公开(公告)号：US20180238733A1

公开(公告)日：2018-08-23

申请号：US15550127

申请日：2015-11-19

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Masatoshi ISHIHARA ,  Hiroo YAMAMOTO ,  Yoshiaki OHSHIGE

IPC: G01J1/04 ,  H01L27/144 ,  H04N5/225

Abstract: The signal processing board includes a plurality of signal processing circuits configured to process signals output from a plurality of pixels of an infrared detecting element. The signal processing board includes an element placement area where the infrared detecting element is placed, and a circuit placement area positioned outside the element placement area to surround the element placement area when viewed from a direction orthogonal to the signal processing board. The signal processing board includes a plurality of insulating layers that are stacked on a surface side opposing the semiconductor substrate. A plurality of signal processing circuits are placed in the circuit placement area. A heat-conducting layer is placed to be positioned on at least one of the insulating layers and in the element placement area, in the signal processing board. The heat-conducting layer has a heat conductivity that is higher than a heat conductivity of the insulating layers.

公开(公告)号：US20200041336A1

公开(公告)日：2020-02-06

申请号：US16594706

申请日：2019-10-07

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Masatoshi ISHIHARA ,  Hiroo YAMAMOTO ,  Yoshiaki OHSHIGE

IPC: G01J1/04 ,  H01L27/14 ,  G01J5/06 ,  G01J1/02 ,  G01J1/42 ,  H01L27/144 ,  H04N5/225

Abstract: The signal processing board includes a plurality of signal processing circuits configured to process signals output from a plurality of pixels of an infrared detecting element. The signal processing board includes an element placement area where the infrared detecting element is placed, and a circuit placement area positioned outside the element placement area to surround the element placement area when viewed from a direction orthogonal to the signal processing board. The signal processing board includes a plurality of insulating layers that are stacked on a surface side opposing the semiconductor substrate. A plurality of signal processing circuits are placed in the circuit placement area. A heat-conducting layer is placed to be positioned on at least one of the insulating layers and in the element placement area, in the signal processing board. The heat-conducting layer has a heat conductivity that is higher than a heat conductivity of the insulating layers.

公开(公告)号：US20180266945A1

公开(公告)日：2018-09-20

申请号：US15542530

申请日：2016-01-13

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Ryusuke KITAURA ,  Masatoshi ISHIHARA ,  Masahiro YAMAZAKI ,  Hironori TAKAHASHI

IPC: G01N21/3581 ,  G01J1/02 ,  G01R29/08 ,  G01J5/20 ,  G01J5/08 ,  G01J5/04 ,  H01Q1/24 ,  H01Q1/38

CPC classification number: G01N21/3581 ,  G01J1/02 ,  G01J1/0252 ,  G01J3/42 ,  G01J5/045 ,  G01J5/08 ,  G01J5/0837 ,  G01J5/20 ,  G01J5/24 ,  G01R29/08 ,  H01Q1/24 ,  H01Q1/38 ,  H01Q19/30

Abstract: A THz bolometer detector includes a directional antenna 1 that receives a THz wave having a wavelength λ and radiates the received THz wave, a reception antenna 2 that is provided so as to face the directional antenna 1, and a bolometer 4 that detects heat generation due to a current flowing in the reception antenna 2. The directional antenna 1 overlaps the reception antenna 2 in plan view, and a longitudinal length of the directional antenna 1 is set to be less than a longitudinal length of the reception antenna 2.