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公开(公告)号:US20110298122A1
公开(公告)日:2011-12-08
申请号:US13208986
申请日:2011-08-12
申请人: Paul A. Silvestri
发明人: Paul A. Silvestri
IPC分类号: H01L23/498 , H01L21/50 , H01L23/48
CPC分类号: H01L23/48 , H01L21/50 , H01L23/50 , H01L24/48 , H01L24/49 , H01L25/0657 , H01L25/18 , H01L2224/05553 , H01L2224/48091 , H01L2224/48145 , H01L2224/49113 , H01L2225/06506 , H01L2225/0651 , H01L2225/06527 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01033 , H01L2924/01076 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/30107 , H01L2924/3011 , H01L2224/45099 , H01L2924/00012
摘要: High density circuit modules are formed by stacking integrated circuit (IC) chips one above another. Unused input/output (I/O) locations on some of the chips can be used to connect other I/O locations, resulting in decreased impedance between the chips. Additional apparatus, systems, and methods are disclosed.
摘要翻译: 通过堆叠集成电路(IC)芯片,形成高密度电路模块。 某些芯片上的未使用的输入/输出(I / O)位置可用于连接其他I / O位置,导致芯片之间的阻抗降低。 公开了附加装置,系统和方法。
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公开(公告)号:US08001513B2
公开(公告)日:2011-08-16
申请号:US12197869
申请日:2008-08-25
申请人: Paul A. Silvestri
发明人: Paul A. Silvestri
IPC分类号: G06F17/50
CPC分类号: H01L23/48 , H01L21/50 , H01L23/50 , H01L24/48 , H01L24/49 , H01L25/0657 , H01L25/18 , H01L2224/05553 , H01L2224/48091 , H01L2224/48145 , H01L2224/49113 , H01L2225/06506 , H01L2225/0651 , H01L2225/06527 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01033 , H01L2924/01076 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/30107 , H01L2924/3011 , H01L2224/45099 , H01L2924/00012
摘要: High density circuit modules are formed by stacking integrated circuit (IC) chips one above another. Unused input/output (I/O) locations on some of the chips can be used to connect other I/O locations, resulting in decreased impedance between the chips. Additional apparatus, systems, and methods are disclosed.
摘要翻译: 通过堆叠集成电路(IC)芯片,形成高密度电路模块。 某些芯片上的未使用的输入/输出(I / O)位置可用于连接其他I / O位置,导致芯片之间的阻抗降低。 公开了附加装置,系统和方法。
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公开(公告)号:US07319728B2
公开(公告)日:2008-01-15
申请号:US10147146
申请日:2002-05-16
申请人: Debra M. Bell , Paul A. Silvestri
发明人: Debra M. Bell , Paul A. Silvestri
CPC分类号: G11C7/222 , G11C7/22 , H03L7/0814
摘要: A delay locked loop includes a delay line for delaying an input signal generated from an external signal. A delay controller controls the delay line to keep the external and internal signals synchronized. The delay locked loop also includes cycle control circuitry for controlling the cycle time of the signal entering the delay and the cycle time of the signal exiting the delay line.
摘要翻译: 延迟锁定环包括用于延迟从外部信号产生的输入信号的延迟线。 延迟控制器控制延迟线,以保持外部和内部信号同步。 延迟锁定环路还包括用于控制进入延迟的信号的周期时间和离开延迟线的信号的周期时间的周期控制电路。
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公开(公告)号:US06768697B2
公开(公告)日:2004-07-27
申请号:US10230546
申请日:2002-08-29
申请人: Nick N. Labrum , Paul A. Silvestri
发明人: Nick N. Labrum , Paul A. Silvestri
IPC分类号: G11C800
CPC分类号: H03K5/1565 , G11C7/22 , G11C11/4076
摘要: The illustrated embodiments relate to a control circuit that uses a latency signal to generate an output signal. The latency is used to create a control signal that is dependent on the latency signal. The control signal is used to select from among multiple input sources. The selected input source is used to create an output signal.
