Czurratis ,  Klaus Kraemer

    发明人： Ludwig Koester ,  Peter Czurratis ,  Klaus Kraemer

    IPC分类号： B31D3/00

    CPC分类号： G01N29/28 ,  G01N29/043 ,  G01N29/0681 ,  G01N29/11 ,  G01N29/265 ,  G01N2291/044 ,  G01N2291/2697 ,  G01N2291/2698 ,  H01L21/67288

    摘要： A method for detection of mechanical defects in a semiconductor ingot section which has at least one planar surface, and a thickness at right angles to this surface of 1 cm to 100 cm, involves scanning the planar surface by at least one ultrasound head which is coupled via a liquid coupling medium to the planar surface and, at each measurement point (x,y) producing at least one ultrasound pulse which is directed at the planar surface of the ingot section, recording the ultrasound-pulse echo as a function of time, such that an echo from the planar surface, an echo from a surface opposite the planar surface, and further echoes are detected, with the positions (xp, yp, zp) of mechanical defects in the ingot section being determined from the further echoes.

    摘要翻译： 一种用于检测半导体块部分中的机械缺陷的方法，其具有至少一个平坦表面，并且与该表面成直角的厚度为1cm至100cm，包括通过至少一个超声头扫描平面， 通过液体耦合介质到平面表面，并且在每个测量点（x，y）处产生至少一个针对晶锭部分的平面表面的超声脉冲，记录超声波脉冲回波作为时间的函数， 使得来自平面表面的回波，来自与平坦表面相对的表面的回波和另外的回波被检测，其中铸锭部分中的机械缺陷的位置（xp，yp，zp）由另外的回波确定。