摘要:
The disclosure relates to communication technologies and discloses a method and a system for emergency switching. In accordance with the embodiments of the present invention, by configuring a mapped IP address in a previous level network device which can map addresses, the embodiments of the present invention enable corresponding devices in respective service processing subsystems to be backup devices to each other. When a problem occurs in a device of a service processing subsystem, as long as an IP address, which is mapped to the network device, in the previous level network device is mapped to a corresponding device of another service processing subsystem, and the corresponding device in another service processing subsystem acts as a backup device to process a service of the device in which the problem occurs, thus enabling simple and fast starting of a backup device when a problem occurs in the original device.
摘要:
The present invention discloses a method and a system for implementing location service, in which the method comprises: sending a location request message from a source user to a MMSG by a MMSC; sending the location request message to a multimedia message generating platform by the MMSG; initiating a location request to an LSP by the multimedia message generating platform according to the location request message; performing location according to the initiated location request and returning a location result to the multimedia message generating platform by the LSP; generating multimedia message information according to the location result and sending the multimedia message information to the MMSG by the multimedia message generating platform; and sending the received multimedia message information to the source user through the MMSC by the MMSG. The present invention can not only reduce the requirement of the location service on terminal capability, but also more conveniently develop the location service, thereby realizing the aim of providing convenient and efficient location service to users by using multimedia message information.
摘要:
The present invention discloses a method and a system for implementing location service, in which the method comprises: sending a location request message from a source user to a MMSG by a MMSC; sending the location request message to a multimedia message generating platform by the MMSG; initiating a location request to an LSP by the multimedia message generating platform according to the location request message; performing location according to the initiated location request and returning a location result to the multimedia message generating platform by the LSP; generating multimedia message information according to the location result and sending the multimedia message information to the MMSG by the multimedia message generating platform; and sending the received multimedia message information to the source user through the MMSC by the MMSG. The present invention can not only reduce the requirement of the location service on terminal capability, but also more conveniently develop the location service, thereby realizing the aim of providing convenient and efficient location service to users by using multimedia message information.
摘要:
Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods are disclosed herein. In one embodiment, a semiconductor die assembly can include a plurality of first semiconductor dies arranged in a stack and a second semiconductor die carrying the first semiconductor dies. The second semiconductor die can include a peripheral portion that extends laterally outward beyond at least one side of the first semiconductor dies. The semiconductor die assembly can further include a thermal transfer feature at the peripheral portion of the second semiconductor die. The first semiconductor dies can define a first thermal path, and the thermal transfer feature can define a second thermal path separate from the first semiconductor dies.
摘要:
Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods are disclosed herein. In one embodiment, a semiconductor die assembly can include a plurality of first semiconductor dies arranged in a stack and a second semiconductor die carrying the first semiconductor dies. The second semiconductor die can include a peripheral portion that extends laterally outward beyond at least one side of the first semiconductor dies. The semiconductor die assembly can further include a thermal transfer feature at the peripheral portion of the second semiconductor die. The first semiconductor dies can define a first thermal path, and the thermal transfer feature can define a second thermal path separate from the first semiconductor dies.