摘要翻译: 所示实施例涉及使用等待时间信号来产生输出信号的控制电路。 延迟用于创建取决于延迟信号的控制信号。 控制信号用于从多个输入源中进行选择。 选择的输入源用于创建输出信号。
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5.
公开(公告)号:US20130119528A1
公开(公告)日:2013-05-16
申请号:US13613540
申请日:2012-09-13
申请人: Steven K. Groothuis , Jian Li , Haojun Zhang , Paul A. Silvestri , Xiao Li , Shijian Luo , Luke G. England , Brent Keeth , Jaspreet Gandhi
发明人: Steven K. Groothuis , Jian Li , Haojun Zhang , Paul A. Silvestri , Xiao Li , Shijian Luo , Luke G. England , Brent Keeth , Jaspreet Gandhi
CPC分类号: H01L23/36 , H01L23/3675 , H01L23/3677 , H01L23/3736 , H01L23/42 , H01L25/0657 , H01L25/18 , H01L25/50 , H01L2224/16145 , H01L2224/16227 , H01L2224/17181 , H01L2224/73204 , H01L2225/06513 , H01L2225/06544 , H01L2225/06589 , H01L2924/15311
摘要: Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods are disclosed herein. In one embodiment, a semiconductor die assembly can include a plurality of first semiconductor dies arranged in a stack and a second semiconductor die carrying the first semiconductor dies. The second semiconductor die can include a peripheral portion that extends laterally outward beyond at least one side of the first semiconductor dies. The semiconductor die assembly can further include a thermal transfer feature at the peripheral portion of the second semiconductor die. The first semiconductor dies can define a first thermal path, and the thermal transfer feature can define a second thermal path separate from the first semiconductor dies.
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公开(公告)号:US08245176B2
公开(公告)日:2012-08-14
申请号:US13208986
申请日:2011-08-12
申请人: Paul A. Silvestri
发明人: Paul A. Silvestri
IPC分类号: G06F17/50
CPC分类号: H01L23/48 , H01L21/50 , H01L23/50 , H01L24/48 , H01L24/49 , H01L25/0657 , H01L25/18 , H01L2224/05553 , H01L2224/48091 , H01L2224/48145 , H01L2224/49113 , H01L2225/06506 , H01L2225/0651 , H01L2225/06527 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01033 , H01L2924/01076 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/30107 , H01L2924/3011 , H01L2224/45099 , H01L2924/00012
摘要: High density circuit modules are formed by stacking integrated circuit (IC) chips one above another. Unused input/output (I/O) locations on some of the chips can be used to connect other I/O locations, resulting in decreased impedance between the chips. Additional apparatus, systems, and methods are disclosed.
摘要翻译: 通过堆叠集成电路(IC)芯片,形成高密度电路模块。 某些芯片上的未使用的输入/输出(I / O)位置可用于连接其他I / O位置,导致芯片之间的阻抗降低。 公开了附加装置,系统和方法。
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公开(公告)号:US07142032B2
公开(公告)日:2006-11-28
申请号:US11003098
申请日:2004-12-03
申请人: Paul A. Silvestri
发明人: Paul A. Silvestri
IPC分类号: H03H11/26
CPC分类号: H03L7/0812 , H03H11/265 , H03K5/133 , H03K2005/0013 , H03K2005/00136 , H03K2005/00143
摘要: A delay locked loop includes a forward path for receiving an input signal to provide an output signal, a feedback path for providing a feedback signal based on the output signal, and a controller responsive to a timing relationship between the feedback signal and the input signal for adjusting a timing of the output signal. The feedback path includes an adjustable delay circuit for adjusting a timing of the feedback signal.
摘要翻译: 延迟锁定环包括用于接收输入信号以提供输出信号的前向路径,用于基于输出信号提供反馈信号的反馈路径,以及响应于反馈信号和输入信号之间的定时关系的控制器, 调整输出信号的定时。 反馈路径包括用于调整反馈信号定时的可调延迟电路。
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公开(公告)号:US07408822B2
公开(公告)日:2008-08-05
申请号:US11655796
申请日:2007-01-18
申请人: Paul A Silvestri
发明人: Paul A Silvestri
IPC分类号: G11C7/00
CPC分类号: G11C7/1051 , G11C7/1066 , G11C7/222
摘要: Circuits and methods are provided for aligning data read from a memory with an output clock signal when the memory is operated at very high clock frequencies. To align data and clock signals when needed, delay is added to the output clock signal during the read operation. This alignment allows various timing specifications to be met when they would otherwise be violated, therefore improving data integrity in the system.
摘要翻译: 当存储器以非常高的时钟频率操作时,电路和方法用于将从存储器读取的数据与输出时钟信号进行对准。 为了在需要时对准数据和时钟信号,在读取操作期间,延迟被添加到输出时钟信号。 这种对齐允许在否则违反时满足各种定时规范,从而提高系统中的数据完整性。
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公开(公告)号:US07184329B2
公开(公告)日:2007-02-27
申请号:US10888195
申请日:2004-07-08
申请人: Paul A Silvestri
发明人: Paul A Silvestri
IPC分类号: G11C7/00
CPC分类号: G11C7/1051 , G11C7/1066 , G11C7/222
摘要: Circuits and methods are provided for aligning data read from a memory with an output clock signal when the memory is operated at very high clock frequencies. To align data and clock signals when needed, delay is added to the output clock signal during the read operation. This alignment allows various timing specifications to be met when they would otherwise be violated, therefore improving data integrity in the system.
摘要翻译: 当存储器以非常高的时钟频率操作时,电路和方法用于将从存储器读取的数据与输出时钟信号进行对准。 为了在需要时对准数据和时钟信号,在读取操作期间,延迟被添加到输出时钟信号。 这种对齐允许在否则违反时满足各种定时规范,从而提高系统中的数据完整性。
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10.
公开(公告)号:US07148742B2
公开(公告)日:2006-12-12
申请号:US10886771
申请日:2004-07-07
申请人: Dong Pan , Feng (Dan) Lin , Paul A Silvestri
发明人: Dong Pan , Feng (Dan) Lin , Paul A Silvestri
IPC分类号: G05F1/10
CPC分类号: G11C5/147
摘要: Power detection circuitry that provides a substantially constant trip-point is provided. The circuitry is immune to temperature and process variations, thus preventing premature or delayed enablement of utilization circuitry (e.g., memory). In addition, the trip-point remains constant during both slow and fast power up and power down conditions. This may be accomplished with the use of bandgap reference circuitry that provides a stable bandgap reference voltage when operating in its stable operating region. The bandgap circuitry operates in conjunction with startup circuitry, which enables the bandgap circuitry to operate in its non-stable operating region. When in the non-stable region, the bandgap circuitry provides a source voltage as the reference voltage until the source voltage begins to approach the bandgap voltage, at which point the bandgap circuitry provides the stable bandgap reference voltage as the reference voltage.
摘要翻译: 提供了提供基本上恒定的跳变点的功率检测电路。 电路不受温度和过程变化的影响,从而防止使用电路(例如,存储器)的过早或延迟启用。 此外,在慢速和快速上电和掉电条件期间,跳变点保持恒定。 这可以通过使用带隙参考电路来实现,该带隙参考电路在其稳定工作区域中操作时提供稳定的带隙参考电压。 带隙电路与启动电路一起工作,这使得带隙电路能够在其非稳定工作区域中工作。 当在非稳定区域中,带隙电路提供源电压作为参考电压,直到源电压开始接近带隙电压,此时带隙电路提供稳定的带隙基准电压作为参考电压。
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